An apparatus for testing an object may include a test chamber, a first chamber, a second chamber, and a gas supply module. The test chamber receives a test board for testing an object. The first chamber is under the test chamber and receives a lower surface of the test board. The second chamber surrounds the first chamber to isolate the first chamber from ambient air. The gas supply module supplies a dry gas to the second chamber to provide a positive pressure higher than an ambient pressure, thereby preventing the ambient air from infiltrating into the first chamber. Thus, during the testing of the object at a low temperature, the second chamber may prevent the humid ambient air from infiltrating into the first chamber to prevent condensation of water on the lower surface of the test board.

A method for testing the hermetic seal of a packaged device, which includes: a package that delimits a device chamber; and a transducer device, which is arranged within the device chamber and generates an electrical signal indicating at least one physical quantity external to the package. The testing method includes the steps of: imposing a reference pressure in the device chamber; arranging the packaged device in a testing chamber in which a testing pressure is present, different from the reference pressure; and subsequently detecting possible pressure variations within the device chamber.

A feedback burn-in device of a burn-in oven includes at least one burn-in rack disposed in the burn-in oven, at least one burn-in board, and at least one feedback burn-in unit. The burn-in rack is formed, in a top thereof, with at least one horizontal ventilation passage in communication with an interior of the burn-in rack. The horizontal ventilation passage has an end connected to at least one negative pressure zone or heat dissipation blower of the burn-in oven. The burn-in board is disposed in the interior of the burn-in rack. The burn-in board is connected to a socket to which at least one tested IC is connectable. The feedback burn-in unit is connected to the socket and the burn-in board. The feedback burn-in unit provide automatic feedback control for a burn-in board environment temperature, tested IC temperature detection, and a tested IC burn-in temperature, a dissipating airflow speed, and a burn-in board environment temperature, so as to discharge heat-dissipation hot air from the burn-in board and the tested IC of each feedback burn-in unit to the horizontal ventilation passage of the burn-in rack to be further discharge through one end of the horizontal ventilation passage to a negative pressure zone or a discharge blower of the burn-in oven, thereby forming a feedback burn-in device featuring automatic feedback burn-in and heat dissipative airflow discharged to the burn-in oven.

The invention relates to a porous thermoelectric material (5; 5a, 5b): having, at 20° C. and at atmospheric pressure, a thermal conductivity of less than 100 mW/(m.Math.K) and an electrical conductivity of between 20 S/m and 10.sup.5 S/m, and comprising a matrix of a thermal insulating material which has a porosity of more than 70%, and which may be filled at least locally with an electrically conductive material (5b), the content of the electrically conductive material being comprised between 0% and 90% by weight of the total weight of the thermal insulating material.

A temperature control component includes a TEC that includes a top surface and a bottom surface. A thermal conduction layer includes a top surface and a bottom surface. The top surface of the thermal conduction layer is coupled to the bottom surface of the TEC. The bottom surface of the thermal conduction layer includes a planar area. The planar area of the thermal conduction layer is to be positioned above two or more electronic devices of multiple electronic devices of an electronic system to transfer the thermal energy at the two or more electronic devices.

A testing apparatus for Devices Under Test (DUTs) includes at least one intake damper and at least one exhaust damper. At least one fan moves recirculated fluid and exterior fluid across one or more DUTs inside the testing apparatus. In one aspect, the testing apparatus includes a door to provide access to a chamber and the door includes at least one channel. At least a portion of the fluid flows through the at least one channel of the door. In another aspect, the door is configured to provide access to a chamber from the front of the chamber and the fluid is moved in a direction across the one or more DUTs substantially from the front of the chamber towards a rear of the chamber.

A probe card for testing power devices under high temperature and high voltage. The probe card includes air inlet system, PCB board, switching layer, guide plate and probe from top to bottom; the bottom of air inlet system includes plurality of lower air outlets and side air outlets, the PCB board includes a first through-hole with same position, shape and quantity as the lower air outlet, the switching layer includes a second through-hole with same position, shape and quantity as the lower air outlet, the guide plate includes a third through-hole with same position, shape and quantity as the lower air outlet. The lower air outlet, the first through-hole, the second through-hole and the third through-hole are coaxially arranged. The high-temperature and high-pressure gas ejected from the lower air outlet is blown between the guide plate and the tested wafer after successively passing through the first, second, and third through-holes.

Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.

A probe assembly and a micro vacuum probe station comprising same are disclosed. A probe assembly according to one embodiment may comprise: a base; a guide rail installed on the base; a guide member sliding along the guide rail; a probe connected to the guide member and of which one side contacts a wafer to inspect electrical properties of the wafer; and a thin film connector connected to the other side of the probe so as to supply electricity to the probe.

A testing apparatus including a base and a preheating unit arranged on the base is provided. The preheating unit includes a gas generator, a blocking mechanism and a heating device. The gas generator is configured to discharge air toward the base to form an air wall. The blocking mechanism is located above the air wall and forms a heat preservation space with the air wall. The heating device is arranged in the heat preservation space.