To reduce the size while being able to accurately monitor light of a plurality of wavelengths. An optical multiplexing circuit includes: a plurality of branching units each configured to divide light output from a corresponding one of a plurality of input waveguides; a multiplexing unit configured to multiplex beams each being one beam of the light divided by each of the plurality of branching units; an output waveguide configured to output the light multiplexed by the multiplexing unit; and a plurality of monitoring waveguides each configured to output another beam of the light divided by each of the plurality of branching units, wherein at least one monitoring waveguide of the plurality of monitoring waveguides includes a bent waveguide constituted by a rib-shaped waveguide.

A grating coupler having first and second ends for coupling a light beam to a waveguide of a chip includes a substrate configured to receive the light beam from the first end and transmit the light beam through the second end, the substrate having a first refractive index n1, a grating structure having curved grating lines arranged on the substrate, the grating structure having a second refractive index n1, wherein the curved grating lines have line width w and height d and are arranged by a pitch Λ, wherein the second refractive index n2 is less than first refractive index n1, and a cladding layer configured to cover the grating structure, wherein the cladding layer has a third refractive index n3.

Provided is a novel beam delivery system for quantum computing applications that includes a beam delivery photonic integrated circuit on a chip and an optical relay assembly. The beam delivery photonic integrated circuit on a chip may contain one or more layers, and a layer may contain one or more inputs connecting one or more outputs. The optical relay assembly receives a beam or beams from one or more outputs from a layer of the beam delivery photonic integrated circuit. The optical relay assembly focuses each received beam on a corresponding position of an atomic object confinement apparatus.

The present disclosure relates to system-level integration of lasers, electronics, integrated photonics-based optical components and a sensing chip. Novel waveguide design on the integrated photonics chip, acting as a front-end chip, ensures precise detection of phase change in a fiber coil or a sensing chip having a waveguide coil or ring resonator, where the sending chip is coupled to the front end chip. Strip waveguides are designed to primarily select TE mode over TM mode when laser light is coupled into the integrated photonics chip. A plurality of mode-selective filters, based on multi-mode interference (MMI) filter, a serpentine structure, or other types of waveguide-based mode-selective structure, are introduced in the system architecture. Additionally, implant regions are introduced around the waveguides and other optical components to block unwanted/stray light into the waveguides and optical signal leaking out of the waveguide.

Embodiments described herein may be related to apparatuses, processes, and techniques related to incorporating photonics integrated circuitry into a base die, the base die including an optical interconnect at a bottom of the base die to transmit and to receive light signals from outside the base die. The top of the base die includes one or more electrical connectors that are electrically coupled with the photonics integrated circuitry. The base die may be referred to as the photonics die. A system-on-a-chip (SOC) may be electrically coupled with and stacked onto the top of the photonics die. Other embodiments may be described and/or claimed.

Embodiments disclosed herein include electronic packages and methods of forming such structures. In an embodiment, an electronic package comprises a package substrate, a first die over the package substrate, and a second die over the package substrate. In an embodiment, the electronic package further comprises an optical waveguide on the package substrate. In an embodiment, a first end of the optical waveguide is below the first die and a second end of the optical waveguide is below the second die. In an embodiment, the optical waveguide communicatively couples the first die to the second die.

Disclosed is a silicon-on-insulator (SOI) chip structure with a substrate-embedded optical waveguide. Also disclosed is a method for forming the SOI chip structure. In the method, an optical waveguide is formed within a trench in a bulk substrate prior to a wafer bonding process that results in the SOI structure. Subsequently, front-end-of-the-line (FEOL) processing can be performed to form additional optical devices and/or electronic devices in and/or above the silicon layer. By embedding an optical waveguide within the substrate prior to wafer bonding as opposed to forming it during FEOL processing, strict limitations on the dimensions of the core layer of the optical waveguide are avoided. The core layer of the substrate-embedded optical waveguide can be relatively large such that the cut-off wavelength can be relatively long. Thus, such a substrate-embedded optical waveguide brings different functionality to the SOI chip structure as compared to FEOL optical waveguides.

An optical waveguide apparatus including a first dispersion unit and a separation unit. The first dispersion unit is connected to the separation unit, the first dispersion unit is configured to disperse a frequency component of at least one first optical signal, and the separation unit is configured to separate, into at least one second optical signal based on configuration information, the frequency component that is of the at least one first optical signal and that is dispersed by the first dispersion unit. The separation unit is implemented by a variable optical waveguide, and the variable optical waveguide is an optical waveguide that implements at least one of the following functions based on the configuration information: forming an optical waveguide, eliminating an optical waveguide, and changing a shape of an optical waveguide.

A device includes a module comprising an arrayed waveguide grating (AWG), and a filter having a filter input port, a filter output port, and a filter COMM output port. The filter is operable such that a first range of wavelengths entering the filter at the filter input port is directed to the filter output port and a second range of wavelengths entering the filter at the filter input port is directed to the COMM output port. The AWG includes an AWG input port optically coupled to the filter output port to receive the first range of wavelengths, and a plurality of AWG output ports.

A multirail-encoded qubit can be implemented using a quantum system having a state space that includes a number M of distinct modes, where M is an integer greater than 2. The M modes are logically partitioned into two disjoint subsets (or “bands”), with each mode assigned to exactly one of the bands. The multirail encoding is defined such that a state in which any one of the modes in the first band is occupied and all modes in the second band are unoccupied maps to a logical 0 state of the qubit, and a state in which any one of the modes in the second band is occupied and all modes of the first band are unoccupied maps to a logical 1 state. Systems and methods for generating, measuring, and operating on multirail-encoded qubits are disclosed.