System and methods for optical power distribution to a large numbers of sample wells within an integrated device that can analyze single molecules and perform nucleic acid sequencing are described. The integrated device may include a grating coupler configured to receive an optical beam from an optical source and optical splitters configured to divide optical power of the grating coupler to waveguides of the integrated device positioned to couple with the sample wells. Outputs of the grating coupler may vary in one or more dimensions to account for an optical intensity profile of the optical source.

A dispersion-engineered 2D optical phased array device includes optical slow light waveguides [202, 208, 218] arranged parallel to each other; waveguide bends [206, 216] optically coupling ends of adjacent waveguides of the optical slow light waveguides to form a serpentine optical configuration; wherein the optical slow light waveguides comprise first waveguides of a first waveguide type and second waveguides of a second waveguide type, wherein the first waveguides and the second waveguides are arranged adjacent to each other and alternate with each other; wherein the optical slow light waveguides comprise phased array sections forming a phased array [214], wherein first waveguides and second waveguides have dispersion slopes of opposite sign and the same group index; wherein the optical slow light waveguides comprise slow light delay waveguide sections [210] that provide a delay between adjacent waveguides.

An object is to improve crosstalk between ports while keeping an interposer circuit small. In an interposer circuit that includes a first surface connected to an optical circuit, a second surface that is connected to a fiber block and is located opposite to the first surface in parallel with the first surface, and a plurality of connection waveguides connected to a plurality of input/output waveguides included in the optical circuit and a plurality of input/output fibers included in the fiber block, the connection waveguides each have a straight shape, and an angle (θ) formed between the first surface and each of the connection waveguides is the same as an angle (φ) formed between the second surface and each of the connection waveguides.

A structure for, and method of, forming a first optoelectronic circuitry that generates an optical signal, a second optoelectronic circuitry that receives an optical signal, and a loopback waveguide that connects the output from the first optoelectronic circuitry to the second optoelectronic circuitry on an interposer substrate are described. The connected circuits, together comprising a photonic integrated circuit, are electrically tested using electrical signals that are provided via probing contact pads on the PIC die. Electrical activation of the optoelectrical sending devices and the subsequent detection and measurement of the optical signals in the receiving devices, in embodiments, provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

Disclosed is a structure including a first waveguide core with a first end portion and a second waveguide core with a second end portion, which overlays and is physically separated from the first end portion. The structure includes a coupler configured for interlayer waveguide coupling. Specifically, the coupler includes an additional waveguide core stacked vertically between and physically separated from the first end portion and the second end portion. Optionally, the coupler includes multiple additional waveguide cores. The shapes of the various waveguide cores are configured in order to achieve mode matching so that optical signals pass between the first end portion of the first waveguide core and the second end portion of the second waveguide core through each additional waveguide core in sequence. Also disclosed is a structure including a crossing array implemented using couplers.

A super-compact arrayed waveguide grating (AWG) wavelength division multiplexer based on a sub-wavelength grating is provided and includes an input waveguide, a first planar waveguide, an arrayed waveguide, a second planar waveguide, and the output waveguide that are sequentially connected. The input waveguide has 1 port, and the output waveguide has 8 ports. The arrayed waveguide includes 50 equivalent uniform strip waveguides with the same length difference, and each of the equivalent uniform strip waveguides is configured as a sub-wavelength grating structure, thereby forming the effect of increasing group refractive index or transmission delay based on a slow light effect. The 8 channels with a channel spacing of 200 GHz have the minimum adjacent channel crosstalk of less than -27 dB, and the overall size is within 300×230 .Math.m.sup.2. In the multiplexer, the overall integration size of the device is reduced by an order of magnitude.

An optical waveguide component is configured to have a dual structure in which a core region of the first optical waveguide is contained within the core region of the second optical waveguide in a cross-section perpendicular to the length direction of the optical waveguide. The refractive index of a first material of the core of the first optical waveguide is greater than a refractive index of a second material of the core of a second optical waveguide. The refractive index of a second material constituting the core of a second optical waveguide is greater than a refractive index of a third material constituting cladding of the second optical waveguide. The center height of the core of the first optical waveguide and the center height of the core of the second optical waveguide are aligned, which solves connectivity problems caused by worsened butt coupling efficiency, and incomplete adiabatic coupling in an SSC structure of prior art.

A PIC including a plurality of optically interconnectable functional photonic blocks and a reconfigurable optical connection arrangement having a plurality of semiconductor-based optical waveguides and a plurality of controllable optical switches, at least one controllable optical switch being configurable to be in a first state allowing optical transmission or a second state preventing optical transmission. Depending on the respective first or second state of the at least one controllable optical switch, the optical connection arrangement is configured to enable at least a first set of semiconductor-based optical waveguides to provide at least one optical connection between at least two functional photonic blocks and/or a first optical access path to at least one functional photonic block. An opto-electronic system including the PIC and to a method of improved determination of an overall performance of the PIC.

A wavelength checker includes an optical converter composed of a conversion material that converts infrared light into visible light. The optical converter is disposed, on an output side (side from which light is output to an external space) of a plurality of first output waveguides of an optical waveguide chip, to receive emitted light that is guided through the first output waveguides and reflected on and emitted from the light emitting-side end surface. The light emitting-side end surface is a reflection surface that is inclined to face a main substrate.

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.