Both a conventional receiver and an HDR-compatible receiver well perform electro-optical conversion processing on transmission video data obtained by using an HDR opto-electronic transfer characteristic. High dynamic range opto-electronic conversion is performed on high dynamic range video data to obtain the transmission video data. Encoding processing is performed on this transmission video data to obtain a video stream. A container of a predetermined format including this video stream is transmitted. Metadata information indicating a standard dynamic range opto-electronic transfer characteristic is inserted into a layer of the video stream, and metadata information indicating a high dynamic range opto-electronic transfer characteristic is inserted into at least one of the layer of the video stream and a layer of the container.

Provided herein are systems, devices, and methods for improved optical waveguide transmission and alignment in an analytical system. Waveguides in optical analytical systems can exhibit variable and increasing back reflection of single-wavelength illumination over time, thus limiting their effectiveness and reliability. The systems are also subject to optical interference under conditions that have been used to overcome the back reflection. Novel systems and approaches using broadband illumination light with multiple longitudinal modes have been developed to improve optical transmission and analysis in these systems. Novel systems and approaches for the alignment of a target waveguide device and an optical source are also disclosed.

A photonic integrated circuit (PIC) assembly that includes a PIC, and a light source mounted on a first carrier substrate, and optically coupled and aligned with the PIC. The first carrier substrate includes a wrap-around metal, that enables the first carrier substrate to be bonded electrically with the PIC using solder bumps, and wherein the wrap-around metal enables the first carrier substrate to be electrically controlled by an external device for facilitating alignment and optical coupling process with the PIC.

An optical waveguide alignment method includes a step of covering an end portion of an optical fiber, an end portion of a PLC, and a microlens with an adhesive before curing in a state in which at least one microlens is disposed between incidence and emission end faces of end portions of the optical fiber and the PLC, a step of causing light for alignment to be incident on at least one of the optical fiber or the PLC so that light enters a portion covered with the adhesive between the optical fiber and the PLC, and a step of curing the adhesive after the microlens moves onto an optical path between the optical fiber and the PLC due to radiation pressure of light. The optical fiber and the PLC are optically connected via the adhesive and the microlens, and the optical fiber, the PLC, and the microlens are mechanically connected by the adhesive.

A system can direct light into an optical fiber. Imaging optics can form an image of an end of an optical fiber. An actuatable optical element can be configured to define an optical path that extends to the actuatable optical element and further extends to the end of the optical fiber. A processor can determine a location in the image of a specified feature in the image. The processor can cause, based on the location of the specified feature in the image, the actuatable optical element to actuate to align the optical path to a core of the optical fiber. A light source can direct a light beam along the optical path to couple into the core of the optical fiber.

A receptacle for transceiver optical sub-assembly is configured for optical elements such as a light-emitting unit, a light guide unit, a light-receiving unit and a filter to connect thereto. The receptacle includes a lower receptacle body having a through bore, to which the light-emitting unit is connected; and an upper receptacle body having an axial receiving bore, to which the light guide unit is connected. The upper and the lower receptacle body are movable relative to each other in the x-y plane. The lower receptacle body can be moved relative to the upper receptacle body until an optical signal emitted from the light-emitting unit is optically coupled and collimated with an optical fiber in the light guide unit, and then the upper and lower receptacle bodies are fixedly connected together.

Embodiments disclosed herein include an optical fiber. In an embodiment, the optical fiber comprises a core and a cladding around the core. In an embodiment, a first rod is within the cladding and adjacent to the core. In an embodiment, the first rod comprises a magnetic material. In an embodiment, the optical fiber further comprises a second rod within the cladding and adjacent to the core, where the first rod and the second rod are on opposite sides of the core.

A system and method are presented for coupling OAM optical beams to optical fibers. The system may include, for instance, an OAM beam generator, for receiving one or more of a plurality of input signals, and generating a different OAM mode signal for each input signal. The OAM beam generator may further be operative to adjust a location and/or an exit angle of the one or more OAM mode signals before sending the one or more OAM mode signals to a beam combiner that combines the one or more OAM mode signals into a combined mode OAM transmission. The system may further include a controller in communication with at least one crosstalk estimate sensor and the at least one OAM beam generator, the controller operative to optimize the crosstalk estimate by receiving the crosstalk estimate for one of the OAM mode signals, and sending control instructions instructing the OAM beam generator to adjust a location and/or an exit angle of the one or more OAM mode signals to reduce the crosstalk estimate.

Optical alignment of optical subassembly and optoelectronic device is achieved using an external source and an external receiver, passing optical signal through a passive waveguide in the optoelectronic device, via alignment reflective surface features provided on the optical subassembly. The optical subassembly is provided with a first alignment reflective surface directing alignment signal from the source to a grating coupler at the input of the waveguide, and a second alignment reflective surface directing to the receiver the alignment signal directed from a grating coupler at the output of the waveguide after the alignment signal has been transmitted from the input to the output through the waveguide. By adjusting the relative position between the optical subassembly and the optoelectronic device, and detecting the maximum optical power of the alignment signal reflected from the second alignment reflective surface, the position of best optical alignment of the optical subassembly and the optoelectronic device can be determined.

Embodiments herein describe optical assemblies that use a spacer element to attach and align a laser to a waveguide in a photonic chip. Once aligned, the laser can transfer optical signals into the photonic chip which can then perform an optical function such as modulation, filtering, amplification, and the like. In one embodiment, the spacer element is a separate part (e.g., a glass or semiconductor block) that is attached between the photonic chip and a submount on which the laser is mounted. The spacer establishes a separation distance between the photonic chip and the submount which in turn aligns the laser with the waveguide in the photonic chip. In another embodiment, rather than the spacer element being a separate part, the spacer element may be integrated into the submount.