A method of forming an integrated module forms a surface protrusion structure and a first electrical pad on a first semiconductor substrate and forms a surface indentation structure and a second electrical pad on a second semiconductor substrate. The first semiconductor substrate is disposed over the second semiconductor substrate by substantially matching the protrusion structure to the indentation structure. The first electrical pad is aligned to the second electrical pad to form bonding between the first semiconductor substrate and the second semiconductor substrate.

A method of configuring an optical cable comprising a plurality of optical fibers. The method includes cleaving with a laser beam a first end of an optical fiber at a first end of the optical cable. The laser beam has an intensity distribution adapted to cause a burst of light to be generated during cleaving of the optical fiber and the laser beam is adapted to cause at least some of the burst of light to be received into the first end of the optical fiber, for propagation within the optical fiber. Light output from a second end of the optical cable is detected, and the optical fiber from which the light was output is determined. Finally, the optical fiber at the second end of the optical cable from which the light was output is correlated with the optical fiber that was cleaved.

A method for manufacturing an optical module is disclosed. The method includes providing an optical coupling member and an optical device, arranging the optical coupling member and the optical device to face each other, and adjusting a position of at least one of the optical coupling member and the optical device. The optical coupling member includes a main body and a first electrode provided on a first face of the main body. The main body at least partially includes a transparent portion to visible light. The optical device includes a surface, a second electrode, and an optical region. The second electrode and the optical region are provided on the surface. The position is adjusted so that a positional relation between the first face and the surface is within a predetermined range, while recognizing at least part of the first face and the surface through the transparent portion from a second face opposite to the first face.

A structure includes an integrated circuit chip in a substrate, and an I/O opening extending inwardly from an edge of the integrated circuit chip. A dielectric moisture barrier includes a first portion extending along a side of the I/O opening, a second portion extending along the edge of the integrated circuit chip, and a third portion coupling the first moisture barrier portion to the second moisture barrier portion to complete the moisture barrier between the edge of the integrated circuit chip and the I/O opening. The third portion is distanced from the corner of the integrated circuit chip where the I/O opening meets the edge of the chip to prevent damage to the moisture barrier from fabrication processes, such as chip dicing, chip handling or other processes. Various crack stop configurations are also provided to further protect the moisture barrier from damage.

Provided are an optical transmission module including: a mold body having a first surface and a second surface opposite to the first surface; edge-type light emitting elements, each of which is molded inside the mold body by fitting same to the first surface so as to match with the first surface and generates an optical signal in an edge direction of a chip; and an optical component disposed on one side of the edge-type light emitting elements and molded inside the mold body, the optical component includes, on one side thereof, a plurality of input waveguides corresponding to the edge-type light emitting elements, and optically processes or transmits the plurality of optical signals incident through the plurality of input waveguides, and an optical axis of each of the light emitting elements and an optical axis of each of the input waveguides of the optical component is optically aligned.

An ophthalmic illumination apparatus can include a movable support. The apparatus can also include an optical array coupled to the movable support and positioned to interact with a light beam from a light source. The optical array can include first and second optical elements. The first optical element can be configured to reflect and transmit first associated amounts of the light beam. The second optical element can be configured to reflect and transmit second associated amounts of the light beam different than the first optical element. The apparatus can further include a drive mechanism coupled to the movable support. The drive mechanism can be configured to cause the movable support to selectively move the optical array such that the light beam is selectively incident upon one of the first optical element or the second optical element. Associated devices, systems, and methods are also provided.

An optical connector holding two or more LC-type optical ferrules is provided. The optical connector includes an outer body, an inner front body accommodating the two or more LC-type optical ferrules, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four LC-type optical ferrules are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight LC-type optical ferrules are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A mating receptacle (transceiver or adapter) includes a receptacle hook and a housing with an opening that accommodates the receptacle hook in a flexed position as the optical connector makes connection with the mating receptacle by introducing the receptacle hook into an optical receptacle hook recess.

An optical receptacle for receiving an optical connector is provided. The optical receptacle may be part of an optical transceiver or an optical adapter. The optical receptacle includes an optical receptacle outer housing wall. An optical receptacle hook opening is formed within the optical receptacle outer housing wall. A receptacle hook is received within the optical receptacle housing, the receptacle hook being configured to retain an optical connector within the optical receptacle. The optical receptacle hook opening is positioned to accommodate the receptacle hook in a flexed position when an optical connector in inserted into the optical receptacle.

An arrangement for improving adhesive attachment of micro-components in an assembly utilizes a plurality of parallel-disposed slots formed in the top surface of the substrate used to support the micro-components. The slots are used to control the flow and shape of an adhesive dot so as to quickly and accurately attach a micro-component to the surface of a substrate. The slots are formed (preferably, etched) in the surface of the substrate in a manner that lends itself to reproducible accuracy from one substrate to another. Other slots (channels) may be formed in conjunction with the bonding slots so that extraneous adhesive material will flow into these channels and not spread into unwanted areas.

A method to manufacture optoelectronic modules comprises a step of providing a first wafer comprising a plurality of first module portions, wherein each of the first module portions comprises at least one passive optical component, providing a second wafer comprising a plurality of second module portions, wherein each of the second module portions comprises at least one optoelectronic component. The wafers are disposed on each other to provide a wafer stack that is diced into individual optoelectronic modules respectively comprising one of the first and the second and the third module portions.