A semiconductor device includes a scan input circuit, a master latch, a slave latch, a first inverter, and a scan output circuit. The scan input circuit is configured to receive a scan input signal, a first data signal, and a scan enable signal and select any one of the first data signal and the scan input signal in response to the scan enable signal to output a first select signal. The master latch is configured to latch the first select signal and output a first output signal. The slave latch is configured to latch the first output signal and output a second output signal. The first inverter is configured to invert the second output signal. The scan output circuit is configured to receive a signal output from the slave latch and an external signal and output a first scan output signal.

An example system includes a processor to receive a template-aware coverage data that tracks probabilities of events in a list of events being hit for a set of test-templates over a first and second predetermined period of time. The processor is to generate a hit prediction score for each combination of unhit event in the events and each test-template in the set of test-templates of the second predetermined period of time. The hit prediction score indicates a probability of an unhit event being hit by a particular test-template in a future third predetermined period of time based on the template-aware coverage data and similarities between the events and the test-templates. The processor is to generate a template score for each test-template based on the hit prediction scores for each test-template. The processor is to select a test-template from the set of test-templates based on the template score.

A performance calculation method suitable for a chip is provided. The chip includes oscillator circuit systems configured to generate oscillation signals and to sense operation states of the chip to adjust periods of the oscillation signals. The method includes following operations: when the chip is in a first operation state, constructing a first function according to the periods of the oscillation signals and a first performance value of the chip; when the chip is in a second operation state, constructing a second function according to the periods of the oscillation signals and a second performance value of the chip; adjusting coefficients of the first or second function according to trajectories of graphs of the first and second functions, so that the graphs of the first and second functions intersect at a coordinate point; constructing a performance function of the chip according to the first and second functions.

A method of reconfiguring a current debug configuration of a debug unit connected to a peripheral circuit on an integrated circuit chip. The method comprises the debug unit collecting debug data of the peripheral circuit and outputting the debug data in a message stream. The debug unit receives a debug reconfiguration command. The debug unit transmits an indication of the current debug configuration, then reconfigures the current debug configuration to a new debug configuration in accordance with the debug reconfiguration command, then transmits an indication of the new debug configuration. The indication of the current debug configuration and the indication of the new debug configuration are transmitted adjacent to the debug data in the message stream.

A circuit comprises: a bit-flipping signal generation device comprising a storage device and configured to generate a bit-flipping signal based on bit-flipping location information, the storage device configured to store the bit-flipping location information for a first number of bits, the bit-flipping location information obtained through a fault simulation process; a pseudo random test pattern generator configured to generate test patterns based on the bit-flipping signal, the pseudo random test pattern generator comprising a register configured to be a linear finite state machine, the register comprising storage elements and bit-flipping devices, each of the bit-flipping devices coupled to one of the storage elements; and scan chains configured to receive the test patterns, wherein the bit-flipping signal causes one of the bit-flipping devices to invert a bit of the register each time a second number of test patterns is being generated by the pseudo random test pattern generator during a test.

A method for recovering data included in a digitally modulated signal is described. The digitally modulated signal includes a symbol sequence. The method includes providing a mathematical model of the digitally modulated signal, the mathematical model describing the digitally modulated signal in terms of the symbol sequence and describing the digitally modulated signal in terms of a step response and/or an impulse response, and wherein the mathematical model also takes disturbances into account; and processing the digitally modulated signal based on the mathematical model, thereby recovering the data included in the digitally modulated signal. The disturbances include a random disturbance component modelled as a Gaussian disturbance, and include an inter-symbol interference component modelled as Gaussian noise, and wherein a dependence of the at least one step response on the symbol sequence is neglected within the mathematical model. Further, a measurement instrument and a measurement system are described.

A method for testing systems on a chip during manufacture obtains basic function information of intellectual property cores and relevant information of network on chip and generates one or more test names according to the basic function information, and the relevant information of the network on chip. The method invokes a pre-prepared integral script to construct a running environment configured to invoke basic function scripts of to-be-tested intellectual property cores one by one, according to each of the test names which are generated. The method also generates the results of testing. A related electronic device and a non-transitory storage medium are also disclosed.

A semiconductor device capable of monitoring a connection state of a terminal on a semiconductor chip includes a selector configured to acquire terminal levels of a plurality of respective terminals on the semiconductor chip to which an inspection pattern is inputted based on a detection signal, a memory configured to store latch data based on a chip address which identifies the semiconductor chip and a plurality of the terminal levels corresponding to the plurality of terminals based on the detection signal, an output circuit configured to read a plurality of pieces of latch data from the memory based on the detection signal and to output the plurality of pieces of latch data, and a timing control circuit configured to generate the detection signal by detecting an edge of a clock inputted during an inspection mode and configured to activate the selector, the memory, and the output circuit.

A semiconductor device comprises a central processing device, a first logical circuit, and a serial memory interface circuit. The first logical circuit has a first scan chain in which a first scan pattern is set, is configured to suppress a leakage current when the first scan pattern for power saving is set in the first scan chain. The serial memory interface circuit is configured to acquire the first scan pattern for power saving from an external storage device. The leakage current of the first logical circuit is suppressed by transferring the first scan pattern for power saving acquired by the serial memory interface circuit to the first logical circuit and setting the first scan pattern for power saving in the first scan chain under control of the central processing device.

A semiconductor device includes a scan input circuit, a master latch, a slave latch, a first inverter, and a scan output circuit. The scan input circuit is configured to receive a scan input signal, a first data signal, and a scan enable signal and select any one of the first data signal and the scan input signal in response to the scan enable signal to output a first select signal. The master latch is configured to latch the first select signal and output a first output signal. The slave latch is configured to latch the first output signal and output a second output signal. The first inverter is configured to invert the second output signal. The scan output circuit is configured to receive a signal output from the slave latch and an external signal and output a first scan output signal.