The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.

A probe card for a testing apparatus of electronic devices comprises a testing head, which houses a plurality of contact elements extending along a longitudinal axis (H-H) between a first end portion and a second end portion, a support plate, onto which the first end portion is adapted to abut, and a flexible membrane which comprises a first face and a second and opposite face. Conveniently, the first portion of the flexible membrane is arranged on at least one support and comprises a plurality of strips extending between a proximal end and a distal end, the probe card further including a plurality of micro contact probes comprising a body extending along the longitudinal axis (H-H) between a first end portion and a second end portion, the second end portion of each contact element abutting onto the first face of the flexible membrane at the distal end of a respective strip, and the first end portion of each micro contact probe abutting onto the second face of the flexible membrane at a respective contact element, the flexible membrane being electrically connected to the support plate through a second portion thereof, the second end portion of the micro contact probes being apt to contact the contact pads of a device to be tested, wherein the at least one support is provided with a plurality of guide holes for the housing of the plurality of micro contact probes.

A testing apparatus includes a chip carrying device and a pressing device. The chip carrying device includes a circuit board and a plurality of electrically connecting units disposed on the circuit board. Each electrically connecting unit includes a main body disposed on the circuit board to form an accommodating slot, a lift structure partially arranged in the accommodating slot. A portion of the lift structure having a chip receiving slot passes through an opening of the main body. The pressing device includes a temperature conditioner being controllable to increase or decrease temperature. When the lift structure is pressed by a flat structure of the temperature conditioner, the probe assemblies are connected to one side of a chip received in the chip receiving slot, and the flat contacting surface is abutted against another side of the chip for transmitting heat energy there-between.

The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.

A metal probe structure and a method for fabricating the same are provided. The metal probe structure includes a multi-layer substrate, a first flexible dielectric layer, a second flexible dielectric layer, and a plurality of first metal components. The first flexible dielectric layer is disposed over the multi-layer substrate and has a conductive layer formed thereover. The second flexible dielectric layer is disposed over the first flexible dielectric layer to cover the conductive layer. The plurality of first metal components is disposed over the conductive layer and partially in the second flexible dielectric layer to serve as a metal probe.

A system for testing an integrated-circuit wafer, the system including a probe card having a probe needle and a probe body enclosing a pressure chamber. The probe body includes a unitary sidewall, a first end cap substantially closing a first end of the probe body, except for an outlet passage in the first end cap, and an inlet passage configured to introduce compressed gas into the pressure chamber. The probe needle is within the pressure chamber and is supported by the probe body. A free end of the probe needle extends through the outlet passage. The ends of the probe needle are separated by a first bend in the probe needle, which has a center of curvature that is located between the probe needle and a longitudinal centerline of the unitary sidewall. Methods of using a probe card are also disclosed.

A three-dimensional (3D) signal transfer structure of a probe card device includes a transfer plate, a supporting frame, and a guiding plate. The transfer plate has a first surface and a second surface that is opposite to the first surface. The transfer plate includes a plurality of signal circuits each having a signal contact arranged on the first surface. The supporting frame is abutted against and fixed onto the first surface of the transfer plate. A portion of the first surface abutted against the supporting frame is arranged outside the signal contacts. The guiding plate has a plurality of thru-holes and is disposed on the supporting frame. The guiding plate, the supporting frame, and the transfer plate jointly and surroundingly define a receiving space, and the signal contacts of the transfer plate are arranged in the receiving space.

A rectangular probe includes two broad side surfaces and two narrow side surfaces each parallel to a longitudinal direction of the rectangular probe. The rectangular probe includes a middle segment, a first connecting segment and a second connecting segment respectively extending from two opposite ends of the middle segment, a first contacting segment and a second contacting segment respectively extending from the first and second connecting segments, and a stroke structure arranged on the middle segment, the first contacting segment, or the second contacting segment. A longitudinal thru-hole of the stroke structure is formed by penetrating through the two broad side surfaces. Two transverse grooves of the stroke structure are respectively recessed in the two broad side surfaces. The two transverse grooves are configured to move in two directions away from each other so as to reduce a length of the rectangular probe.

Provided is an electrical contactor that is formed from a small number of components that can improve the conductivity in the electrical contactor, while improving the slidability of an elastic member and the electrical contact stability with a contact target. The present disclosure provides an electrical contactor which is formed from a plate-shaped member, the plate-shaped member including: a main body; an upper arm portion; a first tip end portion provided at a tip end of the upper arm portion; a lower arm portion; and a second tip end portion provided at a tip end of the lower arm portion, the electrical contactor including: a first contact portion formed by winding the first tip end portion; a first elastic portion formed by winding the upper arm portion and having a bamboo-shoot-like spring structure; a second contact portion formed by winding the second tip end portion; a second elastic portion formed by winding the lower arm portion and having a bamboo-shoot-like spring structure; and a coupling portion that couples the first elastic portion and the second elastic portion to enable elasticity of each of the first elastic portion and the second elastic portion by winding the main body, in which each or either of a tip end surface of the first contact portion that contacts the first contact target and a tip end surface of the second contact portion that contacts the second contact target is an inclined surface.

An electrical contact and connector (also known as elastic electrical contact and system) are disclosed herein for testing semiconductor devices such as integrated circuit (IC) packages, particular high density IC packages. The elastic electrical contact comprises a plurality of interlaced or interwove and unsupported conductive wires. The electrical contact system comprises the elastic electrical contacts and a carrier having a plurality of through openings. The elastic electrical contacts are placed in their respective through openings with both ends exposed from the through openings. Method of making and using the elastic electrical contact are also provided.