A hybrid optical-electrical automated testing equipment (ATE) system can implement a workpress assembly that can interface with a device under test (DUT) and a load board that holds the DUT during testing, analysis, and calibration. A test hand can actuate to position the DUT on a socket and align one or more alignment features. The workpress assembly can include two optical interfaces that are optically coupled such that light can be provided to a side of the DUT that is facing away from the load board, thereby enabling the ATE system to perform simultaneous optical and electrical testing of the DUT.

A current sensor of a detection target current using a shunt resistor includes: a resistance value correction circuit having: a correction resistor; a signal application unit that applies an alternating current signal to a series circuit of the shunt resistor and the correction resistor; a first voltage detection unit that detects the terminal voltage of the shunt resistor; a second voltage detection unit that detects a terminal voltage of the correction resistor; and a correction unit that calculates the resistance value of the shunt resistor based on a first voltage detection value by the first voltage detection unit and a second voltage detection value by the second voltage detection unit, and corrects the resistance value for current detection based on a calculated resistance value of the shunt resistor.

An optical probe for optoelectronic integrated circuits is provided, applicable to a test environment for testing a plurality of optical chips on a wafer. The optical chips include at least one optical waveguide, and the optical probe includes a substrate and an optical fiber. The facet of the optical fiber has a first angle, and the first angle causes the optical signal transmitted by the optical fiber to generate total reflection, and the optical signal after total reflection enters the optical waveguide of the optical chip. Thereby, an optical probe able to perform testing before wafer cutting and polishing is provided, and a high-speed, effective and reliable detection is achieved.

An optical voltage prove includes: an optical modulator 1 having two modulation electrodes 11 and 12, the optical modulator 1 being configured to modulate an intensity of an incident light depending on a voltage between the two modulation electrodes and output the incident light which is modulated; an input/output optical fiber 2 connected with the optical modulator 1; two contact terminal attachment portions 5, 6 to which contact terminals 3, 4 can be detachably attached and contacted, the two contact terminals 3, 4 being configured to be in contact with the points to be measured, the two contact terminal attachment portions 5, 6 being respectively connected with the modulation electrodes 11, 12; and a package 8 that houses the optical modulator 1 and a part of the input/output optical fiber 2. A voltage signal induced via the contact terminals 3, 4 is converted into an optical intensity modulation signal. When an electric wave having a measurement frequency is applied while the contact terminal attachment portions 5, 6 are opened, the package 8 exhibits a shielding effect of attenuating the electric wave by 15 dB or more compared to an output signal intensity measured without providing the package.

An optical voltage sensor assembly includes an input fiber-optic collimator positioned and configured to collimate input light beam from a light source. A crystal material is positioned to receive the input light beam from the light source and configured to exhibit the Pockels effect when an electric field is applied through the crystal material. An output fiber-optic collimator is positioned to receive an output light beam from the crystal material and configured to focus the output light beam from the crystal onto a detector. Methods of using the optical voltage sensor assembly are also disclosed.

A connecting device for inspection includes a probe head (30) configured to hold electric contacts (10) and optical contacts (20) such that tip ends of the respective contacts are exposed on a lower surface of the probe head (30) while proximal ends of the electric contacts (10) are exposed on an upper surface of the probe head and the optical contacts (20) are fixed to the probe head (30), and a transformer (40) including connecting wires (41) provided therein such that tip ends on one side of the connecting wires (41) electrically connected to the proximal ends of the electric contacts (10) exposed on the upper surface of the probe head (30) are arranged in a lower surface of the transformer (40) while the optical contacts (20) slidably penetrate the transformer (40). A positional relationship between the tip end of the respective electric contacts (10) and the tip end of the respective optical contacts (20) on the lower surface of the probe head (30) corresponds to a positional relationship between an electrical signal terminal and an optical signal terminal of a semiconductor device. The optical contacts (20) continuously penetrate the probe head (30) and the transformer (40).

A hybrid automated testing equipment (ATE) system can simultaneously test electrical and optical components of a device under test, such as an optical transceiver. The device under test can be a multilane optical transceiver that transmits different channels of data on different lanes. The hybrid ATE system can include one or more light sources and optical switches in an optical test lane selector to selectively test and calibrate each optical and electrical components of each lane of the device under test.

Described are various configurations for performing efficient optical and electrical testing of an opto-electrical device using a compact opto-electrical probe. The compact opto-electrical probe can include electrical contacts arranged for a given electrical contact layout of the opto-electrical device, and optical interface with a window in a probe core that transmits light from the opto-electrical device. An adjustable optical coupler of the probe can be mechanically positioned to receive light from the device's emitter to perform simultaneous optical and electrical analysis of the device.

A Scanning Time-Resolved Emission (S-TRE) microscope or system includes an optical system configured to collect light from emissions of light generated by a device under test (DUT). A scanning system is configured to permit the emissions of light to be collected from positions across the DUT in accordance with a scan pattern. A timing photodetector is configured to detect a single photon or photons of the emissions of light from the particular positions across the DUT such that the emissions of light are correlated to the positions to create a time-dependent map of the emissions of light across the DUT. The scanning system is configured to updated the time-dependent map of the emissions based on a transformation of an underlying time-resolved waveform at certain intervals and corresponding to at least one location and generating a pseudo image of the DUT.

An optical-electrical device can implement a feedback-based control loop for temperature of the device during component calibration. The optical-electrical device can implement compressed air to vary the device temperature during calibration. Additionally, non-active components of the device can be provided current to vary the temperature of the device in concert with the provided compressed air. Additional calibration temperatures can be implemented by activating and deactivating additional non-active components in the device, such as light sources, optical amplifiers, and modulators.