A digital sensor network is overlaid on an integrated circuit for identifying and mapping hotspots in the integrated circuit. The digital sensor network may include a plurality of digital sensors distributed within an area of an integrated circuit component of an integrated circuit. Each of the plurality of digital sensors may include a ring oscillator and may be configured to output a counter value of a ring oscillator counted over a designated period. A sensor network control unit may be provided that is communicatively connected to the plurality of digital sensors via a communication circuit. The sensor network control unit may be configured to receive a plurality of counter values including the counter value from each of the plurality of digital sensors and identify a hotspot within the area of the integrated circuit.

A testing device may include a stage associated with holding an emitter wafer during testing of an emitter. The stage may be arranged such that light emitted by the emitter passes through the stage. The testing device may include a heat sink arranged such that the light emitted by the emitter during the testing is emitted in a direction away from the heat sink, and such that a first surface of the heat sink is near a surface of the emitter wafer during the testing but does not contact the surface of the emitter wafer. The testing device may include a probe card, associated with performing the testing of the emitter, that is arranged over a second surface of the heat sink such that, during the testing of the emitter, a probe of the probe card contacts a probe pad for the emitter through an opening in the heat sink.

A testing apparatus for Data Storage Devices (DSDs) includes a chassis and at least one interface module configured to be removably inserted into the chassis and house a plurality of interface boards. Each interface board includes a DSD connector for connecting a DSD to the interface board and a backplane connector for connecting to a backplane for communicating with a respective computing unit. In one aspect, the at least one interface module includes a housing and a plurality of openings in a side of the housing with each opening configured to receive a respective interface board. A plurality of guide member pairs is positioned to guide respective interface boards when inserted into respective openings such that the backplane connector is located at a respective predetermined location for connecting to the backplane. In another aspect, the interface boards are removable from the interface module.

Disclosed herein are thermal heads and corresponding test systems for independently controlling a one or more components while testing one or more devices under test. In some embodiments, a thermal head comprises a plurality of adapters, one or more heaters, and one or more thermal controllers for independently controlling temperatures of the components. The thermal controllers may control the temperatures of at least some of the components independently such that thermal control of one component does not affect the thermal control of the other component. In some embodiments, the thermal control is by way of one or more cold plates, and the thermal head comprises one or more cold plates. Embodiments of the disclosure further include independent control of one or more forces using one or more force mechanisms.

A method comprising activating an internal switch within a packaged electronic device to connect to a reference ground of an internal voltage source to a first input of an analog front end, receiving an external ground potential voltage at a first package pin of the packaged electronic device, generating a zero detector output signal for the packaged electronic device at a second package pin, activating the internal switch to connect the first input of the analog front end to the internal voltage source, receiving a second voltage level at the first package pin that generates a second output signal that matches the zero detector output signal, and receiving trim instructions to trim an internal voltage generated by the internal voltage source to a voltage level that is closer to a target voltage level.

A circuit board has: an insulating substrate formed by plural ceramic insulating layers being layered on one another and having a first surface and a second surface on the opposite side to the first surface; a circuit conductor passing through the inside of the insulating substrate and positioned in a region from the first surface to the second surface; and at least one heating wire positioned in the insulating substrate. The heating wire is positioned in, among plural interlayer regions between the ceramic insulating layers, at least one interlayer region between the ceramic insulating layers and has a mesh shape having plural first through holes through which a portion of the circuit conductor passes and having plural second through holes through which the circuit conductor does not pass.

The disclosure describes to techniques for detecting field failures or performance degradation of circuits, including integrated circuits (IC), by including additional contacts, i.e. terminals, along with the functional contacts that used for connecting the circuit to a system in which the circuit is a part. These additional contacts may be used to measure dynamic changing electrical characteristics over time e.g. voltage, current, temperature and impedance. These electrical characteristics may be representative of a certain failure mode and may be an indicator for circuit state-of-health (SOH), while the circuit is performing in the field.

Proposed is a wafer inspection apparatus and a wafer inspection method, which can increase inspection accuracy while reducing the amount of dry air used. The wafer inspection apparatus includes a chamber providing a space for an electrical test of a wafer, a support unit positioned inside the chamber to support the wafer, a temperature control unit for controlling a test temperature of the wafer, a dry air supply unit for supplying dry air to the chamber, and a flow control unit for controlling the dry air supply unit to adjust flow rate of the dry air based on the test temperature. The wafer inspection apparatus and the wafer inspection method of the present disclosure may increase the accuracy of the wafer inspection while preventing the drying air from being wasted by variably adjusting the flow rate of dry air supplied based on the test temperature of the wafer.

A wafer inspection apparatus according to one embodiment is a wafer inspection apparatus including a plurality of inspection parts arranged in a height direction and a lateral direction, and includes a pair of air circulating means disposed at both ends in a longitudinal direction of an air circulating region including the plurality of inspection parts arranged in the lateral direction and configured to circulate air in the circulating region.

A contact resistance test method and related devices are provided. When a MOS transistor working in a linear region is tested, a functional relationship between the channel width of the MOS transistor and total resistances of the MOS transistor at sampling temperatures is determined, to determine the contact resistance of the MOS transistor at the sampling temperatures. A calibration coefficient of the contact resistance at a current ambient temperature is determined based on the contact resistance of the MOS transistor at the sampling temperatures. A measurement result of the contact resistance is further adjusted based on the calibration coefficient of the contact resistance at the current ambient temperature, to obtain an accurate contact resistance at the current ambient temperature.