G01R1/06733

Low-force wafer test probes

Embodiments herein describe structures of low-force wafer test probes and formation thereof. Structures of low-force wafer test probes and their formation via gray scale etch or electroplating is described. Structures are described that include a lower base structure on top of a substrate and an upper blade structure on top of the lower base structure. In various embodiments, a crown of a C4 bump is accommodated by one or both of: i) a cavity present in the lower base structure; and ii) a height of the upper blade structure. Processes for fabricating probe structures are described that include forming lower base structures upon a substrate and forming upper blade structures on top of the lower base structures. The upper blade structures include at least one blade. Each of the blade(s) include a cutting edge that points toward a center point within the probe structure.

Conduction inspection device member and conduction inspection device

Provided is a conduction inspection device member, wherein cracks and voids are less likely to form in conductive parts, conduction performance is less likely to be impaired even when a conduction test is repeated, and contact marks are less likely to remain in the portion of the member in contact with a member to be tested. Also provided is a conduction inspection device comprising the conduction inspection device member. The conduction inspection device member comprises a substrate 13, through holes 11, and conductive parts 12. The multiple through holes 11 are arranged in the substrate 13, the conductive parts 12 are housed inside the through holes 11, and the conductive parts 12 contain conductive particles 2. The conductive particles 2 each comprise a substrate particle 21 and a conductive layer 22 on the surface of the substrate particle 21. The conductive layer 22 has multiple protrusions 23 on the outer surface thereof.

Method for Measuring An Electric Property of a Test Sample

The method may be used for measuring an electric property of a magnetic tunnel junction used in an embedded MRAM memory for example. The method uses a multi point probe with a plurality of probe tips for contacting a designated area of the test sample, which is electrically insulated from the part of the test sample which is to be tested. Electrically connections are placed underneath the magnetic tunnel junction and goes to the designated area.

CLAD WIRE AND METHOD FOR PRODUCING CLAD WIRES
20210241935 · 2021-08-05 ·

The invention relates to a clad wire (1) for producing test needles or sliding contacts having a wire core (2) made of rhodium or a rhodium-based alloy, an inner cladding (3) made of copper or silver or aluminum or a copper-based alloy or a silver-based alloy or an aluminum-based alloy, wherein the inner cladding (3) covers or completely encloses the wire core (2) on at least two opposite sides, an adhesion-promoting layer (5) made of gold or a gold-based alloy, which is arranged between the wire core (2) and the inner cladding (3), and an outer cladding (4) made of a metal or a metal alloy having a greater hardness than the material of the inner cladding (3), wherein the outer cladding (4) encloses the inner cladding (3). The invention also relates to a method for producing a clad wire and to a test needle having at least one clad wire (1) or produced from a clad wire (1) and a test needle array having a plurality of test needles spaced apart from one another and a sliding contact having a plurality of clad wires (1) or produced from a clad wire (1).

Resistive test-probe tips
11079408 · 2021-08-03 · ·

A test-probe tip having a tip component, a resistive element, and a compliance member. The tip component is configured to electrically connect to a device under test at a first end of the tip component. The resistive element is electrically connected to a second end of the tip component along a signal-flow axis. The resistive element is configured to provide electrical impedance to an electrical signal passing through the resistive element. The compliance member is configured to allow movement of the tip component in a first direction when a mechanical force applied to the tip component in the first direction and to cause movement of the tip component in an opposite, second direction when the mechanical force applied to the tip component is removed or reduced. Architectures for the resistive element are also described.

Connector having contact members
11067603 · 2021-07-20 · ·

An electrical connector comprises a bottom assembly extending in a first direction, a first contact assembly, a first substrate assembly, a second contact assembly, a second substrate assembly, a third contact assembly, a top assembly and a plurality of conductive vias. The bottom assembly, the first contact assembly, the first substrate assembly, the second contact assembly, the second substrate assembly, the third contact assembly, and the top assembly are arranged in a second direction. The plurality of conductive vias extends in the second direction to penetrate the bottom assembly, the first substrate assembly, the second substrate assembly, and the top assembly. Each of the contact member of the first contact assembly, the second contact assembly, and the third contact assembly are of a letter V shape.

PROBE CARD DEVICE AND NECK-LIKE PROBE THEREOF
20210223289 · 2021-07-22 ·

A probe card device and a neck-like probe thereof are provided. The neck-like probe includes a conductive pin and a ring-shaped insulator. The conductive pin includes a stroke segment and two end segments extending from the stroke segment. The stroke segment has two broad side surfaces and two narrow side surfaces, and each of the broad side surfaces has a long slot extending from one of the narrow side surfaces to the other one. The two long slots have a minimum distance therebetween that is 75%-95% of a maximum distance between the two broad side surfaces. The ring-shaped insulator surrounds a portion of the conductive pin having the two long slots, and a portion of the neck-like probe corresponding in position to a part of the ring-shaped insulator on the two broad side surfaces has a thickness that is 85%-115% of the maximum distance.

PROBE FITTING STRUCTURE AND PROBE
20210278480 · 2021-09-09 · ·

A probe fitting structure includes a connector to be inspected and a probe capable of being fitted to the connector. The connector includes a plurality of connection electrodes. The probe includes a flange having a through hole and used for attaching the probe to a device, a coaxial cable extending through the through hole and including a leading end portion to which a probe pin is attached, a plunger including a leading end through which the probe pin is exposed, and a spring housing the coaxial cable between the flange and the plunger and including a first end portion fixed to the flange and a second end portion fixed to the plunger. The plunger includes a plunger-side fitting portion in a leading end portion of the plunger. The connector includes a connector-side fitting portion (opening portion) capable of being fitted to the plunger-side fitting portion.

PROBE

A probe for characteristic inspection of a connector includes a plunger, a coaxial cable, a flange, and a housing having an end portion on one side including an increased diameter portion. A recessed portion which receives the increased diameter portion is in an upper surface of the flange. The increased diameter portion has side walls in contact with or facing respective inner side surfaces of the flange partly, with the inner side surfaces forming the recessed portion, and a bottom wall in contact with an upper recessed surface of the flange that forms the recessed portion. The increased diameter portion has connection surfaces connecting the bottom and side walls and inclined inward from one of the side walls toward the bottom wall. Alternatively, the inner side surfaces each have a first surface inclined downward, and a vertical surface extending downward from the first surface to the upper recessed surface.

HIGH-FREQUENCY TEST CONNECTOR DEVICE, HIGH FREQUENCY TESTING SYSTEM AND USE OF SAME

The invention relates to a high-frequency test connector device (12; 12′) having an adapter housing including a sleeve-like ground contact section (10; 10′) axially at one end, (18) at the other end, and centrally an insulated inner contact (20), wherein the ground contact section has an electrically conducting spring member (26; 26′, 28; 42, 44; 44′, 46) for ground contact, associated such that for engaging over the sleeve section (14) of the contacting partner (16), the latter with an end face (30), to form a contact and resiliently along the movement or connecting longitudinal axis, can engage on the spring member (26) formed in a sleeve base of the ground contact section (10), or wherein, for engaging in the sleeve section (14′) of the connecting partner (16′), the spring member (26′) projects from an end face end section of the ground contact section (10′), to form a contact and resiliently along the longitudinal axis, can engage on a ground-conducting inner section (40) of the connecting partner.