The present disclosure discloses an optical module including a circuit board and a light-emitting assembly. In the light-emitting assembly, a wavelength tuning mechanism is formed of a semiconductor optical amplification chip, a silicon optical chip and a semiconductor refrigerator. The semiconductor optical amplification chip may provide a plurality of wavelengths, and a wavelength selection is carried out by an optical filter in the silicon optical chip; a temperature adjustment for the optical filter is achieved by the semiconductor refrigerator, so as to further adjust a performance of the filter for wavelength selection. The above device is provided in a housing to facilitate packaging of the devices.

Structures for a photonics chip, testing methods for a photonics chip, and methods of forming a structure for a photonics chip. A photonics chip includes a first waveguide, a second waveguide, an optical tap coupling the first waveguide to the second waveguide, and a photodetector coupled to the second waveguide. A laser is attached to the photonics chip. The laser is configured to generate laser light directed by the first waveguide to the optical tap.

This disclosure relates to the layout of optical components included in a photonics integrated circuit (PIC) and the routing of optical traces between the optical components. The optical components can include light sources, a detector array, and a combiner. The optical components can be located in different regions of a substrate of the PIC, where the regions may include one or more types of active optical components, but also may exclude other types of active optical components. The optical traces can include a first plurality of optical traces for routing signals between light sources and a detector array, where the first plurality of optical traces can be located in an outer region of the substrate. The optical traces can also include a second plurality of optical traces for routing signals between the light sources and a combiner, where the second plurality of optical traces can be located in regions between banks of the light sources.

A temperature compensation method for wavelength monitoring using spectrometers on photonic integrated chips and a related temperature-compensated wavelength monitoring device include an optical filter of the chip filters a source signal to provide at least one spectral reference line to a first spectrometer to detect thermal wavelength drifts thereof. At least one spectral line to be monitored is received by the same or another spectrometer of the chip to detect wavelength shifts thereof. The detected thermal drift of the reference line is compared to calibrated thermal drifts for the reference line which is associated with a calibrated thermal drift for the spectral response curve of the spectrometer receiving the spectral line to be monitored. A thermal drift rate for the response curve of the optical filter differs from a thermal drift rate for the response curve of the first spectrometer at least by an amount.

Provided is an optical communication device, such as a wavelength locker, a wavelength demultiplexer, an optical coupling system, and an optical switching system, using a small-sized lens element. An optical communication device includes, as a lens element, a liquid crystal diffractive lens element having an optically anisotropic layer that is formed using a composition containing a liquid crystal compound, and has a liquid crystal alignment pattern in which an orientation of an optical axis of the liquid crystal compound changes while continuously rotating toward one direction, in a radial shape from an inside toward an outside, and in the liquid crystal alignment pattern, in a case where a length over which the orientation of the optical axis rotates by 180° in one direction in which the optical axis changes is a single period, a length of the single period gradually decreases from the inside toward the outside.

A demultiplexer for use in a wavelength division multiplexed system. The demultiplexer comprises: an input waveguide, configured to receive a wavelength division multiplexed signal; a demultiplexing element, configured to demultiplex the multiplexed signal received from the input waveguide into a plurality of multi-mode demultiplexed signal components; a multi-mode output waveguide, the multi-mode output waveguide being coupled to the demultiplexing element and configured to receive one of the multi-mode demultiplexed signal components; and a splitter, coupled to the multi-mode output waveguide, and configured to split the received multi-mode demultiplexed signal component into two single-mode outputs.

An electro-optic combiner includes a polarization splitter and rotator (PSR) that directs a portion of incoming light having a first polarization through a first optical waveguide (OW). The PSR rotates a portion of the incoming light having a second polarization to the first polarization to provide polarization-rotated light. The PSR directs the polarization-rotated light through a second OW. Each of the first and second OW's has a respective combiner section. The first and second OW combiner sections extend parallel to each other and have opposite light propagation directions. A plurality of ring resonators is disposed between the combiner sections of the first and second OW's and within an evanescent optically coupling distance of both the first and second OW's. Each of ring resonators operates at a respective resonant wavelength to optically couple light from the combiner section of the first OW into the combiner section of the second OW.

The present disclosure provides a three-dimensional packaging method and a three-dimensional package structure of a photonic-electronic chip. The method includes: fixing an electronic chip on a first area of a first surface of a photonic chip; fixing a dummy chip on a second area of the first surface of the photonic chip, wherein the photonic chip is provided with an optical coupling interface at the second area, and the dummy chip has a cavity with a single-sided opening, and the opening of the cavity faces and covers an optical coupling interface.

An integrated circuit includes an electronic circuit. The integrated circuit further includes a photonic device. The photonic device includes a first photodetector (PD) electrically connected to the electronic circuit. The photonic device further includes a second PD electrically connected to the electronic circuit. The photonic device further includes a first waveguide configured to receive an optical signal input, wherein the first waveguide is optically connected to the first PD. The photonic device further includes a second waveguide optically connected to the second PD. The photonic device further includes a resonant structure between the first waveguide and the second waveguide, wherein the resonant structure is configured to optically couple the first waveguide to the second waveguide.

An optical time domain reflector structure and the optical assembly is disclosed in the present invention. The optical assembly comprise an optical time domain reflector structure, a light guiding module and an optical transceiver sub-module. By disposing the optical time domain reflector structure in the optical transceiver sub-module can reduce the overall space. The optical signals emitted from the light guiding module can be reflected back to the optical fiber by the disposing of the reflection filter of the optical time domain reflector structure. Due to the two different radius of curvature of the first reflection surface and the second reflection surface of the reflection filter, the required optical signal can be completely refocused to return to the optical fiber, so that the intensity loss of the optical signals can also be reduced.