There are provided an optical receptacle having an optical fiber including a first portion on another end surface side, a third portion on one end surface side, and a second portion between the first portion and the third portion; a core diameter at the first portion is smaller than the core diameter at the third portion; the core diameter at the second portion increases from the first portion side toward the third portion side; a first elastic member is provided between the optical fiber and an inner wall of a through-hole; a holder holds the another end surface side of a fiber stub; and the sleeve holds the one end surface side of the fiber stub.

An example optoelectronic module includes a housing that extends between a first end and an opposite second end. The optoelectronic module includes a printed circuit board (“PCB”) with an electrical connector at an end thereof, a transmitter electrically coupled to the PCB, a receiver electrically coupled to the PCB, and a receiving member including a plurality of ports each configured to receive a respective one of a plurality of fiber optic cables. In one aspect, the receiving member includes a plurality of deformable retaining members configured to be positioned in corresponding receptacles of the housing member in an arrangement structured to limit movement of the receiving member. In another aspect, the module also includes a plurality of fiber optic cable receptacles and a receptacle retaining member is positioned between the housing and the receptacles and limits movement of the receptacles in the housing.

An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface.

An optical fiber array module that can accommodate variations in diameters of the optical fibers in the fiber array within anticipated tolerance, to accurately and securely retain the optical fibers in grooves in the module without using any solder interface or epoxy interface between the optical fibers and the supporting components. The fiber array module of the present invention relies on elasto-plastic interfaces for mechanical deformation, as opposed to solder reflow or epoxy curing, to accommodate variations in diameters of the optical fibers in the fiber array as supported in grooves between a substrate and a cover.

The present disclosure provides an electronic module includes a light source configured to radiate a first light beam having a first wavelength and a converting device configured to receive the first light beam and to convert the first light beam to a second light beam having a second wavelength different from the first wavelength. The electronic module also includes a connection element configured to transmit the first light beam from the light source to the converting device and adapted to a predetermined geometric relationship between the light source and the converting device to meet a condition of total internal reflection.

A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured to transfer a plurality of optical communication signals. The MCF interconnect includes multiple fiber cores for routing the plurality of optical communication signals between the MCM and the panel. The MCF has a first end at which the multiple fiber cores are coupled to the MCM, and a second end at which the multiple fiber cores are connected to the optical-to-optical connector on the panel.

A silicon photonics based single wavelength 100 Gbit/s PAM4 DWDM transceiver in a pluggable form factor having a transmitter, said transmitter having: a DWDM laser source; a fiber array pigtail having a polarization maintaining fiber and an output single mode fiber; a silicon photonics modulator chip configured to optically connect to the DWDM laser source through the usage of the polarization maintaining fiber, a modulator driver chip connected to the silicon photonics modulator chip and an LC receptacle configured to optically connect to the silicon photonics modulator chip through the usage of the output single mode fiber. The disclosed transmitter may be further comprised of a reference loop within the silicon photonics modulator chip to allow for the utilization of a passive alignment approach for optically connected elements. The disclosed transceiver may be configured for use with C-band DWDM applications for utilization in applicable technologies, including 5G telecommunications.

A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.

The optical fibers disclosed have single mode and few mode optical transmission for VCSEL-based optical fiber transmission systems. The optical fibers have a cable cutoff wavelength λ.sub.C of equal to or below 1260 nm thereby defining single mode operation at wavelengths greater than 1260 nm and few-mode operation at wavelengths in a wavelength range from 800 nm and 1100 nm. The mode-field diameter is in the range from 8.0 microns to 10.1 microns at 1310 nm. The optical fibers have an overfilled bandwidth OFL BW of at least 1 GHz.Math.km at at least one wavelength in the wavelength range. The optical fibers have a single-step or two-step core and can have a trench refractive index profile. VCSEL based optical transmission systems and methods are disclosed that utilize both single core and multicore versions of the optical fiber.

A micro-optical connector holder with an integrated mating system for an optical assembly, typically on a modem PCBA. The integrated mating system is used to hold the micro-optical connectors together during assembly and to apply constant pressure keeping the connectors fully mated. The invention also uses a spring-pin mechanism to keep the holder lid and connectors in place without the use of screws or glue to make assembly easier. The integrated mating system allows the micro-optical connectors to be easily installed and uninstalled for manufacturing and testing purposes. The connector plugs and connector receptacles are aligned and secured by the integrated connector holder.