A photonic integrated circuit (PIC) system, preferably including a substrate, one or more photonic connections, and a plurality of circuit blocks. The circuit blocks preferably include one or more waveguides that are optically coupled to the photonic connections, such as by transition features. A method of PIC fabrication, preferably including defining a PIC structure and defining circuit blocks. The circuit blocks are preferably defined onto one or more template regions defined by the PIC structure. Photonic connections are preferably defined as part of the PIC structure. Transition features, such as transitions between the photonic connections and the circuit blocks, are preferably defined concurrently with defining the circuit blocks.

A Distributed Feedback Laser (DFB) mounted on a Silicon Photonic Integrated Circuit (Si PIC), the DFB having a longitudinal length which extends from a first end of the DFB laser to a second end of the DFB laser, the DFB laser comprising: an epi stack, the epi stack comprising: one or more active material layers; a layer comprising a partial grating, the partial grating extending from the second end of the DFB laser, only partially along the longitudinal length of the DFB laser such that it does not extend to the first end of the DFB laser; a highly reflective medium located at the first end of the DFB laser; and a back facet located at the second end of the DFB laser.

Configurations are disclosed for multi-wavelength optical devices and systems. In particular, multi-wavelength optical devices that include separate chips optically connected via phonic wire bonds. The disclosed configurations can utilize photonic wire bond interconnects and photonic wire bond interconnection techniques, which may facilitate low-cost implementation of wavelength division multiplexed optical systems.

In one embodiment, a silicon photonic integrated circuit (PIC) includes a pair of Mach-Zehnder Interferometers (MZI) with a phase shifter to function as a 1x2 optical switches. On one path between the MZIs is a wavelength interleaver. The MZI switch can be controlled to either an all-pass mode or a by-pass mode, therefore setting configurable optical demultiplexing bandwidths to support dual 1.6 T FR8/800G FR4 network backward compatibility. The configurable multiplexer operates at set-and-forget mode for the entire operating temperature and the product’s lifetime.

A fiber-to-fiber system for multi-layer ferroelectric on insulator waveguide devices is described. The system comprises a fiber-to-chip coupler that couples light from a standard optical fiber to multi-layer ferroelectric on insulator waveguides. The multi-layer ferroelectric on insulator waveguides are integrated with electrodes to implement an optical device, an electro-optical device, or a non-linear optical device, such as an electro-optical modulator, with microwave and optical waveguide crossings compatible with packaging. A second fiber-to-chip coupler outputs the light from the multi-layer ferroelectric on insulator device to a standard optical fiber.

Semiconductor devices and methods of forming the semiconductor devices are described herein. A method includes providing a first material layer between a second material layer and a semiconductor substrate and forming a first waveguide in the second material layer. The method also includes forming a photonic die over the first waveguide and forming a first cavity in the semiconductor substrate and exposing the first layer. Once formed, the first cavity is filled with a first backfill material adjacent the first layer. The methods also include electrically coupling an electronic die to the photonic die. Some methods include packaging the semiconductor device in a packaged assembly.

Provided are a subminiature optical transmission module and a method for manufacturing same. The optical transmission module includes: a mold body having a first surface and a second surface opposite to each other; multiple edge-type light emitting elements, each of which is molded inside the mold body by fitting same to the first surface so as to match with the first surface and generates an optical signal in the edge direction of a chip; and an optical component disposed on one side thereof so as to optically multiplex multiple optical signals incident from the multiple edge-type light emitting elements and to output same, wherein the identical height is configured between the surface of each light emitting element and the optical axis of the optical component, and the edge direction of the chip is parallel to the first surface of the mold body.

A photonic integrated circuit (PIC) is disclosed herein. The PIC can include a substrate, a main optical waveguide supported by the substrate. The main optical waveguide can be in communication with an electromagnetic radiation source, and configured to receive electromagnetic radiation from the electromagnetic radiation source. A first branch optical waveguide can be optically coupled to the main optical waveguide at a first location. An optical phased array (OPA) can include plurality of array elements, each having an optical antenna and an optical phase modulator. At least some array elements within a first subset of the plurality of array elements can be optically coupled to the first branch optical waveguide wherein locations of at least some of the plurality of array elements are aperiodic in one or more directions on the substrate.

An optoelectronic chip includes optical inputs having different passbands, a photonic circuit to be tested, and an optical coupling device configured to couple said inputs to the photonic circuit to be tested.

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400° C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.