The present invention relates to an optical sub-assembly for an optoelectronic module (M), designed to provide conversion of an electrical signal from a main electronic board into an optical signal or vice-versa. It comprises an alignment ring which allows the mechanical sub-assembly to be mechanically aligned and to be centered in a passive manner directly upon installation and hence the optical axis of the optoelectronic component to be readily aligned with the axis of the fiber optic ferrule and hence with the optical fiber extended by a complementary ferrule which is accommodated facing it in the holding cage.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

Disclosed embodiments relate to additive manufacturing systems. In some embodiments, an additive manufacturing system may include a plurality of laser energy sources, an optics assembly configured to direct laser energy onto a build surface, and an optical fiber connector positioned between the plurality of laser energy sources and the optics assembly. A first plurality of optical fibers may extend between the plurality of laser energy sources and the optical fiber connector, and a second plurality of optical fibers may extend between the optical fiber connector and the optics assembly. Each optical fiber of the first plurality of optical fibers may be coupled to a corresponding optical fiber of the second plurality of optical fibers within the optical fiber connector.

In an embodiment, an optoelectronic module includes a printed circuit board (PCB) and a lens block. The printed circuit board (PCB) includes at least one of an optical transmitting or receiving array. The lens block may be configured for directly coupling light between one of the optical transmitting or receiving array to optical fibers in an optical cable. A method may include directly coupling light between one of an optical transmitting or receiving array and a lens block, and further coupling the light through the lens block directly to an optical fiber of an optical cable externally coupled to the optoelectronic module.

Optical alignment of an optical connector to input/output couplers of a photonic integrated circuit can be achieved by first actively aligning the optical connector successively to two loopback alignment features formed in the photonic chip of the PIC, optically unconnected to the PIC, and then moving the optical connector, based on precise knowledge of the positions of the loopback alignment features relative to the input/output couplers of the PIC, to a position aligned with the input/output couplers of the PIC and locking it in place.

An optical connector includes a lens body including a lens portion, an optical conversion module, and a housing including an accommodation portion having a recessed portion, the optical conversion module combined with the lens body being fitted and assembled into the accommodation portion. The optical conversion module includes a light element disposed at a position facing the lens portion when combining the optical conversion module with the lens body. The housing includes a longitudinal support mechanism. The longitudinal support mechanism includes a reference surface and a pressing rib.

An optical connector includes a housing including an accommodating portion, a lens body including a lens portion and assembled to the accommodating portion, and an optical conversion module. The optical conversion module includes a light element disposed at a position facing the lens portion when combining the optical conversion module with the lens body, and is assembled to the accommodating portion together with the lens portion.

An optical connector holding one or more optical ferrule assembly is provided. The optical connector includes an outer body, an inner front body accommodating the one or more optical ferrule assembly, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four optical ferrule assembly are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight optical ferrule assembly are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A receptacle can hold one or more connector inner bodies forming a single boot for all the optical fibers of the inner bodies.

An illumination apparatus, which is to be connected to a light source apparatus that generates laser light and which is to be attached to an optical cable that guides the laser light, is provided. The illumination apparatus includes a light-emitting module which is to be attached to a tip portion of the optical cable. The light-emitting module receives the laser light emitted from the optical cable, converts the laser light into light having a different wavelength of a predetermined color, and emits the light. A heat dissipating lens case includes a lens and dissipates heat generated by the light-emitting module. The lens controls distribution of the light emitted by the light-emitting module. The heat dissipating lens case includes an attachment structure which allows the heat dissipating lens case to be removably attached to the light-emitting module.

An optical ferrule for transmitting and propagating light having a predetermined wavelength includes a polymeric ferrule body having a fiber alignment feature for receiving an optical fiber, a redirecting side for redirecting light, and an output side window for exiting light therethrough. A multilayer anti-reflection film is disposed on the output side window and includes at least two first layers including titanium oxide and at least two second layers including silicon dioxide. At least one of the two first layers is thinner than an optimum thickness that would minimize reflection at the predetermined wavelength. Heating the optical ferrule at a temperature of about 85 degrees centigrade for at least five hours results in no, or very little, damage to the multilayer anti-reflection film.