A system, apparatus and method for detecting a porous object are provided. The system includes a light emitting module, a detecting module and an analyzing module. The light emitting module emits light onto an object to be measured such that the light passes through a plurality of holes of the object. The detecting module has a porous plate having a plurality of non-circular holes and a plurality of photosensitive units respectively corresponding to the non-circular holes. Each of the non-circular holes corresponds to at most one of the holes at one time point. The light passes through the plurality of non-circular holes corresponding to the plurality of holes. The photosensitive units respectively sense luminous flux of the light passing through the plurality of non-circular holes to produce a luminous flux signal. The analyzing module analyzes a status of the plurality of holes corresponding to the plurality of non-circular holes.

A system (10) for detecting a level of dirtiness of a filter mat (20) of an airflow cooling system for telecommunications equipment, the system (10) comprising a detector (12) for detecting fluorescent or reflected light backscattered at at least one part in (22) of the filter mat (20) comprising or treated with a fluorescent or reflective material, wherein the detector (12) comprises a light source (12a) for illuminating said at least one part (22) of the filter mat (20) with sampling light, and a photosensor (12b) for detecting fluorescent or reflected light backscattered at said at least one part (22) of the filter mat (20) caused by the illumination thereof with sampling light, wherein the system (10) is configured for inferring the level of dirtiness of the filter mat (20) from the amount of detected fluorescent or reflected light.

A substrate inspection system includes a substrate support, optics configured to irradiate a patterned structure on the substrate and capture images of the patterned structure from light reflected from the patterned structure, a focus adjustment operative to adjust a focal position of the incident light on the patterned structure, and an image processor configured to calculate an optimal value of a focus offset used to establish focal points of the light for defect detection in the patterned structure. The patterned structure may include a first pattern having an opening and a second pattern having top surfaces located at different heights relative to the substrate. The value of the focus offset is determined using images of the top surfaces of the second pattern obtained while changing the focal position of the incident light.

An inspection apparatus and method to automatically inspect ceramic honeycomb bodies during the manufacturing thereof. The apparatus includes a light source to shine light through channels of the ceramic honeycomb body, a lens to receive at least a portion of the light transmitted through channels of the ceramic honeycomb body, a camera to capture images of the transmitted light, a support chuck to support the honeycomb body, and a controller to receive the captured images, to analyze each captured image, to adjust the support chuck and/or the lens based on the analysis, and to align the ceramic honeycomb body channels and the lens optical axis.

A system includes a processor configured to receive a design model for a blade that has multiple diffuser holes. The processor is also configured to generate multiple points along an edge of each of the multiple diffuser holes. Further, the processor is configured to generate multiple vectors and each of the multiple points includes a corresponding vector. Moreover, each of the multiple vectors originates at the corresponding vector's corresponding point. Further, the processor is configured to apply the multiple vectors to inspect one or more manufactured diffuser holes.

A system includes a processor configured to receive a design model for a blade that has multiple diffuser holes. The processor is also configured to generate multiple points along an edge of each of the multiple diffuser holes. Further, the processor is configured to generate multiple vectors and each of the multiple points includes a corresponding vector. Moreover, each of the multiple vectors originates at the corresponding vector's corresponding point. Further, the processor is configured to apply the multiple vectors to inspect one or more manufactured diffuser holes.

In order to provide an inspection device capable of quantitatively evaluating a pattern related to a state of a manufacturing process or performance of an element, it is assumed that an inspection device includes an image analyzing unit that analyzes a top-down image of a sample in which columnar patterns are formed at a regular interval, in which an image analyzing unit 240 includes a calculation unit 243 that obtains a major axis, a minor axis, an eccentricity, and an angle formed by a major axis direction with an image horizontal axis direction of the approximated ellipse as a first index and a Cr calculation unit 248 that obtains a circumferential length of an outline of a columnar pattern on the sample and a value obtained by dividing a square of the circumferential length by a value obtained by multiplying an area surrounded by the outline and 4 as a second index.

The present application provides a method for characterizing defects in silicon crystal comprising the following steps: etching a surface of the silicon crystal to remove a predicted thickness of the silicon crystal; conducting a LLS scanning to a surface of the etched silicon crystal to obtain a LLS map of the surface, a LSE size of defects, and defect bulk density; based on at least one of the LLS map of the surface, the LSE size of defects and the defect bulk density, determining a type of defect existing in the silicon crystal and/or a defect zone of each type of defect on the surface. By applying the method, the characterizing period and the characterizing cost can be reduced, plural defects such as vacancy, oxygen precipitate and dislocation can be characterized simultaneously, the characterizing accuracy can be enhanced, and the defect type and the defect zone can be determined with high reliability. In addition, the method can be applied to all crystal defect types, is easy to operate, and is an environmentally friendly method for determination of grown-in defects.

A method for inspecting an end face, comprising: an arrangement step of arranging a honeycomb structure having a partition wall extending from a first end face to a second end face, at a predetermined position using the second end face as a placement face; a first image data for processing acquisition step of acquiring first image data for processing while irradiating the first end face with light having an angle of 40 or more, the angle being an angle formed between the light and an axis being perpendicular to the placement face of the honeycomb structure; a second image data for processing acquisition step of acquiring second image data for processing while irradiating the first end face with light having an angle of less than 40; and a crack detection step of detecting a crack by comparing the first image data for processing with the second image data for processing.

An inspection system and method are presented for inspecting structures having a pattern formed by an array of elongated grooves having high aspect-ratio geometry, such as semiconductor wafers formed with vias. The inspection system comprises an imaging system and a control unit. The imaging system is configured and operable for imaging the structure with a dark-field imaging scheme and generating a dark-field image. The control unit comprises an analyzer module for analyzing pixels brightness in the dark-field image for identifying a defective groove, being a groove characterized by pixels brightness in the dark-field image lower than nominal brightness by a predetermined factor.