G02B6/3652

Fiber optic circuit and preparation method

A method of preparing a preformed fiber optic circuit for later termination to at least one fiber optic connector includes providing a substrate for supporting a plurality of optical fibers, the substrate including at least one layer of flexible foil, wherein the flexible foil may be formed from polyethylene terephthalate (PET) according to one example and peeling a layer including at least the optical fibers from the at least one layer of flexible foil.

Optical Coupling
20230084003 · 2023-03-16 ·

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

SUPPORT SYSTEM AND APPARATUS FOR RAPID ASSEMBLY OF COMPONENTS AND INFRASTRUCTURES WITH INTEGRATED ELECTRONICS, POWER AND OTHER INSTRUMENTALITIES
20230070138 · 2023-03-09 · ·

A system of interlocking blocks and rods or tubes for rapid assembly of component infrastructures, where one or more of those components have electronics, power or other instrumentalities built into the component during manufacture, such as by 3-D printing, and the components thereof and methods therefor. The rods or tubes, blocks (for interlocking the rods/tubes) and through-holes allow not only structural stability but interconnectivity of electricity, power or other functionalities. The methodology of the present invention provides a paradigm for modeling more costly and complicated systems. Also, product packaging for products made pursuant to the present invention is scaled so as to be usable in the application of the parts.

PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTIONS OF FIBERS TO ON-CHIP OPTICAL COMPONENTS
20230130467 · 2023-04-27 ·

A photonic integrated circuit (PIC) die are provided. The PIC die includes a set of optical connect grooves including a first groove aligning a core of a first optical fiber positioned with a first optical component in a first layer at a first vertical depth in a plurality of layers of a body of the die, and a second groove aligning a core of a second optical fiber positioned therein with a second optical component in a second, different layer at a second different vertical depth in the plurality of layers. The grooves may also have end faces at different lateral depths from an edge of the body of the PIC die. Any number of the first and second grooves can be used to communicate an optical signal to any number of layers at different vertical and/or lateral depths within the body of the PIC die.

Photonic system and method for its manufacture

A photonic system includes a first photonic circuit having a first face and a second photonic circuit having a second face. The first photonic circuit comprises first wave guides, and, for each first wave guide, a second wave guide covering the first wave guide, the second wave guides being in contact with the first face and placed between the first face and the second face, the first wave guides being located on the side of the first face opposite the second wave guides. The second photonic circuit comprises, for each second wave guide, a third wave guide covering the second wave guide. The first photonic circuit comprises first positioning devices projecting from the first face and the second photonic circuit comprises second positioning devices projecting from the second face, at least one of the first positioning devices abutting one of the second positioning devices in a first direction.

METALLIZED OPTICAL FIBER ARRAY MODULE AND FABRICATION METHOD THEREOF
20230123751 · 2023-04-20 ·

An optical fiber array module that can accommodate variations in diameters of the optical fibers in the fiber array within anticipated tolerance, to accurately and securely retain the optical fibers in grooves in the module without using any solder interface or epoxy interface between the optical fibers and the supporting components. The fiber array module of the present invention relies on elasto-plastic interfaces for mechanical deformation, as opposed to solder reflow or epoxy curing, to accommodate variations in diameters of the optical fibers in the fiber array as supported in grooves between a substrate and a cover.

Optical assembly with cassette

An optical assembly includes a hermaphroditic cassette comprising a hood that includes a narrower section and a wider section. The narrower and wider sections are separated by slots such that the narrower section fits at least partially within a wider section of an identical mating hood of a mating optical assembly and the wider section receives a narrower section of the mating hood. The hood has first and second stop features configured to engage with second and first stop features of the mating hood. The first stop feature comprises a mating end of the narrower section of the hood and the second stop feature comprises a stop surface disposed within the wider section of the hood. Engagement of the stop features of the hood with stop features of the mating hood is configured to stop relative translational movement of the hood and the mating hood along the mating axis during mating.

OPTICAL FIBER SUPPORT STRUCTURE
20230161110 · 2023-05-25 ·

An optical fiber support structure for an optical fiber includes a substrate having a groove configured to receive the optical fiber and running lengthwise generally parallel to the optical fiber and at least two projections from the substrate and into the groove, each of said at least two projections including a surface to receive the optical fiber. The optical fiber support structures may also be included in a fiber optic ferrule. There may also be a plurality of optical fiber openings included with the fiber optic ferrule.

ALIGNMENT OF PHOTONIC SYSTEM COMPONENTS USING A REFERENCE SURFACE
20230114532 · 2023-04-13 · ·

Systems and method for aligning components of photonic systems are provided. An optical component for integration into and optical coupling within a photonic system is created by separating the component from a substrate to form a precisely defined surface on the optical component, the surface being precisely spaced from an optical feature of the component to be optically coupled within the photonic system. The precisely defined surface of the optical component is then pressed against a reference surface to position the optical feature in a predefined position and/or orientation for optical coupling of the optical feature within the photonic system. Passive precise alignment and optical coupling is thus provided without the need for iterative readjustment, multi-axis feedback, or active feedback.

OPTICAL FIBER ARRANGEMENT METHOD, OPTICAL FIBER FUSION SPLICING METHOD, METHOD FOR MANUFACTURING OPTICAL FIBER RIBBON WITH CONNECTOR, AND INTERMITTENTLY CONNECTED OPTICAL FIBER RIBBON

An optical fiber arrangement method includes: preparing an intermittently connected optical fiber ribbon including optical fibers arranged side by side at a first pitch larger than a fiber diameter; holding a non-connecting region of the optical fiber ribbon with a holder, where connecting portions intermittently connect the optical fibers extending out from the holder to each other; changing a width of the optical fiber ribbon in an interior of the holder; and arranging the optical fibers, extending out from the holder, with intervals of the optical fibers changed from the first pitch to a second pitch smaller than the first pitch by removing the connecting portions in a state where the holder is holding the optical fibers.