An optical module includes: a substrate and a waveguide element having a mount face opposed to the substrate, the waveguide element having an interference waveguide portion having an optical interference function. Further, the mount face includes a projection region to which the interference waveguide portion is projected on the mount face and a non-projection region, and the waveguide element is joined to the substrate with a joint material in the non-projection region.

Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.

A multi-channel transmitter optical subassembly (TOSA) with an off-center fiber in an optical coupling is disclosed, and can provide passive compensation for beam displacement introduced by optical isolators. The optical coupling receptacle can include an optical isolator configured to receive a focused light beam from a focus lens within the TOSA. The optical coupling receptacle may be offset such that a center line of the focused light beam entering the optical isolator is offset from a center line of a fiber within optical coupling receptacle. Thus the optical isolator receives the focused light beam from the focus lens and introduces beam displacement such that an optical signal is launched generally along a center line of the fiber. Thus the expected beam displacement introduced by the optical isolator is eliminated or otherwise mitigated by the offset between a center line of the fiber and a center position of the focus lens.

The invention relates to an optical fiber signal direct guided optical module which comprises a connector, a control circuit board and a plastic optical fiber. The control circuit board is connected to the connector and is provided with a functional optical module. The plastic optical fiber is provided with an optical fiber end face corresponding to the functional optical module. The distance L between the end face of the optical fiber and the top face of the functional optical module is in range Of 50 ?m to 150 ?m. Optical signals emitted by the end face of the optical fiber can be directly received by the functional optical module, and optical signals emitted by the functional optical module can also directly penetrate through the end face of the optical fiber to be received by the plastic optical fiber.

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a photonic integrated circuit (PIC) having a first surface having a channel and a first magnetic material; a fiber connector including a second surface with a second magnetic material; and a fiber physically coupled to the second surface of the fiber connector by an adhesive material; wherein the first surface of the PIC is coupled to the second surface of the fiber connector by the first and second magnetic materials with the fiber positioned in the channel.

An optical connector module (1) according to the present disclosure includes an optical waveguide board (10) and an optical connector (20) attached to the optical waveguide board (10). The optical connector (20) includes a positioning target portion (23) that engages with the optical waveguide board (10), and the optical connector (20) is positioned relative to the optical waveguide board (10) in a state in which the positioning target portion (23) is engaged with the optical waveguide board (10). The optical waveguide board (10) includes an optical waveguide (12) including a first cladding (122a) and a core (121) stacked on the first cladding (122a), the first cladding being stacked on a substrate (11) in a stacking direction perpendicular to the substrate (11), and a positioning core (14) that is stacked on the first cladding (122a) by using a material the same as a material of the core (121) and that engages with the positioning target portion (23). The positioning core (14) protrudes further than the core (121) toward a side opposite to the substrate (11) in the stacking direction.

An optical module includes: a substrate and a waveguide element having a mount face opposed to the substrate, the waveguide element having an interference waveguide portion having an optical interference function. Further, the mount face includes a projection region to which the interference waveguide portion is projected on the mount face and a non-projection region, and the waveguide element is joined to the substrate with a joint material in the non-projection region.

A method to manufacture optoelectronic modules comprises a step of providing a first wafer comprising a plurality of first module portions, wherein each of the first module portions comprises at least one passive optical component, providing a second wafer comprising a plurality of second module portions, wherein each of the second module portions comprises at least one optoelectronic component. The wafers are disposed on each other to provide a wafer stack that is diced into individual optoelectronic modules respectively comprising one of the first and the second and the third module portions.

A method of arranging a network of optical fiber ends opposite a corresponding network of waveguide ends of a semiconductor wafer displaceable with respect to each other in orthogonal directions X and Y, the method including: arranging the fibers so that the network ends have the same orientation and that the projection of the axis of each fiber on the wafer is parallel to direction Y; injecting, into one of the fibers, a light beam having a wavelength such that light is scattered from the fiber walls, locating the fiber axis, and displacing the fibers or the wafer in direction X to align a characteristic point in line with the projection of the fiber axis on the wafer.

In an embodiment, an optoelectronic module includes a printed circuit board (PCB) and a lens block. The printed circuit board (PCB) includes at least one of an optical transmitting or receiving array. The lens block may be configured for directly coupling light between one of the optical transmitting or receiving array to optical fibers in an optical cable. A method may include directly coupling light between one of an optical transmitting or receiving array and a lens block, and further coupling the light through the lens block directly to an optical fiber of an optical cable externally coupled to the optoelectronic module.