The invention relates to an optical fiber mounted photonic integrated circuit device, wherein the tolerance for positioning in terms of the coupling between the single mode optical fibers and the optical waveguides provided on the photonic integrated circuit device is increased. An optical waveguide core group is provided in such a manner where a plurality of optical waveguide cores having a portion that is tapered in the direction of the width within a plane are aligned parallel to each other at intervals that allow for mutual directional coupling and that are narrower than the width of the core of the single mode optical fiber, and the inclined connection end surface of the single mode optical fiber and the upper surface of an end portion of the optical waveguide cores face each other for coupling.

Lens assemblies including a substrate and a plurality of mechanically isolated lenses coupled to the substrate are disclosed. The substrate may have a low coefficient of thermal expansion. Optical connectors including the lens assemblies described herein, as well as methods of fabricating a lens assembly, are also disclosed. In one embodiment, a lens assembly includes a substrate having a first surface, and a lens layer including a plurality of lenses. A coefficient of thermal expansion of the substrate is different from a coefficient of thermal expansion of the plurality of lenses. The lens layer is coupled to the first surface of the substrate, and each lens of the plurality of lenses is mechanically isolated from adjacent lenses of the plurality of lenses by gap regions within the lens layer.

A process for preparing a subassembly, the process comprising (a) defining the location of one or more grooves for receiving at least one polymer waveguide in a wafer, (b) etching the grooves into the wafer, each groove having sidewalls and a first facet at the terminal end perpendicular to the side walls, the first facet having a first angle relative to the top planar surface, (c) coating the first facet with a reflective material, and (d) disposing a fluid polymer waveguide precursor into each groove, and writing a core into the polymer material by directing at least one laser beam on the first facet by directing the laser beam into the top of the polymer material such that the beam reflects off of the first facet and down the interior of the polymer material to form the core in the polymer waveguide.

Numerous examples are disclosed of a fiber optic cable coupling assembly and components thereof. In one example, a fiber optic cable coupling assembly comprises a coupling board containing a plurality of lasers and a plurality of photodiodes; and a mechanical-optical interface comprising a first plurality of ferrules and a plurality of lasers, where each laser in the plurality of lasers is aligned with a ferrule in the first plurality of ferrules; and a second plurality of ferrules and a plurality of photodiodes, wherein each photodiode in the plurality of photodiodes is aligned with a ferrule in the second plurality of ferrules.

A laser apparatus comprises a laser outputting laser light at an output location in a mean propagation direction, a surgical laser light application fiber having a fiber axis and a light entry cross section, and a device for connecting the fiber to the laser. The device comprises laser and fiber ports connecting the laser and the fiber to the device, and focusing optics arranged between the laser and fiber ports and coupling a part of the laser light output by the laser at the output location through the light entry cross section into the fiber. The focusing optics focus the laser light with a full convergence angle of not more than 2 onto the light entry cross section; and the focusing optics couple the laser light at an angle between the mean propagation direction and the fiber axis in a range from 2 to 10 into the fiber.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

An assembly of electronic components providing means for reception of data using an optical fibre wherein said assembly comprises: a photodiode; an amplifier coupled to said photodiode a printed circuit board, said photodiode and amplifier physically mounted on a first side of said printed circuit board; and a stiffener attached to said printed circuit board, wherein said stiffener is attached in a region approximately concentric with said region of said printed circuit board whereon said photodiode and amplifier are mounted, and conducting bond wires configured to directly couple said amplifier and said photodiode to conducting traces on a second opposite side of said printed circuit board with respect to said amplifier and said photodiode; and a fibre alignment ferrule and lens cap assembly, wherein said fibre alignment ferrule and lens cap assembly comprises: a ferrule which is configured to configured to provide a receptacle with defined physical alignment for an optical fibre; a lens which is configured to focus light from said optical fibre on to said photodiode; a cover region configured to provide an hermetic seal for said amplifier and said photodiode, wherein said fibre alignment ferrule and lens cap assembly is configured to be physically attached to said printed circuit board so as to provide an hermetic seal for said photodiode and amplifier and to further align said lens within said fibre alignment ferrule and lens cap assembly so as to focus light from said optical fibre onto said photodiode.

A connector for use in coupling an optical signal between an optical fiber in an optical plug mounted to a bottom of a silicon photonics (SiPh) chip is provided. The connector comprises: a curved mirror; and a tilted flat mirror; wherein at least one of the curved mirror and the tilted flat mirror is formed on a hardened stamped imprint material that was deposited on the SiPh chip at least in a cavity thereof.

The substrate of an integrated circuit component comprises a cutout that extends fully or partially through the substrate. An edge of a photonic integrated circuit (PIC) in the integrated circuit component is coplanar with a wall of the cutout or extends into the cutout. An optical fiber in an FAU is aligned with a waveguide within the PIC and the FAU is attached to the PIC edge and an attachment block. The attachment block provides an increased attachment surface area for the FAU. A portion of the FAU extends into the substrate cutout. A stress relief mechanism can secure the fiber optic cable attached to the FAU to the substrate to at least partially isolate the FAU-PIC attachment from external mechanical forces applied to the optical fiber cable. The integrated circuit component can be attached to a socket that comprises a socket cutout into which an FAU can extend.

A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.