An optical circuit board of the present disclosure includes a wiring board and an optical waveguide. The wiring board includes a mounting region for an optical component on an upper surface of the wiring board. The optical waveguide is located in a region adjacent to the mounting region, and includes, over the upper surface of the wiring board, a lower cladding layer, a plurality of cores extending in a first direction, and an upper cladding layer in this order, and is provided with alignment marks on the lower cladding layer. The lower cladding layer includes a first region in which the plurality of cores are located, and two second regions located facing the first region across a groove at positions between which the plurality of cores are sandwiched. The optical waveguide includes a first surface facing the mounting region, and end surfaces of the plurality of cores are exposed thereon.

The present disclosure relates to packaging techniques in connection with packaging electrical and optical components within circuit packages. For example, one or more examples described herein involve techniques for packaging an electro-photonic circuit while preserving access to a grating coupler, which may involve using a sacrificial die in conjunction with a unique overmolding process.

An optical subassembly comprising: (a) an interposer having first and second opposing sides and defining an alignment aperture extending from said first opposing side to said second opposing side, said interposer defining traces having contacts; (b) a fiber having a first optical axis, said fiber being held such that first optical axis is positioned essentially orthogonal to said first and second opposing sides; (c) at least one optical component mounted to said second opposing side and being electrically connected to at least a portion of said contacts, said at least one optical component having a second optical axis coincident with said first optical axis; and (d) a circuit board configured to receive said interposer such that said interposer is essentially orthogonal to said circuit board and said first optical axis is essentially parallel to said circuit board, said circuit board being electrically connected to at least a portion of said contacts.

In some embodiments, a tubing assembly can include a coiled tubing and a fiber optic assembly disposed within a flow path of the coiled tubing. The fiber optic assembly can include at least one optical fiber in a coupled electro-optical package. The at least one optical fiber can be in intimate contact with an enclosure of the coupled electro-optical package. The fiber optic assembly can also include an insulation layer disposed about the enclosure. The fiber optic assembly can also include a layer of helically wound metal strands disposed about the insulation layer. The fiber optic assembly can also include an outer metal layer disposed about the layer of helically wound metal strands.

An optical device includes: a case; a sleeve attached to the case, the sleeve including a first through-hole penetrating between an inside and an outside of the case, and an inclined surface inclined with respect to a penetrating direction of the first through-hole, the inclined surface having an opening of the first through-hole; a first optical fiber including a core wire including a core and a clad, and a sheath configured to surround the core wire, wherein an exposed portion of the core wire not surrounded by the sheath passes through the first through-hole; and a first joining material interposed and sealed between an outer peripheral surface of the exposed portion and an inner peripheral surface of the first through-hole in the first through-hole.

The present disclosure relates to packaging techniques in connection with packaging electrical and optical components within circuit packages. For example, one or more examples described herein involve techniques for packaging an electro-photonic circuit while preserving access to a grating coupler, which may involve using a sacrificial die in conjunction with a unique overmolding process.

A packaging and assembly of a parallel optical link is disclosed. The packaging and assembly may have four major parts: assembly of the optical transceiver die, 2.5D package assembly, package attachment to a system printed circuit board, and optical coupling attachment. A frame and a removable lid may be attached to the optical transceiver die. The lid may protect the optical transceiver array of the optical transceiver die, and the frame may help in aligning optical coupling assembly with the optical transceiver array.

Disclosed embodiments relate to additive manufacturing systems. In some embodiments, an additive manufacturing system may include a plurality of laser energy sources, an optics assembly configured to direct laser energy onto a build surface, and an optical fiber connector positioned between the plurality of laser energy sources and the optics assembly. A first plurality of optical fibers may extend between the plurality of laser energy sources and the optical fiber connector, and a second plurality of optical fibers may extend between the optical fiber connector and the optics assembly. Each optical fiber of the first plurality of optical fibers may be coupled to a corresponding optical fiber of the second plurality of optical fibers within the optical fiber connector.

Structures and methods that provide and maintain precise lateral registration between mounted optical devices and waveguides formed on an optical interposer structure use a methodology in which a same patterned mask layer is utilized to pattern a plurality of alignment features requiring alignment and the waveguide cores to which mounted devices are aligned in the formation of photonic integrated circuits. Subsequent burial and re-exposure of the patterned mask layer in subsequent processing steps maintains the feature registration provided with the use of the self-aligned layer throughout the formation of the optical interposer and the alignment structures provided thereon.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.