An optical assembly is provided. The optical assembly includes a light transmitting terminal, a light receiving terminal, an optical component located between the light transmitting terminal and the light receiving terminal, a collimating unit located between the optical component and the light transmitting terminal, and a focusing unit located between the optical component and the light receiving terminal. The collimating unit includes a first lens located between the optical component and the light transmitting terminal, and a field lens located between the first lens and the optical component and configured to absorb an alignment error between the light transmitting terminal and the first lens. The focusing unit includes a second lens located between the optical component and the light receiving terminal.

An optical device includes one or more optical fibers and a holder having a supporting block, a reflecting plate, and an intermediate layer. The supporting block has a first to a third end surfaces at one end. The first end surface extends from a bottom surface of the holder to claddings of the optical fibers. The second end surface extends along a first axis intersecting the first end surface. The third end surface is oblique with respect to the first axis at an angle greater than zero degrees and less than 90 degrees. The optical fibers extend in the supporting block and is exposed to the third end surface. The reflecting plate is provided on the third end surface via the intermediate layer. Light from the optical fiber passes through the third end surface which has some roughness, and is reflected by a surface of the reflecting plate.

A compact and highly efficient coupling structure for coupling between DFB-LD and Si PIC edge coupler with suppressed return loss may include a DFB-LD, a Si PIC comprising at least one input edge coupler and at least one output edge coupler, a silica cover lid disposed on the Si PIC and aligned edge to edge with the Si PIC, a single-mode fiber aligned to the at least one output edge coupler of the Si PIC, a lens disposed between the DFB-LD and the at least one input edge coupler of the Si PIC, and an isolator bonded to a facet of the at least one input edge coupler with a first volume of an index matching fluid. The lens may be configured to minimize a mismatch between an output spot size of the DFB-LD and a spot size of the at least one input edge coupler of the Si PIC.

An optical module comprising: an optical waveguide transports light, the optical waveguide including a first mirror which reflects first light; an adhesive sheet formed over the optical waveguide, the adhesive sheet including a first gap above the first mirror; a first light-transmissive layer formed in the first gap; a lens sheet arranged over the adhesive sheet, the lens sheet including a first lens which is formed above the first light-transmissive layer; and a light-emitting device formed above the lens sheet, the light-emitting device including a light-emitting portion which emits the first light to the first lens.

An optical subassembly (1) includes a photonic integrated circuit (2), an external optical system (4) and an optical interface (6) that is arranged between the PIC and the external optical system. The optical subassembly includes a third material (7) and a fourth material (8). The third material (7) at least partially fills the optical interface between the PIC and the external optical system in order to minimize contamination of any kind. The fourth material (8) being in contact at least with the third material for sealing at least the third material from ambient moisture. In this way a low-cost near-hermetic environmental protection barrier (7, 8) may be provided. An optical system (14) including the optical subassembly and a method of fabricating such an optical subassembly are also described.

An optical module that includes (a) an optical interface that includes an input surface and an output surface, and (b) a scintillator that has a flat surface. The scintillator is configured emit emitted light through the flat surface in response to an impingement of a charged particle on the scintillator. The flat surface is optically coupled to the input surface. The optical interface is configured to (i) receive the emitted light from the scintillator and (ii) output, via the output surface, output light. An optical interface refractive index substantially equals a scintillator refractive index.

Semiconductor package with one or more optical die(s) embedded therein is disclosed. The optical die(s) may have one or more overlying interconnect layers. Electrical contact to the optical die may be via the one or more overlying interconnect layers. An optical waveguide may be disposed next to the optical die and embedded within the semiconductor package. An optical fiber may be optically coupled to the optical waveguide.

The present disclosure generally relates to devices, which may be used in communication or optoelectronic modules for example, suitable for arrayed positioning of a plurality of fiber optical components. In one form, an optoelectronic module includes a printed circuit board (PCB) and at least one optical component array device including an array of laterally or radially spaced receptacles configured to receive an optical component. One or more of the receptacles includes a fused fiber optical component positioned therein. A recursive fiber may extend between an output of a first fused fiber optical component and an input of a second fused fiber optical component, and an optical fiber routing member may be coupled to the PCB and include a plurality of guides extending away from the PCB and defining a pathway for routing optical fibers relative to the PCB.

Examples herein relate to optoelectronic systems or modules. In particular, implementations herein relate to an optoelectronic module or system that includes a substrate having opposing first and second sides and an optoelectronic component having opposing first and second sides flip chip assembled to the substrate. The optoelectronic component is configured to emit at least one optical signal to the substrate, receive at least one optical signal from the substrate, or both. The optoelectronic system further includes an underfill exclusion structure configured to prevent underfill material dispensed between the optoelectronic component and the substrate from flowing into an optical area or path of the at least one optical signal transmitted between the optoelectronic component and the substrate. The underfill exclusion structure is spaced apart from at least one of the optoelectronic component or the substrate.

A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure for optically coupling a fiber includes a photonic die, an electronic die disposed on and electrically coupled to the photonic die, and an insulating layer disposed on the photonic die and extending along sidewalls of the electronic die. The photonic die includes a first portion and a second portion connected to the first portion, an optical device of the photonic die optically coupled to the fiber is within the first portion, and the second portion extends beyond lateral extents of the first portion.