A system and methods are provided for robot-assisted, interactive testing of electronic circuits comprising a test fixture comprising a robotic arm, a probe, and a bracket configured to hold a unit-under-test, wherein the probe is configured to be mounted on the robotic arm and to perform a probe action, and a computer system communicatively connected to the test fixture and comprising a graphics display, a user input device. The computer system is configured to present on the graphics display a logic schematic of the unit-under-test, to receive a user selection of a target element shown on the logic schematic, to determine the corresponding physical location on the unit-under-test of said element, to move the probe to the physical location of the target element, by means of the robotic arm, and to perform one or more probe actions.

Probe systems and methods are disclosed herein. The methods include directly measuring a distance between a first manipulated assembly and a second manipulated assembly, contacting first and second probes with first and second contact locations, providing a test signal to an electrical structure, and receiving a resultant signal from the electrical structure. The methods further include characterizing at least one of a probe system and the electrical structure based upon the distance. In one embodiment, the probe systems include a measurement device configured to directly measure a distance between a first manipulated assembly and a second manipulated assembly. In another embodiment, the probe systems include a probe head assembly including a platen, a manipulator operatively attached to the platen, a vector network analyzer (VNA) extender operatively attached to the manipulator, and a probe operatively attached to the VNA extender.

A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.

Aspects of the present disclosure describe a voice coil actuated leaf spring prober that advantageously may be operated to probe every individual device (device under testDUT) comprising a contemporary wafer. The prober according to aspects of the present disclosure includes one or more probe needles attached in an electrically isolated arrangement to an end of a horizontal-U-shaped, recurved, leaf spring arrangement. The prober includesfor examplea voice coil actuator positioned within the horizontal-U-shaped portion of the leaf spring whichwhen operatedresults in leaf spring displacement and probe needle movement such that it may mechanically/electrically contact the DUT.

Probe systems and methods are disclosed herein. The methods include directly measuring a distance between a first manipulated assembly and a second manipulated assembly, contacting first and second probes with first and second contact locations, providing a test signal to an electrical structure, and receiving a resultant signal from the electrical structure. The methods further include characterizing at least one of a probe system and the electrical structure based upon the distance. In one embodiment, the probe systems include a measurement device configured to directly measure a distance between a first manipulated assembly and a second manipulated assembly. In another embodiment, the probe systems include a probe head assembly including a platen, a manipulator operatively attached to the platen, a vector network analyzer (VNA) extender operatively attached to the manipulator, and a probe operatively attached to the VNA extender.

A probe structure for inspecting characteristics of a connector having at least one terminal includes a plunger, a coaxial probe, a flange, a housing, and a spring. A first end portion of the housing and the flange are configured to restrict rotation of the housing in the circumferential direction in a state in which the first end portion of the housing is fitted into the through-hole of the flange. Thus, inspection of characteristics of the terminal of the connector can be performed with higher accuracy.

A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.

A test and measurement management device, including a request queue to receive a request from a request module, the request including an identification of a device under test and a requested measurement and one or more processors. The one or more processors are configured to receive the request from the request queue, generate a command to instruct an optical switch to select a port associated with the device under test based on the identification of the device under test, determine the requested measurement from the request, and based on the requested measurement and the identification of the device under test, generate instructions to configure a test and measurement instrument to perform the requested measurement.

A method for retesting a wafer is provided, including following steps of: providing a wafer having dice; providing a plurality of probe sets each including probes used to test the dice; on the basis of a first threshold, the probe sets respectively test the dice so as to classify the dice into first dice and retesting dice, each value obtained from testing each of the first dice being higher than the first threshold, each value obtained from testing each of the retesting dice being lower than the first threshold; conducting a smart sifting operation to classify the retesting dice of the wafer into second dice and third dice, wherein value obtained from testing each of the second dice is higher than a second threshold, and value obtained from testing each of the third dice is lower than the second threshold.

A positioning method and probe system for performing the same, a method for operating probe system, and a method for utilizing probe system to produce a tested semiconductor device are provided. The positioning method is used for positioning a plurality of probe assemblies with an under-test device including a plurality of pads, each of the probe assemblies have at least one probe tip that corresponds to each of the pads for contact, and at least one fixed probe assembly and at least one motorized probe assembly are defined among the probe assemblies during a positioning process.