Aspects and techniques of the present disclosure relate to an apparatus for providing 200 micron, or smaller, coated optical fibers with a 250 micrometer pitch diameter in preparation for insertion into a Multi-fiber Push On connector (MPO) and/or splicing apparatus. The apparatus can sort, arrange, and clamp optical fibers into a proper sequence to allow the coated optical fibers to be aligned for processing, for example, connectorization and/or splicing. The apparatus includes a separator element that defines grooves for receiving and sequencing coated optical fibers with respect to each other to set a uniform pitch diameter.

The present disclosure provides an optical fiber to silicon photonics circuit (PIC) assembly method utilizing a structured fiber retaining apparatus for fiber confinement in which polymer filling volume for adhesion and refractive index matching purpose is reduced. Reduction of polymer volume result in smaller optical alignment change due to polymer material volume changes upon moisture absorption and aging, hence improving assembly reliability. In an embodiment, the assembly method and apparatus, transparent polymer material interfaces between fiber and edged coupler volume reduce more than 50% compares to conventional assembly method.

An integrated optical device includes: a mounting base; an optical semiconductor device which is provided on a surface of the mounting base; a substrate; and an optical waveguide which is provided on a surface of the substrate, wherein an incident surface of the optical waveguide is disposed to face an emission surface of the optical semiconductor device, wherein light emitted from the optical semiconductor device is able to be incident to the optical waveguide, wherein the optical semiconductor device is connected to the mounting base through a metal layer, wherein the mounting base is connected to the substrate through the other metal layer, and wherein a mounting base bottom surface on the side opposite to a surface of the mounting base and a substrate bottom surface on the side opposite to a surface of the substrate are provided on the substantially same plane.

An opto-mechanical coupler and corresponding method of manufacture are provided. The coupler may include a body defining a bottom surface, a receiving surface, and a reflective surface. The reflective surface may redirect optical signals between a first direction and a second direction. The receiving surface may position one or more optical fibers along the second direction such that an optical signal from the plurality of optoelectronic transceivers may be directed into the one or more optical fibers or an optical signal received from the one or more optical fibers may be directed into the plurality of the optoelectronic transceivers. The receiving surface may also define grooves to locate each optical fiber at a height relative to a first optical path in the second direction.

Embodiments disclosed herein include an optical fiber. In an embodiment, the optical fiber comprises a core and a cladding around the core. In an embodiment, a first rod is within the cladding and adjacent to the core. In an embodiment, the first rod comprises a magnetic material. In an embodiment, the optical fiber further comprises a second rod within the cladding and adjacent to the core, where the first rod and the second rod are on opposite sides of the core.

The present disclosure relates to a fiber optic assembly including a flexible substrate and a plurality of optical fibers having affixed segments bonded to the flexible substrate along fiber routing paths. The optical fibers having first ends positioned at route termination locations corresponding to optical connection locations. The fiber optic assembly also includes a planar lightguide circuit chip having lightguides optically connected to second ends of the optical fibers including a silicon substrate and a core layer supported by the silicon substrate. Optical signal paths are defined that extend continuously from the first ends of the optical fibers through the second ends of the optical fibers to the lightguides without any optical fiber splices being located along the optical signal paths. The optical device also includes a spring mounted to the planar lightguide circuit chip for biasing the optical fiber into the alignment groove.

Embodiments herein include an optical system that passively aligns a fiber array connector (FAC) to a waveguide in a photonic chip. A substrate of the FAC is machined or etched to include multiple grooves along a common axis or plane to hold optical waveguides, or more specifically, the fibers of the optical cables in the FAC. To align the fibers to the photonic chip, one of the fibers is disposed in an alignment trench which has a width that is substantially the same as the diameter of the fiber. When the fiber registers with the alignment trench, the fiber is aligned with a waveguide disposed at the end of the trench. Because the pitch between the fibers can be precisely controlled, aligning one of the fibers using the alignment trench results in the other fibers becoming passively aligned to respective waveguides in the photonic chip.

A bend inducing fiber array unit is provided comprising first and second anti-recovery plates and a V-groove chip. Opposing lateral anti-recovery plates are arranged on opposite sides of the first and second anti-recovery plates. Lateral edges on a common side of the anti-recovery plates are secured to a common face of one of the opposing lateral anti-recovery plates to fix the first and second anti-recovery plates relative to each other. A guided portion of the array of optical fibers is positioned in the fiber accommodating grooves of the V-groove chip and the V-groove chip is secured to the second anti-recovery plate such that the fiber accommodating grooves and a fiber guiding face of the first anti-recovery plate are fixed at a relative angle θ approximating the bend in the array of optical fibers.

An optoelectronic structure includes a substrate, an electronic die and a photonic die. The electronic die is disposed on the substrate and includes a first surface, wherein the first surface is configured to support an optical component. The photonic die is disposed on the first surface of the electronic die and has an active surface toward the first surface of the electronic die and a side surface facing the optical component.

A light coupling element including a groove and a light redirecting member is described. The groove is for receiving and aligning an optical waveguide and incudes an open front end and a back end. The light redirecting member includes an input side for receiving light from an optical waveguide received and supported in the groove and a light redirecting side for changing a direction of light received from the input side. The groove may include a bottom surface extending between the front and back ends of the groove and including a raised bottom surface portion raised upwardly relative to an unraised bottom surface portion. The unraised bottom surface portion of the bottom surface may be disposed between the raised bottom surface portion of the bottom surface and the input side of the light redirecting member. Optical coupling assemblies including the light coupling element and an optical waveguide are described.