Embodiments of the disclosure provide a probe structured for electrical and photonics testing of a photonic integrated circuit (PIC) die, the probe including: a membrane having a first surface and an opposing second surface and including conductive traces, the membrane being configured for electrical coupling to a probe interface board (PIB); a set of probe tips positioned on the membrane, the set of probe tips being configured to send electrical test signals to the PIC die or receive electrical test signals from the PIC die; and a photonic test assembly disposed on the membrane and electrically coupled to the conductive traces of the membrane, the photonic test assembly positioned for substantial alignment with a photonic I/O element of the PIC die, wherein the photonic test assembly is configured to transmit a photonic input signal to the photonic I/O element or detect a photonic output signal from the photonic I/O element.

A device and method for determining a property of an electric field are herein described. The device comprises: a housing having a biocompatible outer surface; a plurality of electrodes supported by the housing; and a controller supported within the housing, the controller comprising a processor, a communication device, and a non-transitory computer-readable medium storing processor-executable code that when executed causes the processor to: measure a potential difference between a first electrode and a second electrode of the plurality of electrodes, the first electrode and the second electrode being spaced a predetermined distance apart; and transmit, with the communication device, data indicative of the potential difference.

A flexible probe for microLED defect detection includes: a flexible base and a flexible circuit film layer. The flexible base includes a flexible substrate and flexible protrusions located on the flexible substrate. A circuit for illuminating a microLED to be detected is provided inside the flexible circuit film layer. The flexible circuit film layer is attached to a surface on a side of the flexible base on which the flexible protrusions are provided, at least a portion of the circuit of the flexible circuit film layer is located on the flexible protrusions, and when the flexible probe for MicroLED defect detection is placed on the MicroLED, the circuit on the flexible protrusions abuts against pins of the MicroLED to be detected and is electrically connected to the pins.

An electro-optical circuit board can provide probe card functionality. The electro-optical circuit board includes at least one electrical conductor track and at least one optical beam path.

A connecting device for inspection includes a probe head configured to hold electric contacts and optical contacts such that tip ends of the respective contacts are exposed on a lower surface of the probe head while proximal ends of the electric contacts are exposed on an upper surface of the probe head and the optical contacts are fixed to the probe head, and a transformer including connecting wires provided therein such that tip ends on one side of the connecting wires electrically connected to the proximal ends of the electric contacts exposed on the upper surface of the probe head are arranged in a lower surface of the transformer while the optical contacts slidably penetrate the transformer. A positional relationship between the tip end of the respective electric contacts and the tip end of the respective optical contacts on the lower surface of the probe head corresponds to a positional relationship between an electrical signal terminal and an optical signal terminal of a semiconductor device. The optical contacts continuously penetrate the probe head and the transformer.

A current sensor for a detection target current using a shunt resistor includes: a resistance value correction circuit having a correction resistor; a signal application unit that applies an alternating current signal to a series circuit of the shunt resistor and the correction resistor; a voltage detection unit that detects terminal voltages of the shunt resistor and the correction resistor; and a correction unit that calculates a resistance value of the shunt resistor and corrects the resistance value for detection; and a power supply circuit having a first power supply generation unit that generates a first power supply of the signal application unit from an input power supply of an outside; and a second power supply generation unit that generates a second power supply of the voltage detection unit.

An optical voltage sensor assembly includes an input fiber-optic collimator positioned and configured to collimate input light beam from a light source. A crystal material is positioned to receive the input light beam from the light source and configured to exhibit the Pockels effect when an electric field is applied through the crystal material. An output fiber-optic collimator is positioned to receive an output light beam from the crystal material and configured to focus the output light beam from the crystal onto a detector. Methods of using the optical voltage sensor assembly are also disclosed.

A system and method are provided for compensating for thermal drift of a probe device. The method includes monitoring a first temperature of a laser source in a sensor head that receives output electrical signals from a DUT and outputs corresponding optical signals; monitoring a second temperature of a photoreceiver in a probe interface that converts the optical signals to electrical test signals to input to the test instrument; calculating a first value of a first bias voltage using the first temperature; applying the first value of the first bias voltage to the laser source to compensate for thermal drift when the first temperature is within a first predefined temperature range; calculating a second value of a second bias voltage for the photoreceiver using the second temperature; and applying the second value of the second bias voltage to the photoreceiver to compensate for thermal drift when the second temperature is within a second predefined temperature range.

An arrangement for a spatially resolved determination of the specific electrical resistance and/or of the specific electrical conductivity of a sample at different positions, in which a plurality of detectors are configured for a spatially resolved spectral analysis of electromagnetic radiation within a wavelength interval and is incident onto the detectors. A radiation onto a surface takes place with homogeneous intensity. The measurement signals of the detectors detected with spatial resolution and wavelength resolution within a wavelength interval are compared for each detected position with a wavelength-resolved function that are compared by calculation of the propagation of electromagnetic radiation in multilayer systems while using an optical model for a physical description of the examined sample while taking account of the wavelength-dependent progressions of the linear optical refractive indices n and of the coefficients of absorption k of all the materials and/or substances forming the sample that can be approximated by a physical function of a complex refractive index of the conductive material or substance. They are brought to a sufficient overlap with a calibration curve progression by a change of the parameters of the physical function to determine the specific electrical resistance and/or the specific electrical conductivity at different positions with spatial resolution.

A mechanism is included for receiving a phase modulated optical signal. The phase modulated signal is modulated by a remote electrical test signal at a sensor head. A reference optical signal is also received. A phase difference between the phase modulated optical signal and the reference optical signal is then determined. The phase difference is employed to recover the remote electrical test signal from the sensor head. The phase difference may be determined by employing a phase modulator in a controller that tracks a phase modulator in the sensor head. The phase difference may also be determined by comparison of the signals in the complex signal domain.