A detector assembly for use in detecting radiation includes a scintillator and a solid state photomultiplier coupled to the scintillator. The detector assembly may include a light guide connected between the scintillator and the solid state photomultiplier. The detector assembly may be used within a receiver in a logging instrument for use downhole. The receiver is configured to detect radiation produced by an emitter or from naturally occurring sources.

A digital radiographic detector includes redundant bonding pads formed on the array substrate and electrically connected to the array of photosensors. A plurality of COFs are each electrically connected to one of the bonding pads. A repair may be performed by removing a bond pad and reconnecting a corresponding COF to a redundant bond pad. A PCB including array read out electronics is electrically connected to the plurality of COFs.

The disclosure relates to a scintillation pixel array, a radiation sensing apparatus, a scintillation apparatus, and methods of making a scintillation pixel array wherein scintillation pixels have beveled surfaces and a reflective material around the beveled surfaces. The embodiments described herein can reduce the amount of cross-talk between adjacent scintillation pixels.

Some embodiments include a method. The method can include providing a scintillator structure. Providing the scintillator structure can include providing a scintillator support layer, providing a scintillator layer, and coupling the scintillator layer to the scintillator support layer. Meanwhile, the scintillator support layer has a substantially non-planar surface, the scintillator layer having a first surface and a second surface opposite the first surface and being configured to scintillate, and the first surface of the scintillator layer is coupled to the substantially non-planar surface of the scintillator support layer such that the second surface of the scintillator layer has a contour of the substantially non-planar surface of the scintillator support layer. Other embodiments of related methods and systems are also disclosed.

A radiation detection apparatus may include a scintillator to emit scintillating light in response to absorbing radiation, a photosensor to generate an electronic pulse in response to receiving the scintillating light, and a reflector surrounding the photosensor. The photosensor may be coupled to a wiring board and the reflector may be coupled to the wiring board. The radiation detection apparatus can be more compact and more rugged as compared to radiation detection apparatuses that include a photomultiplier tube.

A dual mode radiation detector can include a compact casing, a scintillator; and a photosensor disposed on the scintillator. The scintillator can be the only detection medium disposed within the casing. The radiation detector can have a Pulse Shape Discrimination Figure of Merit of at least 1.5, or a neutron detection efficiency of at least 0.06 cps/ng .sup.252Cf, measured at 1 meter with a 5 cm high density polyethylene moderator, each measured at a temperature of 22° C.

According to the embodiment, a radiation detector includes an array substrate, a scintillator layer, a wall body, a filling body, and a moisture-resistant body. A peripheral portion of the scintillator layer has a tapered shape in a direction toward outside. The filling body adheres to an inner side surface of the wall body. The filling body is close or adhering to the peripheral portion of the scintillator layer having the tapered shape. The filling body fills a space above the peripheral portion of the scintillator layer. A height of an upper surface of the filling body is close to a height of an upper surface of the wall body.

The present invention provides an X-ray image sensor comprising: a sensor panel which is bendable, generates an electrical signal by detecting an X-ray, and has a first elasticity; a printed circuit board which transmits the electrical signal to the outside, has a second elasticity that is smaller than the first elasticity, and has a flexible property; and an elastic adjustment member which is made of an elastic material having a third elasticity that is larger than the first elasticity, and which adjusts the elasticity of the sensor panel and the printed circuit board so as to be greater than or equal to the third elasticity.

The present approaches relate to the fabrication of non-rectangular (e.g., non-square) light imager panels having comparable active areas to rectangular light imager panels but manufactured using fewer c-Si wafers. Such light imager panels may be generally squircle shaped (e.g., a square or rectangle with one or more rounded corners and may be manufactured using conventional crystalline silicon (c-Si) wafers, such as 8″ wafers.

Fabrication and use of an X-ray detector scan interface having separate enable and reset lines for each line (e.g., row) of pixels is described. In certain implementations, the respective enable and reset lines are connected such that activation of an enable line for a given line of pixels is concurrent with activation of a reset line for a different (e.g., preceding) row of pixels. In this manner, readout of one row of pixels is performed in conjunction with resetting the row of pixels readout in the preceding operation. In another technical implementation, a non-rectangular detector is divided into quadrants, with alternating quadrants configured for scan module or data module operations such that no quadrant has overlapping scan and data interconnections at the connection finger regions.