A method of arranging a network of optical fiber ends opposite a corresponding network of waveguide ends of a semiconductor wafer displaceable with respect to each other in orthogonal directions X and Y, the method including: arranging the fibers so that the network ends have the same orientation and that the projection of the axis of each fiber on the wafer is parallel to direction Y; injecting, into one of the fibers, a light beam having a wavelength such that light is scattered from the fiber walls, locating the fiber axis, and displacing the fibers or the wafer in direction X to align a characteristic point in line with the projection of the fiber axis on the wafer.

In some embodiments, an integrated photonic module contains, a silicon-on-insulator platform, an integrated photonic component, and an optical fiber. The silicon-on-insulator platform can contain a silicon-on-insulator photonic circuit, a co-fabricated spot size converter, and a co-fabricated micromachined trench structure. The co-fabricated micromachined trench structure can contain dimensions compatible with the optical fiber, and the optical fiber can be bonded to, and disposed at least partially within, the micromachined trench structure. The optical modes of the optical fiber, the integrated photonic component, the co-fabricated spot size converter, and the silicon-on-insulator photonic circuit can also be spatially aligned with one another.

An implantable medical device (1) is detailed that includes a housing (2) enclosing an electronic circuit and source of power, and an optical unit (3) sealingly coupled to the housing, the optical unit including monolithic block unit (4) made of a transparent ceramic material and comprising: a thin window (4w) defined by an inner surface and an outer surface, an outer mating structure (4om) for coupling a fibre optic to the monolithic block, and an inner mating structure (4im) for permanently coupling a light unit, and a light unit (5) rigidly mounted in the inner mating structure (4im) of the monolithic block unit. The light unit includes a light element including one or more of an inner light source (5L), and/or a photodetector (5d), the light element and a fibre optic engaged in the outer mating structure are in alignment with a corresponding reference point (4r) located on the thin window.

Passive alignment and connection between a fiber array and a plurality of optical waveguides terminating along an edge of a photonic IC (PIC) is provided by a controlled mating between alignment V-grooves formed in a fiber array support substrate and extra-array alignment ridges formed beyond the extent of a waveguide array integrated within the PIC. The height and width of the alignment ridges are formed to engage with the alignment V-grooves upon mating of the fiber array substrate with the PIC, providing passive alignment while maintaining a physical gap spacing g between the components (ensuring the integrity of the passive alignment).

An optical connector module (1) according to the present disclosure includes an optical waveguide board (10) and an optical connector (20) attached to the optical waveguide board (10). The optical connector (20) includes a positioning target portion (23) that engages with the optical waveguide board (10), and the optical connector (20) is positioned relative to the optical waveguide board (10) in a state in which the positioning target portion (23) is engaged with the optical waveguide board (10). The optical waveguide board (10) includes an optical waveguide (12) including a first cladding (122a) and a core (121) stacked on the first cladding (122a), the first cladding being stacked on a substrate (11) in a stacking direction perpendicular to the substrate (11), and a positioning core (14) that is stacked on the first cladding (122a) by using a material the same as a material of the core (121) and that engages with the positioning target portion (23). The positioning core (14) protrudes further than the core (121) toward a side opposite to the substrate (11) in the stacking direction.

An optical integrated circuit (IC) structure includes: a substrate including a fiber slot formed in an upper surface of the substrate and extending from an edge of the substrate, and an undercut formed in the upper surface and extending from the fiber slot; a semiconductor layer disposed on the substrate; a dielectric structure disposed on the semiconductor layer; an interconnect structure disposed in the dielectric structure; a plurality of vents that extend through a coupling region of the dielectric structure and expose the undercut; a fiber cavity that extends through the coupling region of dielectric structure and exposes the fiber slot; and a barrier ring disposed in the dielectric structure, the barrier ring surrounding the interconnect structure and routed around the perimeter of the coupling region.

Disclosed embodiments relate to additive manufacturing systems. In some embodiments, an additive manufacturing system may include a plurality of laser energy sources, an optics assembly configured to direct laser energy onto a build surface, and an optical fiber connector positioned between the plurality of laser energy sources and the optics assembly. A first plurality of optical fibers may extend between the plurality of laser energy sources and the optical fiber connector, and a second plurality of optical fibers may extend between the optical fiber connector and the optics assembly. Each optical fiber of the first plurality of optical fibers may be coupled to a corresponding optical fiber of the second plurality of optical fibers within the optical fiber connector.

Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.

An optical connector holding two or more LC-type optical ferrules is provided. The optical connector includes an outer body, an inner front body accommodating the two or more LC-type optical ferrules, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four LC-type optical ferrules are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight LC-type optical ferrules are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A mating receptacle (transceiver or adapter) includes a receptacle hook and a housing with an opening that accommodates the receptacle hook in a flexed position as the optical connector makes connection with the mating receptacle by introducing the receptacle hook into an optical receptacle hook recess.

An optical receptacle for receiving an optical connector is provided. The optical receptacle may be part of an optical transceiver or an optical adapter. The optical receptacle includes an optical receptacle outer housing wall. An optical receptacle hook opening is formed within the optical receptacle outer housing wall. A receptacle hook is received within the optical receptacle housing, the receptacle hook being configured to retain an optical connector within the optical receptacle. The optical receptacle hook opening is positioned to accommodate the receptacle hook in a flexed position when an optical connector in inserted into the optical receptacle.