Disclosed are optical arrays and optical devices that can be operated in narrow and wide spectral bands and at high spectral resolutions. Disclosed also are filter arrays with replicated etalon units that can function as bandpass filters. Disclosed further are methods for manufacturing optical arrays, filter arrays, and optical devices having such optical or filter arrays.

An optical phased array is provided, including: a silicon substrate; a silicon oxide layer; an optical waveguide layer including a coupling beam splitter and a grating antenna; a silicon oxide cladding layer, disposed around the optical waveguide layer and filled in the band-shaped gap; and one or more lithium niobate phase shifters; each lithium niobate phase shifter includes: a lithium niobate thin film located in the band-shaped gap, a lithium niobate optical waveguide disposed over the lithium niobate thin film and connected to the coupling beam splitter and the grating antenna, modulation electrodes. The present disclosure uses materials with high electro-optical coefficient and low loss, such as lithium niobate, to replace thermal modulation resistors and the phase modulation mode based on carrier injection used in optical phased arrays, so that the optical phase modulation with low power consumption, high speed and low waveguide loss can be performed.

An optical array waveguide grating-type multiplexer and demultiplexer according to an embodiment of the present invention comprise: a first substrate, a plurality of first waveguides disposed on the first substrate to be superposed in the vertical direction, which is the thickness direction of the first substrate; a 1-1st cladding layer disposed between the first substrate and a 1-1st waveguide, which is nearest to the first substrate among the plurality of first waveguides; a 1-2nd cladding layer disposed between the plurality of first waveguides; and a 1-3rd cladding layer disposed on a 1-2nd waveguide, which is furthest from the first substrate among the plurality of first waveguides.

An optical coupler device comprises a substrate having a substantially planar upper surface, and a grating structure on the upper surface of the substrate. In one embodiment, the grating structure comprises a copropagating array of waveguides that are substantially parallel to each other and extend along at least a portion of the upper surface of the substrate. Each of the waveguides has opposing sidewalls, wherein a width of each waveguide is defined by a distance between the opposing sidewalls. The opposing sidewalls each have a periodic structure that produces a sidewall modulation for each of the waveguides. An input port is in optical communication with the grating structure. The input port is configured to direct an input light beam in plane into the grating structure such that the beam propagates along the waveguides. The grating structure is configured to diffract the beam out of plane and into free space.

A method for manufacturing an optical electrical module includes steps as follow. Forming first patterns on a first substrate by a first mask, wherein an angle between a primary flat of the first substrate and an arrangement direction having a maximum number of first pattern units of the first mask is (θ+90°*n), wherein θ is between 22° to 39°, and n is an integer. Subjecting the first substrate to a first patterning process using the first patterns as a mask to form accommodating grooves and a reflective groove connected with the accommodating grooves in the first substrate, wherein an extension direction of each of the accommodating grooves is perpendicular to an extension direction of the reflective groove.

A multi-path interference filter. The multi-path interference filter includes a first port waveguide, a second port waveguide, and an optical structure connecting the first port waveguide and the second port waveguide. The optical structure has a first optical path from the first port waveguide to the second port waveguide, and a second optical path, different from the first optical path, from the first port waveguide to the second port waveguide. The first optical path has a portion, having a first length, within hydrogenated amorphous silicon. The second optical path has a portion, having a second length, within crystalline silicon, and the second optical path has either no portion within hydrogenated amorphous silicon, or a portion, having a third length, within hydrogenated amorphous silicon, the third length being less than the first length.

An apparatus and method for temperature compensation, belonging to the technical field of optical communications, and particularly an apparatus and method for implementing bilinear temperature compensation of an arrayed waveguide grating is disclosed. The apparatus consists of two drivers. A first driver performs linear compensation in a range lower than normal temperature 25° C. to −40° C. (low-temperature area) or a range higher than ambient temperature 25° C. to 85° C. (high-temperature area). A second driver is used to realize nonlinear compensation of superimposed effect of AWG chip wavelength/temperature in another temperature area. Two parts of the chip after being divided have different relative displacement/effective compensation amounts in different temperature ranges, having over-compensation in the high-temperature area and under-compensation in the low-temperature area, so that a center wavelength of the AWG chip appears as two gentle curves with temperature change. The residual nonlinear temperature effect is effectively reduced.

An optical waveguide interferometer that includes a first optical section, a second optical section, and a set of optical waveguides configured to connect the first and second optical sections, such that light propagating between the first optical section and the second optical section passes through each optical waveguide in the set, wherein the set of optical waveguides includes a first optical waveguide having a first length and a first width and a second optical waveguide having a second length and a second width, wherein the second length is greater than the first length, and the second width is greater than the first width.

In general, a TOSA consistent with the present disclosure includes a light driving circuit coupled to a hermetically-sealed light engine. The hermetically-sealed light engine includes a housing defined by a plurality of sidewalls. The housing defines a cavity that is hermetically-sealed to prevent introduction of contaminants that would otherwise reduce optical power. The hermetically-sealed light engine optically couples to an external arrayed waveguide grating (AWG), or other multiplexing device, by way of an optical receptacle. The optical receptacle can include a waveguide implemented external to the hermetically-sealed cavity and can include, for instance, an optical isolator, fiber stub, and fiber ferrule section. Thus, the external AWG and associated external optical coupling components advantageously allow for the hermetically-sealed light engine to have a cavity with dimensions relatively smaller than other approaches that dispose an AWG and associated components within a hermetically-sealed cavity.

A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.