An optical module includes an interface electrically connected to an external device to receive a data signal to be transmitted, a signal processor configured to perform serialization and signal modulation on the received data signal, an optical transceiver configured to generate an optical transmission signal by receiving a direct current (DC) light source, in which a plurality of light sources having different wavelengths are multiplexed, from an optical power supply and performing optical modulation thereon through the serialized and modulated data signal, and an optical fiber connector configured to output the generated optical transmission signal to the external device and receive an optical reception signal from the external device.

An optical connector for a photonic circuit. The optical connector includes a first part, fixable to a photonic circuit, having at least one slab of optically transparent material, the at least one slab including a first lens. The optical connector includes a second part, movable between a connected position adjacent the first part and a disconnected position removed from the first part. The second part includes at least one slab of optically transparent material, the at least one slab including a second lens located to be in alignment with the first lens in the connected position. One or more guiding elements are arranged to direct light to the second lens. The second part is configured to connect the one or more guiding elements to an optical fiber.

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

A quantum communication system that includes a multiphoton entanglement generator, a plurality of photon detector units, and a plurality of optical fiber links. The plurality of photon detector units include a first photon detector unit and a second photon detector unit. The multiphoton entanglement generator is structurally configured to output more than two entangled photons. The plurality of optical fiber links comprise a first optical fiber link optically coupled to the multiphoton entanglement generator and disposed between the multiphoton entanglement generator and the first photon detector unit. The plurality of optical fiber links comprise a second optical fiber link optically coupled to the multiphoton entanglement generator and disposed between the multiphoton entanglement generator and the second photon detector unit. Further, at least one of the plurality of optical fiber links has a core, a cladding, and a scattering region having a plurality of scattering structures.

Some embodiments may include a packaged laser diode assembly, comprising: a length of optical fiber having a core and a cladding layer, the length of optical fiber having a first section and a second section, the first section of the length of optical fiber including a tip of an input end of the optical fiber; one or more laser diodes to generate laser light; one or more optical components to direct a beam derived from the laser light into the input end of the length of optical fiber; a clad light stripper on the second section of the length of optical fiber; wherein, in the first section of the length of optical fiber, the cladding layer includes: a light scattering feature at the tip of the input end of the optical fiber and/or a void along a length of the optical fiber.

A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.

Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include a PIC in a first layer including an insulating material, wherein the PIC is embedded in the insulating material with an active surface facing up; a conductive pillar in the first layer; an integrated circuit (IC) in a second layer on the first layer, wherein the second layer includes the insulating material and the IC is embedded in the insulating material, and wherein the IC is electrically coupled to the active surface of the PIC and the conductive pillar; an optical component optically coupled to the active surface of the PIC; and a hollow channel surrounding the optical component, the hollow channel extending from the active surface of the PIC through the insulating material in the second layer.

Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include a PIC in a first layer including an insulating material, wherein the PIC has an active surface and an opposing backside, and wherein the PIC is embedded in the insulating material with the active surface facing up; a conductive pillar in the first layer; an integrated circuit (IC) in a second layer, wherein the second layer is on the first layer and the second layer includes the insulating material, wherein the IC is embedded in the insulating material in the second layer, and wherein the IC is electrically coupled to the active surface of the PIC and the conductive pillar; and an optical component optically coupled to the active surface of the PIC and extending through the insulating material in the second layer.

An optoelectronic assembly is disclosed, comprising a substrate having a core comprised of glass, and a photonic integrated circuit (PIC) and an electronic IC (EIC) coupled to a first side of the substrate. The core comprises a waveguide with a first endpoint proximate to the first side and a second endpoint exposed on a second side of the substrate orthogonal to the first side. The first endpoint of the waveguide is on a third side of the core parallel to the first side of the substrate. The substrate further comprises an optical via aligned with the first endpoint, and the optical via extends between the first side and the third side. In various embodiments, the waveguide is of any shape that can be inscribed by a laser between the first endpoint and the second endpoint.

An optical semiconductor device includes a semiconductor light receiving element, a capacitor, and a carrier. The carrier has a mounting surface on which the semiconductor light receiving element and the capacitor are mounted. The optical semiconductor device includes a first conductive pattern including a first mounting area and a first bonding pad, a second conductive pattern including a second mounting area and a third mounting area, and a third conductive pattern including a second bonding pad. The first mounting area is connected to a first electrode of the semiconductor light receiving element. The second mounting area is connected to a second electrode of the semiconductor light receiving element. The third mounting area is connected to one electrode of the capacitor. The conductive patterns are separated from each other. The other electrode of the capacitor is electrically connected to the third conductive pattern via a wire.