Provided are a defect observation method and a defect observation device which detect a defect from an image obtained by imaging the defect on a sample with an optical microscope by using positional information of the defect on the sample detected by a different inspection device to correct the positional information of the defect and observe in detail the defect on the sample with a scanning electron microscope using the corrected positional information. The defect observation method includes detecting the defect from the image to correct the positional information of the defect, switching a spatially-distributed optical element of a detection optical system of the optical microscope according to the defect to be detected, and changing an image acquisition condition for acquiring the image and an image processing condition for detecting the defect from the image according to a type of the switched spatially-distributed optical element.

In an inspection apparatus, a plurality of light source parts (42, 43) for irradiating an object area on a surface of an object (9) with light from a plurality of directions, respectively, are provided, and a first picked-up image representing an object area is acquired in one image pickup part (32, 33) by light irradiation from one of the plurality of light source parts and a second picked-up image is acquired in the image pickup part by light irradiation from the plurality of light source parts. Further, a first defect candidate area is detected by comparing the first picked-up image with a first reference image corresponding to the first picked-up image and a second defect candidate area is detected by comparing the second picked-up image with a second reference image corresponding to the second picked-up image. Then, an overlapping area in the first defect candidate area and the second defect candidate area is specified as a defect area in the object area. It is thereby possible to detect a defect on the satin-finished surface of the object with high accuracy.

In order to provide a simplified inspection of an aircraft for the pilot, an aircraft inspection system is provided which includes at least one movable inspection unit, a position detection arrangement, and at least one data transfer interface. The at least one moveable inspection unit is moveable relative to an aircraft to be inspected. The at least one movable inspection unit includes at least one sensor for detecting a characteristic value, for verifying a characteristic and/or for determining a defect of an aircraft. The movable inspection unit is configured to generate monitoring data. When a defect or a characteristic value is detected, the position detection arrangement detects position data of the movable inspection unit in relation to the aircraft to be inspected, and assigns the position data to the monitoring data. The data transfer interface provides the position data with the assigned monitoring data as inspection data.

A method for reviewing a defect including a light capturing step that illuminates a sample with light under plural optical conditions, while varying only at least one of illumination conditions, sample conditions, or detection conditions, and detects plural lights scattering from the sample; a signal obtaining step that obtains plural signals based on the lights detected; and a processing step that discriminates a defect from noise according to a waveform characteristic quantity, an image characteristic quantity, or a value characteristic quantity created using the signals and derives the coordinates of defect.

A method for inspecting an object to assist in determining whether the object has a surface defect. The method includes moving the object in a first direction and illuminating the object under ambient lighting conditions. The method also includes capturing at least one image of the object under the ambient lighting conditions while the object moves in the first direction. In addition, the object is illuminated under object lighting conditions and at least one image of the object under the object lighting conditions is captured while the object moves in the first direction to provide at least one object image. Further, the method includes selecting at least one object image having at least one indication of a possible defect to provide images having defect candidates and comparing the defect candidates with previously defined characteristics associated with the defect to facilitate determination of whether a defect exists.

Method and machine utilizes the real-time recipe to perform weak point inspection on a series of wafers during the fabrication of integrated circuits. Each real-time recipe essentially corresponds to a practical fabrication history of a wafer to be examined and/or the examination results of at least one examined wafer of same “lot”. Therefore, different wafers can be examined by using different recipes where each recipe corresponds to a specific condition of a wafer to be examined, even these wafers are received by a machine for examining at the same time.

Methods and systems for integrated multi-pass reticle inspection are provided. One method for inspecting a reticle includes acquiring at least first, second, and third images for the reticle. The first image is a substantially high resolution image of light transmitted by the reticle. The second image is a substantially high resolution image of light reflected from the reticle. The third image is an image of light transmitted by the reticle that is acquired with a substantially low numerical aperture. The method also includes detecting defects on the reticle using at least the first, second, and third images for the reticle in combination.

A belt examination system includes a defect candidate detecting processor that detects a candidate for a belt defect that is an abnormal portion of an intermediate transfer belt of an image forming apparatus from a belt image that is an image of the intermediate transfer belt, the defect candidate detecting processor executes a background pattern reduction step to reduce a texture-pattern like background noise present in the belt image and detects the candidate based on the belt image generated during the background pattern reduction step, and the background pattern reduction step is to replace, in the belt image, a color value within a specific range of color values not including a lowest color value of the belt defect with a specific color value within the specific range.

The embodiments herein relate to defect inspection methods of semiconductor wafers during the manufacturing process. According to an aspect of the present disclosure, a defect inspection system is provided. The defect inspection system includes a first inspection system, pattern simulator software, and a second inspection system. The first inspection system is capable of determining a plurality of defect locations on an article. The pattern simulator software is capable of generating a set of simulated pattern features from the plurality of defect locations. The second inspection system is capable of providing a higher graphical resolution of defects than the first inspection at the defect locations corresponding to the set of simulated pattern features.

The present disclosure provides an electronic system with defect identification function and a method of qualifying a photoresist pattern formed using a lithography process. The electronic system includes an inspection apparatus and a processor associated with the inspection apparatus. The inspection apparatus is used for acquiring at least one image of the specimen on which a photoresist pattern is formed using a lithography process. The processor is configured to automatically apply machine learning processes implemented through one or more neural networks to identify at least one defect present in the photoresist pattern.