An optoelectronic device and a method for assembling an optoelectronic device are provided which obviate the need for providing additional structural elements only for aligning purposes, thus reducing the costs and effort for manufacturing the optoelectronic device. An optoelectronic substrate is mounted on a mounting surface of a mounting substrate; a coupling region of the optoelectronic device faces a reflection element. A fiber endpiece is arranged at a mounting distance from the mounting surface, the mounting distance being larger than a distance of the coupling region from the mounting surface. The mounting surface is exposed and free of any further substrates, layers or structures for mechanically connecting or contacting the optical fiber. A fiber portion which is arranged at a distance from the fiber endpiece contacts a glue droplet arranged on or above the mounting surface of the mounting substrate.

Disclosed are optical ports and devices using the optical ports. The optical port includes a mounting body having a first pocket and at least one mounting surface for securing the optical port, one or more optical elements, and a first alignment feature disposed in the pocket, wherein the alignment feature includes a piston that is translatable during mating. The one or more optical elements may be an integral portion of the mounting body or a discrete lens. In other embodiments, the mounting body may include a plurality of pockets and one of the pockets may include a magnet for securing a plug to the optical port. The optical port may optionally have a minimalist optical port footprint so that the complimentary mating optical plug engages a portion of the frame during mating.

Disclosed are optical ports and devices having a minimalist footprint. Specifically, the optical ports and devices have a footprint where the optical elements are exposed at a frame of the device. Additionally, a frame of the device provides a portion of the mating surface for engaging a complimentary optical plug during mating with the optical port on the device. This minimalist footprint advantageously allows for a smaller portion of the optical port to be exposed to the environment and subject to damage and/or wear. Further, the optical port provides a clean and sleek optical port on the device with a relatively small surface that may be cleaned or wiped by the user as necessary.

This optical module comprises a substrate, light-emitting elements, a ferrule, an optical receptacle, through-holes and an adhesive. The optical receptacle includes two support units, and an optical receptacle body that has a first optical surface and a second optical surface. The through-holes include two first through-holes surrounded by the leading ends of the support units and the ferrule, and two second through-holes which are surrounded by the optical receptacle body, the support units and the ferrule. Thus, even using the adhesive to fix the optical receptacle and the ferrule to the substrate, it is possible to optically connect multiple optical transmission bodies with multiple light-emitting elements or multiple light-receiving elements in a suitable manner.

The present invention relates to an illumination system comprising at least one light source and an optical light mixing rod. The illumination system comprises a rod holder holding the optical light mixing rod in a position, where the entrance surface of the optical light mixing rod is arranged above the emitting window of the light source. The optical light mixing rod is from in a flexible and solid transparent material and the rod holder is adapted to provide a pressure force to the optical light mixing rod and the pressure force is adapted to press the entrance surface of the optical light mixing rod and the emitting window of the light source together. The optical light mixing rod comprises a bulge the entrance surface and the pressure force presses the bulge flat against the emitting window of the light source.

A multi-channel transmitter optical subassembly (TOSA) with an off-center fiber in an optical coupling is disclosed, and can provide passive compensation for beam displacement introduced by optical isolators. The optical coupling receptacle can include an optical isolator configured to receive a focused light beam from a focus lens within the TOSA. The optical coupling receptacle may be offset such that a center line of the focused light beam entering the optical isolator is offset from a center line of a fiber within optical coupling receptacle. Thus the optical isolator receives the focused light beam from the focus lens and introduces beam displacement such that an optical signal is launched generally along a center line of the fiber. Thus the expected beam displacement introduced by the optical isolator is eliminated or otherwise mitigated by the offset between a center line of the fiber and a center position of the focus lens.

A fiber coupling device for coupling of at least one optical fiber is disclosed. The fiber coupling device comprises at least one opto-electronic and/or photonic chip comprising at least one opto-electronic and/or photonic integrated element capable of emitting and/or detecting electromagnetic radiation. The fiber coupling device is configured for coupling the at least one opto-electronic and/or photonic integrated element to at least one fiber end-piece of an optical fiber having a reflection surface and a convex exit and/or entrance surface. The fiber coupling device further comprises a fiber end-piece alignment substrate configured for locally contacting and thereby supporting at least one convex exit and/or entrance surface of at least one fiber end-piece in an aligned position relative to the at least one opto-electronic and/or photonic integrated element.

A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.

A method for optically and mechanically coupling an optical fiber to an optical or optoelectronic component on a substrate is provided. The method comprises: providing an optical fiber comprising a core and a cladding, the core being exposed at an end face of the optical fiber; forming a polymer waveguide core on the end face, the polymer waveguide core extending from the fiber core; bringing the polymer waveguide core in proximity of the optical or optoelectronic component; providing a liquid optical material, the liquid optical material embedding the polymer waveguide core; and curing the liquid optical material, thereby forming a polymer cladding layer encapsulating the polymer waveguide core and mechanically attaching the optical fiber to the optical or optoelectronic component.

A first photonic integrated circuit (PIC) comprises a first optical element optically coupled to a first coupling region at an edge of the first PIC. A second PIC is formed in part from a multilayer structure comprising a bottom layer, a top layer comprising a first material with a first index of refraction, and a middle layer comprising a second material with a second lower index of refraction and having a first thickness between the bottom and top layers. The second PIC comprises a plurality of vertical alignment pedestals comprising a portion of the middle layer having the first thickness and attached to at least a portion of the bottom layer, a plurality of thinned regions, and a second optical element optically coupled to a second coupling region at an edge of the second PIC. Two or more of the vertical alignment pedestals are adhered to the first PIC.