A test fixture holding without risk of any surface marking or damage to a product being tested includes a base with a circuit board, a needle seat, and a side push structure. The needle seat includes probes and first receiving cavity for holding the product. An opening in a sidewall of the first receiving cavity exposes one end of the side push structure. One end of the probe connects with the circuit board, other end of the probe is in the needle seat. With product in the first receiving cavity, the side push structure pushes the product against the sidewalls and the product is depressed to abut against the needle seat and the needles which are moved into the first receiving cavity to make contact with to the product. A testing machine having the test fixture is also provided.

A high-frequency testing probe having a probe substrate and at least two probe tips. The probe substrate is a printed circuit board and the probe tips are coupled to and extend outward from the printed circuit board. The first and second probe tips are each communicatively coupled to respective first and second probe connectors through respective first and second conducting traces disposed upon the printed circuit board. The probe connectors are configured to couple the testing probe to at least one of a high-frequency vector network analyzer and a high-frequency time domain reflectometer. The probe tips translate along their respective central longitudinal axes through respective adjustable couplings to modify respective distances the probe tips extend outward from the printed circuit board.

The invention relates to a test needle for measuring electrically conductive layers in holes of printed circuit boards, as well as to a test probe equipped with such a test needle and to a flying probe tester for testing printed circuit boards equipped with such a test needle or such a test probe.

The test needle has a capacitive measuring body, which is connected via a cable to a capacitive measuring device. The cable is shielded so that only the capacitive measuring body can form a capacitive coupling with other electrically conductive bodies. This makes it possible to determine this capacitive coupling with a high local resolution.

A test probe assembly for use in testing a semiconductor wafer includes a probe card, a plurality of test probes mounted to the probe card and one or more piezoelectric elements mounted to each test probe. The piezoelectric elements are configured to move respective probe ends of the individual test probes in at least one direction to facilitate realignment of the probe ends for semiconductor wafer testing.

A method for retesting a wafer is provided, including following steps of: providing a wafer having dice; providing a plurality of probe sets each including probes used to test the dice; on the basis of a first threshold, the probe sets respectively test the dice so as to classify the dice into first dice and retesting dice, each value obtained from testing each of the first dice being higher than the first threshold, each value obtained from testing each of the retesting dice being lower than the first threshold; conducting a smart sifting operation to classify the retesting dice of the wafer into second dice and third dice, wherein value obtained from testing each of the second dice is higher than a second threshold, and value obtained from testing each of the third dice is lower than the second threshold.

A probe structure for inspecting characteristics of a connector having at least one terminal includes a plunger, a coaxial probe, a flange, a housing, and a spring. A first end portion of the housing and the flange are configured to restrict rotation of the housing in the circumferential direction in a state in which the first end portion of the housing is fitted into the through-hole of the flange. Thus, inspection of characteristics of the terminal of the connector can be performed with higher accuracy.

A probe structure for inspecting characteristics of a connector having at least one terminal includes a plunger, a coaxial probe, a flange, a housing, and a spring. A first end portion of the housing and the flange are configured to restrict rotation of the housing in the circumferential direction in a state in which the first end portion of the housing is fitted into the through-hole of the flange. Thus, inspection of characteristics of the terminal of the connector can be performed with higher accuracy.

A hermetically sealed link for low loss coaxial airline connection between the wafer probe and the RF connector of an external instrument with 30 or 45 degrees wafer probes allows continuous, micro-positioner controlled, 3 axis horizontal and vertical probe movement. A flexible sealing ring ensures airtight and/or RF-EMI shielded operation. A metallic or plastic collar ensures wafer testing under EMI, airtight or high temperature conditions.

Embodiments of the invention include a tool and method for automatically replacing defective pogo pins for use in testing a semiconductor package. Aspects of the invention include a nozzle tip and a pin management valve assembly coupled to the nozzle tip. The pin management valve assembly is actuatable to couple an open pin management valve or a partially closed pin management valve to the nozzle tip. The open pin management valve includes a first diameter and the partially closed pin management valve includes a second diameter. A vacuum reservoir is coupled to the pin management valve assembly and a vacuum management valve is positioned between the pin management valve assembly and the vacuum reservoir. The vacuum management valve is actuatable between an open and closed position.

Embodiments of the invention include a tool and method for automatically replacing defective pogo pins for use in testing a semiconductor package. Aspects of the invention include a nozzle tip and a pin management valve assembly coupled to the nozzle tip. The pin management valve assembly is actuatable to couple an open pin management valve or a partially closed pin management valve to the nozzle tip. The open pin management valve includes a first diameter and the partially closed pin management valve includes a second diameter. A vacuum reservoir is coupled to the pin management valve assembly and a vacuum management valve is positioned between the pin management valve assembly and the vacuum reservoir. The vacuum management valve is actuatable between an open and closed position.