Systems, devices, and methods for characterizing semiconductor devices and thin film materials. The device consists of multiple probe tips that are integrated on a single substrate. The layout of the probe tips could be designed to match specific patterns on a CMOS chip or sample. The device provides for detailed studies of transport mechanisms in thin film materials and semiconductor devices.

Vertical transmission line probes having alternating capacitive and inductive sections are provided. These alternating sections can be designed to provide a desired transmission line impedance (e.g., between 10 and 100 Ohms, preferably 50 Ohms). Probe flexure in operation is mainly in the inductive sections, advantageously reducing flexure stresses on the dielectrics in the capacitive sections.

A precipitation-hardening alloy, including 17 to 23.6 at % of Ag, 0.5 to 1.1 at % of B, and a total of 74.9 to 81.5 at % of Pd and Cu, wherein the at % ratio of the Pd and Cu is 1:1 to 1:1.2, and the rest includes In and inevitable impurities. This provides an alloy with good overall balance, having all of maintaining low specific resistance, at least almost equal to that of conventional Ag—Pd—Cu alloys, and also having contact resistance stability (oxidation resistance), good plastic workability, and higher hardness than before.

A palladium-copper-silver alloy consisting of 40 to 58% by weight of palladium, 25 to 42% by weight of copper, 6 to 20% by weight of silver, optionally up to 6% by weight of at least one element from the group ruthenium, rhodium, and rhenium, and up to 1% by weight of impurities, wherein the palladium-copper-silver alloy contains a crystalline phase with a B2 crystal structure and has 0% by volume to 10% by volume of precipitates of silver, palladium, and binary silver-palladium compounds. The invention also relates to a molded body, a wire, a strip, or a probe needle made of such a palladium-copper-silver alloy and to the use of such a palladium-copper-silver alloy for testing electrical contacts or for electrical contacting or for the production of a sliding contact. The invention also relates to a method for producing a palladium-copper-silver alloy.

A contact probe for a testing head of an apparatus for testing electronic devices comprises a body extending along a longitudinal axis between a first end portion and a second end portion, the second end portion being adapted to contact pads of a device under test. Suitably, the contact probe comprises a first section, which extends along the longitudinal axis from the first end portion and is made of an electrically non-conductive material, and a second section, which extends along the longitudinal axis from the second end portion up to the first section, the second section being electrically conductive and extending over a distance less than 1000 μm.

A manufacturing method for manufacturing at least one contact probe for a probe head of a test equipment of electronic devices, comprising a step of submicrometric 3D printing of the contact probe with at least one printing material selected from a conductor material or a semiconductor material is disclosed.

A pogo pin-free testing device for IC chip test includes a load board, a ceramic interposer disposed on the load board, and copper core balls. The ceramic interposer has first and second surfaces and connecting points, and the second surface of the ceramic interposer faces the load board. Each connecting point has through holes penetrating the first and second surfaces, and an inner sidewall surface thereof has a metallization layer. The metallization layer is extended to a portion of the first surface and a portion of the second surface. In each of the connecting points, an area of an extending portion of the metallization layer extended to the second surface is less than an area of an extending portion of the metallization layer extended to the first surface. The copper core balls are disposed between the load board and the through holes of each connecting point of the ceramic interposer.

A probe pin having an improved gripping structure is disclosed. The disclosed probe pin includes a pin body including a plurality of holes and positioned at one side, a first extension portion extending upward from an outer side of the pin body, a second extension portion elongated from the other end of the first extension portion, further extending than the pin body in the other direction, and spaced apart from the pin body, and a tip part integrated with the second extension portion and having an end sharply protruding upward from an outer upper end of the second extension portion, in which the second extension portion includes a plurality of elasticity provision holes formed in parallel with an outer peripheral surface of the second extension portion and having different shapes to provide an elastic force that moves a portion of a needle of the tip part.

A probe includes a first rod having a first axis and a second rod having a second axis. A first end of the first rod is connected to a first end of the second rod to form an angle that maintains a “total internal reflection” effect for waves propagating through the probe. A second end of the second rod includes a prong facilitating attachment of the probe to a housing block. The first axis and the second axis define a plane. A second end of the first rod includes a tapered face formed perpendicular to the plane. The tapered face is sufficiently flat to make planar contact with a portion of a component under study. A support is formed in the plane and connected to the second rod. A second end of the support includes a connector to facilitate attachment of the probe to the housing block.

An electrical connecting device (1) includes probes (10), and a probe head (20) including a middle guide plate (23) arranged between a top guide plate (21) and a bottom guide plate (22) and closer to the bottom guide plate (22) so as to lead the probes (10) to penetrate therethrough. The top guide plate (21) and the middle guide plate (23) are provided with guide holes through which the probes (10) are inserted at positions shifted between the top guide plate (21) and the middle guide plate (23) so as to lead the probes (10) to be held in a bent state between the top guide plate (21) and the middle guide plate (23). The probes (10) have a structure easier to bend at a region excluding a maximum stress part than at the maximum stress part defined at a position at which a maximum stress is applied to the probes (10) buckled when tip end parts of the probes (10) are brought into contact with an inspection object.