An approach for collecting disparate data within a pipe involves a sensor arrangement configured to be deployed within the pipe. The sensor arrangement includes a plurality of sensors configured to detect disparate data related to the pipe. Each sensor of the plurality of sensors is coupled to a respective collection computer on the sensor arrangement. A synchronization module is configured to synchronize the disparate data. A database is configured to store the synchronized data. A processor is configured to process the synchronized data. A user interface configured to present the synchronized data to a user.

Illumination systems and methods of designing and construction of the same are disclosed. The resulting illumination systems comprising both Front and Back light modules, provides selectable and programmable illumination according to the requirements of the invention for optimal performance of enhancing defects on a multidimensional object. The light guides are suitably aligned to the Backlight module and mechanically integrated with spring loaded mechanisms to enable them to move freely and subsequently re-postion them to a reference home position as determined at the time of setup of the illumination assembly. The Front light module is utilised to highlight surface defects and mechanically integrated to the illumination system. The illumination modules, may include multiple discrete light emitting components of different spatial intensity distribution and color spectrum mounted in specific layout such that the application oriented combined illuminating effect is created.

Provided are method, apparatus, electronic device and storage medium for determining defect shape of wafer, wherein the method includes: for a target wafer image of each specification, comparing the target wafer image with the standard wafer image of this specification, and acquiring a coordinate position where each of defect points is located in the target wafer image; according to each coordinate position, projecting each of the defect points into the image to be classified of the target specification on the basis of the preset scaling ratio; determining target points where distance between any two adjacent points in the image to be classified is less than the preset distance; and determining the shape of the region formed by the target points, so as to determine the shape as the defect shape of the target wafer.

An inspection apparatus inspecting a wafer on which a plurality of patterns are formed by a plurality of exposure shots, the inspection apparatus comprising: acquisition unit configured to acquire first information representing a positional relation between an inspection mark included in a pattern formed by a first exposure shot and an inspection mark included in a pattern formed by a second exposure shot, and second information representing a positional relation between the inspection mark included in the pattern formed by the second exposure shot and an inspection mark included in a pattern formed by a third exposure shot; and derivation unit configured to derive a linear component of an error caused by a reticle, and a linear component of an error caused by a position of a wafer, on the basis of the first information and the second information.

A method and device for automatically identifying a point of interest (e.g., the deepest or highest point) on a viewed object using a video inspection device. The method involves placing a first cursor on an image of the object to establish a first slice plane and first surface contour line, as well as placing another cursor, offset from the first cursor, used to establish an offset (second) slice plane and an offset (second) surface contour line. Profile slice planes and profile surface contour lines are then determined between corresponding points on the first surface contour line and the offset (second) surface contour line to automatically identify the point of interest.

A method and device recognize and analyze surface defects in three-dimensional objects having a reflective surface, in particular motor vehicle bodies. In which method the surface defects are identified by the evaluation of an image, recorded by a camera in the form of a raster image of pixels, of an illumination pattern projected by a first illumination device onto a part of the reflective surface using a two-dimensional raster coordinate system. The surface defects are identified exclusively using two-dimensional image information with the aid of image processing algorithms without the need for “environmental parameters”, and complex geometric calculations can be omitted. The solution is fast and robust and can be carried out using differently configured first illumination devices, which makes it suitable for mobile applications, for example as a hand-held module. It is also made possible for the method to be optimized by a “deep learning” strategy.

A method for optically inspecting containers in a drinks processing system, wherein the containers are transported as a container mass flow using a transporter and captured as camera images by an inspection unit arranged in the drinks processing system, and wherein the camera images are inspected for faults by a first evaluation unit using a conventional image processing method, wherein the camera images with faulty containers are classified as fault images and the faults are correspondingly assigned to the fault images as fault markings, wherein the camera images with containers considered to be good quality are classified as fault-free images, the fault images, the fault markings and the fault-free images are compiled as a specific training data set, and wherein, using the specific training data set, a second evaluation unit is trained in situ with an image processing method working on the basis of artificial intelligence.

A system for inspecting and validating processes performed on a continuous web of fabric in an automated apparel manufacturing environment. The continuous web of fabric can move in a step wise fashion across a work area where tooling can perform one or more processes on the continuous web of fabric. At least one projector is provided to display an image onto the continuous web of fabric the image including a first image related to an article to be manufactured and a second image related to a reference grid. The continuous web of fabric and the first and second images are viewed by a camera, and data related to the viewed first and second images and the continuous web of fabric can be sent to a computer implemented control center which can analyze the data to determine whether a deviation or error exists regarding the manufacturing process.

A defect inspection device is provided with an illumination optical system that irradiates light or an electron beam onto a sample, a detector that detects a signal obtained from the sample through the irradiation of the light or electron beam, a defect detection unit that detects a defect candidate on the sample through the comparison of a signal output by the detector and a prescribed threshold, and a display unit that displays a setting screen for setting the threshold. The setting screen is a two-dimensional distribution map that represents the distribution of the defect candidates in a three dimensional feature space having three features as the axes thereof and includes the axes of the three features and the threshold, which is represented in one dimension.

Techniques are disclosed for systems and methods to provide reliable analyte spatial detection systems. An analyte spatial detection system includes an imaging module, a visible light projector, associated processing and control electronics, and, optionally, orientation and/or position sensors integrated with the imaging module and/or the visible light projector. The imaging module includes sensor elements configured to detect electromagnetic radiation in one or more selected spectrums, such as infrared, visible light, and/or other spectrums. The visible light projector includes one or more types of projectors configured project visible light within a spatial volume monitored by the imaging module. The system may be partially or completely portable and/or fixed in place. The visible light projector is used to indicate presence of a detected analyte on a surface near or adjoining the spatial position of the detected analyte.