An automatic 3D image acquisition system for optical inspection of objects (B) includes one or more light sources (including a laser source) configured to emit a light toward a field of view wherein an object (B) to be inspected is placed, and at least one digital sensor that acquires at least part of the light reflected by the object (B) to be inspected.

The the-digital sensor includes and intensity sensor and is operatively connected to a data processing unit configured to determine physical and/or geometric features of the object (B) to be inspected on the basis of the light acquired by the digital sensor.

The automatic optical inspection system includes an image intensifier apparatus and optical elements which define a path of the laser light pulse from the laser source to the field of view and from the field of view to the image intensifier apparatus.

A device for detecting a defect on a surface including an optical device (14) suitable for acquiring an image of the surface in a given optical direction, a lighting device (15) comprising a plurality of light sources (16), the light sources (16) being arranged in a hemisphere (20), each light source (16) having an off and an on state, an electronic calculation device (18). The electronic calculation device (18) is able to control the optical device (14) and the lighting device (15) so that the optical device (14) acquires a plurality of images of the surface, different light sources (16) or different combinations of light sources (16) being switched on for each image, the hemisphere (20) having a diameter D smaller than or equal to 50 mm.

In an inspection apparatus, a plurality of light source parts (42, 43) for irradiating an object area on a surface of an object (9) with light from a plurality of directions, respectively, are provided, and a first picked-up image representing an object area is acquired in one image pickup part (32, 33) by light irradiation from one of the plurality of light source parts and a second picked-up image is acquired in the image pickup part by light irradiation from the plurality of light source parts. Further, a first defect candidate area is detected by comparing the first picked-up image with a first reference image corresponding to the first picked-up image and a second defect candidate area is detected by comparing the second picked-up image with a second reference image corresponding to the second picked-up image. Then, an overlapping area in the first defect candidate area and the second defect candidate area is specified as a defect area in the object area. It is thereby possible to detect a defect on the satin-finished surface of the object with high accuracy.

A system and method for defect detection in a hole array on a substrate is disclosed herein. In one embodiment, a method for defect detection in a hole array on a substrate, includes: scanning a substrate surface using at least one optical detector, generating at least one image of the substrate surface; and analyzing the at least one image to detect defects in the hole array on the substrate surface based on a set of predetermined criteria.

An inspection system for and method of inspecting deposits printed on workpieces through a printing screen, the system comprising: a camera unit movable relative to a printing screen, where comprising a body including a plurality of apertures, and a workpiece on which deposits are printed through the apertures of the printing screen; and a control unit operable to control the camera unit such as to capture images of at least one pair of corresponding regions of the printing screen and the workpiece, and process the images to determine, for each of a plurality of points defining the image of the printing screen, whether the point is of aperture, and, only where the point is of aperture, determine whether the corresponding point of the corresponding image of the workpiece, as defined by a corresponding plurality of points, is of deposit, thereby enabling a determination of a print characteristic of deposits printed on the workpiece from a relationship of the points determined to be of deposit to the points determined to be of aperture.

A thickness estimation method may include: obtaining a test spectrum image; obtaining test spectrum data; measuring a thickness of a test layer formed on the test substrate at the plurality of positions; generating a regression analysis model using a correlation between the thickness of the test layer and the test spectrum data; obtaining a spectrum image; and estimating a thickness of a target layer over the entire area of the semiconductor substrate by applying the spectrum image to the regression analysis model. The thickness corresponding to the entire area of the semiconductor substrate that is being transferred is estimated using the thickness estimation method according to an exemplary embodiment in the present disclosure, such that whether or not processing is normally performed may be examined without requiring a separate time. In addition, an examination result may be feedbacked to processing equipment to improve production yield.

A package comprising an electronic chip, a laminate type encapsulant in and/or on which the electronic chip is mounted, a solderable electric contact on a solder surface of the package, and a solder flow path on and/or in the package which is configured so that, upon soldering the electric contact with a mounting base, part of solder material flows along the solder flow path towards a surface of the package at which the solder material is optically inspectable after completion of the solder connection between the mounting base and the electric contact.

A printed circuit board inspection apparatus can inspect a mounting state of a component by generating depth information on the component by using a pattern of light reflected from the component mounted on a printed circuit board received by an image sensor, generating two-dimensional image data for the component by using at least one of light of a first wavelength, light of a second wavelength, light of a third wavelength, and light of a fourth wavelength reflected from the component received by a first image sensor, inputting the depth information and the two-dimensional image data for the component into a machine learning-based model, obtaining depth information with reduced noise from the machine learning-based model, and using the noise-reduced information.

An processing apparatus includes a first illumination portion and a first imaging portion. The first illumination portion irradiates ta second inner surface on an opposite side of a second outer surface and a third inner surface on an opposite side of a third outer surface via a first outer surface of the electronic component with irradiation light in a state where the electronic component is disposed on a first inspection position. The first imaging portion captures an image of a first internal corner portion formed by the second inner surface and the third inner surface, based on the first irradiation light emitted from the first outer surface after being specularly reflected on the second inner surface and the third inner surface.

In order to reduce inspection tact time in centralized management of a plurality of inspection lines, the system includes: a plurality of inspection lines 4 each having a visual appearance inspection device 3; a first database 5A for storing a captured image captured by each of the visual appearance inspection device 3; and a centralized control device 6 connected to each of the visual appearance inspection devices 3 and the first database 5A, having a display unit 32 that displays an inspection image of an inspection object 7, and enabling visual inspection of the inspection object 7 conveyed on each of the inspection lines 4 in a centralized manner; wherein, while one of the inspection lines 4 is inspected by using the centralized control device 6, the visual appearance inspection devices 3 of the other inspection lines 4 pre-captures the inspection object 7 conveyed on the inspection line 4 under predetermined capturing conditions and stores the pre-captured image in the first database 5A, and wherein the pre-captured image read from the first database 5A is displayed on the display unit 32 in the visual inspection.