Patent classifications
G02B6/422
TRANSMISSION APPARATUS, TRANSMISSION METHOD, RECEPTION APPARATUS, AND RECEPTION METHOD
Both a conventional receiver and an HDR-compatible receiver well perform electro-optical conversion processing on transmission video data obtained by using an HDR opto-electronic transfer characteristic. High dynamic range opto-electronic conversion is performed on high dynamic range video data to obtain the transmission video data. Encoding processing is performed on this transmission video data to obtain a video stream. A container of a predetermined format including this video stream is transmitted. Metadata information indicating a standard dynamic range opto-electronic transfer characteristic is inserted into a layer of the video stream, and metadata information indicating a high dynamic range opto-electronic transfer characteristic is inserted into at least one of the layer of the video stream and a layer of the container.
Optical Circuit and Optical Connection Structure
Optical alignment between an optical waveguide device and an optical connection part is realized easily and at low cost. An optical circuit in which optical waveguides to be connected to optical fibers are formed includes: an alignment optical waveguide configured to be opposed to, on an optical waveguide edge face to which an optical connection part having guide holes for insertion of core wires of the optical fibers is to be fixed, a guide hole into which an alignment optical fiber is to be inserted; and a light path changing member configured to change a path of light to a vertical direction with respect to the optical axis direction of the core of the alignment optical waveguide.
Optical subassembly structure
An optical subassembly structure for mode conversion by an active alignment of an optical fiber with a semiconductor optical waveguide includes a sub-mount for holding the optical subassembly structure, a semiconductor die mounting on the sub-mount, the semiconductor optical waveguide growing on the semiconductor die and a glass capillary subassembly actively aligned to the semiconductor optical waveguide.
LASER AND PHOTONIC CHIP INTEGRATION
Embodiments herein describe optical assemblies that use a spacer element to attach and align a laser to a waveguide in a photonic chip. Once aligned, the laser can transfer optical signals into the photonic chip which can then perform an optical function such as modulation, filtering, amplification, and the like. In one embodiment, the spacer element is a separate part (e.g., a glass or semiconductor block) that is attached between the photonic chip and a submount on which the laser is mounted. The spacer establishes a separation distance between the photonic chip and the submount which in turn aligns the laser with the waveguide in the photonic chip. In another embodiment, rather than the spacer element being a separate part, the spacer element may be integrated into the submount.
Laser and photonic chip integration
Embodiments herein describe optical assemblies that use a spacer element to attach and align a laser to a waveguide in a photonic chip. Once aligned, the laser can transfer optical signals into the photonic chip which can then perform an optical function such as modulation, filtering, amplification, and the like. In one embodiment, the spacer element is a separate part (e.g., a glass or semiconductor block) that is attached between the photonic chip and a submount on which the laser is mounted. The spacer establishes a separation distance between the photonic chip and the submount which in turn aligns the laser with the waveguide in the photonic chip. In another embodiment, rather than the spacer element being a separate part, the spacer element may be integrated into the submount.
Lateral mounting of optoelectronic chips on organic substrate
A chip packaging structure that includes an optoelectronic (OE) chip mounted on a first surface of a substrate and whose optically active area is directed laterally; and a lens array for the optoelectronic (OE) chip that is mounted on the first surface of the substrate and faces to the optoelectronic (OE) chip, wherein the lens array has inside a reflector reflecting light from a first direction to a second direction, in which the first direction is substantially perpendicular to the second direction.
Systems, devices, and methods for improved optical waveguide transmission and alignment
Provided herein are systems, devices, and methods for improved optical waveguide transmission and alignment in an analytical system. Waveguides in optical analytical systems can exhibit variable and increasing back reflection of single-wavelength illumination over time, thus limiting their effectiveness and reliability. The systems are also subject to optical interference under conditions that have been used to overcome the back reflection. Novel systems and approaches using broadband illumination light with multiple longitudinal modes have been developed to improve optical transmission and analysis in these systems. Novel systems and approaches for the alignment of a target waveguide device and an optical source are also disclosed.
INTEGRATION OF AN ACTIVE COMPONENT ON A PHOTONICS PLATFORM
A photonics integrated circuit includes a photonics platform having a waveguide layer having a waveguide and a wiring substrate with an active component positioned thereon and extending therefrom. The active component has a component top surface facing away from the wiring substrate and component side surfaces through which radiation can be coupled. The photonics platform comprises a recess wherein the active component can be positioned such that the component top surface of the active component is positioned on a surface of the recess. The photonics platform and the active component are being configured for allowing lateral optical coupling between the waveguide in the photonics platform and at least one of the component side surfaces of the active component.
LASER AND PHOTONIC CHIP INTEGRATION
Embodiments herein describe optical assemblies that use a spacer element to attach and align a laser to a waveguide in a photonic chip. Once aligned, the laser can transfer optical signals into the photonic chip which can then perform an optical function such as modulation, filtering, amplification, and the like. In one embodiment, the spacer element is a separate part (e.g., a glass or semiconductor block) that is attached between the photonic chip and a submount on which the laser is mounted. The spacer establishes a separation distance between the photonic chip and the submount which in turn aligns the laser with the waveguide in the photonic chip. In another embodiment, rather than the spacer element being a separate part, the spacer element may be integrated into the submount.
Light guide body, optical module, and optical path and optical axis adjustment method
A light guide body for optical path and optical axis adjustment, the light guide body includes a silicon single crystal having an extinction ratio of 30 dB or more. The light guide body is a light guide body having one side surface alone joined and fixed to a base. An optical module including the light guide body installed at an installation angle adjusted for optical path and optical axis adjustment between components. An optical path and optical axis adjustment method including adjusting an installation angle of the light guide body to perform the optical path and optical axis adjustment between components. It is possible to provide the light guide body which does not adversely affect polarization characteristics and can easily perform the optical path and optical axis adjustment. It is possible to provide optical module and the optical path and optical axis adjustment method using such a light guide body.