In the technical field of optical communication a multi-path wavelength division multiplexing light receiving component including a substrate placed at the bottom of a housing is provided. The housing and substrate form an installation chamber, and include a light emitting unit, a light de-multiplexing unit, a reflector and a light receiving unit. The light emission unit, the light de-multiplexing unit, the reflector, and the light receiving unit are located inside the installation cavity, and the light emission unit, the light de-multiplexing unit, and the reflector are fixed on the housing, and the light receiving unit is fixed on the substrate. An optical module includes the multiplex wavelength division multiplexing optical receiving component. The length of the light receiving unit is shortened by reflecting an optical signal decomposed by a light de-multiplexing unit, and disposing the light receiving unit integrally below a reflector.

A cell site includes a tower, a multi-service terminal mounted to the tower and a base transceiver station in communication with the multi-service terminal. The multi-service terminal includes a housing and a plurality of adapters mounted to the housing. Each of the adapters includes an outer port accessible from outside the housing and an inner port accessible from inside the housing.

An optical package for providing efficient coupling between a distributed feedback laser diode (DFB-LD) and a silicon photonic integrated-circuit chip (Si PIC) edge couplers with low return loss, as well as variations thereof, is described. The optical package may include a DFB-LD, a Si PIC, a single mode fiber or fiber array assembly, a lens and a spacer. The Si PIC may include an input edge coupler and an output edge coupler. The single mode fiber or fiber array assembly may be aligned to the output edge coupler. The lens may be disposed between the DFB-LD and the input edge coupler, and may be configured to minimize a mismatch between an output spot size of the DFB-LD and a spot size of the input edge coupler of the Si PIC. The spacer may be bonded to a facet of the input edge coupler with an index matching fluid.

A transmitter optical sub-assembly, includes a prism body, a first lens, and a plug-in. The prism body includes a light inlet end and a light outlet end, the first lens is disposed between the light outlet end and the plug-in, and the plug-in includes a contact end. The contact end is located on a surface that is of the plug-in and that is away from the first lens, a center of the contact end is located on a focus on an optical path of the first lens, and the contact end is arc-shaped for a purpose of a gapless interconnection with an optical fiber, to reduce end face reflection of the contact end. An optical transceiver assembly includes the transmitter optical sub-assembly, and has comparatively small reflection and a comparatively small return loss of an optical fiber end face.

An optical assembly includes a combination of laser sources emitting radiation, focused by a combination of lenses into optical waveguides. The optical waveguide and the laser source are permanently attached to a common carrier, while at least one of the lenses is attached to a holder that is an integral part of the carrier, but is free to move initially. Micromechanical techniques are used to adjust the position of the lens and holder, and then fix the holder it into place permanently using integrated heaters with solder.

An optical multiplexer and methods of making and calibrating the same are disclosed. A method of aligning components in a multichannel optical/optoelectronic transmitter includes passively fixing a plurality of light emitters in place on a substrate; adjusting positions of a first lens passing light from a first light emitter and an optical signal transmission medium receiving the light from the first light emitter until a far field spot of the light from the first light emitter is at or near an end of the transmission medium; fixing one or more optical subassemblies on the substrate; and adjusting positions of the optical subassembly(ies) to align light from the remaining light emitters with the far field spot. Some embodiments include multiple optical subassemblies, each including a lens and a filter. Other embodiments include one optical subassembly including a mirror and a beam combiner.

An optical component assembly includes a light-guiding member; a cylindrical member which retains the light-guiding member in a through hole thereof; and a projection which is provided at one end of the cylindrical member so as to extend beyond an outer periphery of the cylindrical member, and is engageable in a groove which is formed in a cylindrical shell so as to extend in an axial direction of the cylindrical shell and then turn at a distal end thereof in a circumferential direction of the cylindrical shell. By fixing the cylindrical shell to the projection, the cylindrical shell becomes attachable and detachable. It is possible to provide an optical receptacle and a transceiver module for optical communications having easy removal of foreign matters.

A photodetector according to an embodiment includes: a semiconductor substrate including a first region and a second region adjacent to the first region; at least one light detection cell including a first semiconductor layer disposed in the first region, a second semiconductor layer disposed between the first semiconductor layer and the semiconductor substrate and including a junction portion with the first semiconductor layer, a third semiconductor layer disposed in the semiconductor substrate separately from the second semiconductor layer, a first electrode on the semiconductor substrate and applying a voltage to the first semiconductor layer, and a second electrode on the semiconductor substrate and applying a voltage to the third semiconductor layer; and a light guide disposed in the second region and guiding incident light to be propagated in a first direction to the junction portion between the first semiconductor layer and the second semiconductor layer.

Provided is a semiconductor light source element or an optical device including a semiconductor optical waveguide of a high-mesa semi-insulated embedded structure having a window structure made of the same material as an overclad layer at a light emission end, and a method for manufacturing thereof, in which an active layer at a portion of the window structure is removed, and then the same layer as the overclad layer is formed.

A multi-layer waveguide display includes a base waveguide layer, one or more grating couplers on one or two surfaces of the base waveguide layer, an overcoat layer on each grating coupler of the one or more grating couplers and filling grating grooves of the grating coupler, and a first waveguide layer stack on a first side of the base waveguide layer. The first waveguide layer stack includes one or more polymer layers. Each of the one or more polymer layers is characterized by a respective refractive index lower than the refractive index of the base waveguide layer. Each polymer layer is formed in a plurality of process cycles, where each process cycle includes dispensing a two-dimensional array of droplets of a resin material to form a thin layer and cross-linking the thin layer to form a sublayer of the polymer layer.