A single-layer redistribution plate functioning as a space translator between a device under testing (“DUT”) and a testing PCB may comprise a hard ceramic plate. A DUT side of the plate may have pads configured to interface with a device under testing. Both sides of the plate may comprise traces, vias, and pads to fan out the DUT pad pattern so that the plate side opposite the DUT side has spatially translated pads configured to interface with the pads on a testing PCB. Fabricating a redistribution plate may comprise calibrating and aligning, laser milling vias, laser milling trenches and pads, copper plating, grinding and polishing, removing residual copper, and coating the copper surfaces.

The present invention relates to a test socket configured to electrically connect a tester generating a test signal and a device under inspection to each other includes a nonelastic electrically-conductive housing having a plurality of housing holes passing therethrough in a thickness direction, an insulating coating layer applied on at least an upper surface of the nonelastic electrically-conductive housing and a circumference of each of the plurality of housing hole, and an electrically-conductive part formed to have a configuration in which a plurality of electrically-conductive particles are contained in an elastic insulating material, disposed in the housing hole such that a lower end portion thereof may be connected to a signal electrode of the tester placed below the nonelastic electrically-conductive housing.

A socket includes: a contact probe; and an insulating support body supporting the contact probe. The contact probe includes: a first plunger to be connected with an object to be inspected; a second plunger to be connected with an inspecting board; and a spring configured to urge the first plunger and the second plunger in a direction apart from each other. In a state where a tip end of the first plunger is released, a projecting amount of the second plunger from the insulating support body is zero with a natural length of the spring.

Provided is a circuit structural body is formed into a shape including: A circuit structural body, including: a multilayer board, which includes a plurality of layers of a first to N-th tri-plate structural bodies each including a first to N-th (N is an integer of 2 or more) planar conductors; an interlayers connection conductor, which is configured to connect the first to N-th planar conductors to each other; and a side-surface ground conductor, which is formed on a side surface of the multilayer board, and is approximately parallel to and near the interlayers connection conductor.

A socket includes: a contact probe; and an insulating support body supporting the contact probe. The contact probe includes: a first plunger to be connected with an object to be inspected; a second plunger to be connected with an inspecting board; and a spring configured to urge the first plunger and the second plunger in a direction apart from each other. In a state where a tip end of the first plunger is released, a projecting amount of the second plunger from the insulating support body is zero with a natural length of the spring.

A socket testing method comprises obtaining a raw socket image, performing binarization on the raw socket image to generate a binarized socket image, determining a plurality of pinhead locations in the binarized socket image, applying a grid with the grid including a plurality of intersections to the binarized socket image, for each of the plurality of pinhead locations, obtaining the distance between the pinhead location and one of the plurality of intersections which is nearest to the pinhead location, and outputting a warning signal associated with the pinhead location when determining that the distance is larger than a tolerance value.

Disclosed are a testing unit, system, and method for testing and predicting failure of optical receivers. The testing unit and system are configured to apply different values of current, voltage, heat stress, and illumination load on the optical receivers during testing. The test methods are designed to check dark current, photo current, forward voltage, and drift over time of these parameters.

A socket testing method comprises obtaining a raw socket image, performing binarization on the raw socket image to generate a binarized socket image, determining a plurality of pinhead locations in the binarized socket image, applying a grid with the grid including a plurality of intersections to the binarized socket image, for each of the plurality of pinhead locations, obtaining the distance between the pinhead location and one of the plurality of intersections which is nearest to the pinhead location, and outputting a warning signal associated with the pinhead location when determining that the distance is larger than a tolerance value.

The present invention relates to a semiconductor test socket of a hybrid coaxial structure and a manufacturing method thereof. The test socket includes a test socket locating plate, an insulation test socket body, a built-in conductive socket body, a built-in conductive socket cover, and an insulation test socket cover. The test socket locating plate, the insulation test socket body, and the insulation test socket cover are sequentially disposed from top to bottom. An opening is provided on the insulation test socket body. The built-in conductive socket body and the built-in conductive socket cover are disposed in the opening. In the present invention, relatively good inter-channel isolation is achieved by using the coaxial structure made of conductive metal, thereby greatly reducing manufacturing costs and a production period of the test socket.

A compact tester including a housing having a base plate and a roof plate being parallel and defining a space therebetween. The compact tester includes one or more device-under-test press units having an actuator and a contact head movable by the actuator. The compact tester includes a reinforcement arrangement having a roof reinforcement sub-arrangement coupled to the roof plate and an upright reinforcement sub-arrangement coupled to the base plate. The upright reinforcement sub-arrangement includes a pair of reinforcing side walls extending upright from the base plate. The roof reinforcement sub-arrangement includes a reinforcing structure having a reinforcing panel portion attached flat against the roof plate and an elongated reinforcing rib portion protruding from the reinforcing panel portion and away from the roof plate. The roof reinforcement sub-arrangement is supported by the upright reinforcement sub-arrangement with the elongated reinforcing rib portion extending between the pair of reinforcing side walls.