An optical connector, a semiconductor assembly including the optical connector, a multi-chip package including the optical connector, and a method of making the optical connector. The optical connector includes: a first lid; and a second lid attached to the first lid to define a cavity therebetween. Individual ones of the first lid and the second lid include: a substrate having an inner surface facing the cavity, an outer surface opposite the inner surface, a first end and a second end, the first end to receive a corresponding waveguide therein; and a concave mirror on the substrate and having a reflective surface facing the cavity, wherein a straight linear optical axis is to extend between the reflective surface of the concave mirror and a photonic structure at an opposing one of said individual ones of the first lid and the second lid.

An optical connector module (1) according to the present disclosure includes an optical waveguide board (10) and an optical connector (20) attached to the optical waveguide board (10). The optical connector (20) includes a positioning target portion (23) that engages with the optical waveguide board (10), and the optical connector (20) is positioned relative to the optical waveguide board (10) in a state in which the positioning target portion (23) is engaged with the optical waveguide board (10). The optical waveguide board (10) includes an optical waveguide (12) including a first cladding (122a) and a core (121) stacked on the first cladding (122a), the first cladding being stacked on a substrate (11) in a stacking direction perpendicular to the substrate (11), and a positioning core (14) that is stacked on the first cladding (122a) by using a material the same as a material of the core (121) and that engages with the positioning target portion (23). The positioning core (14) protrudes further than the core (121) toward a side opposite to the substrate (11) in the stacking direction.

The optical chip includes a photonic integrated circuit PIC, a fastening substrate, a first lens array (450), and a second lens array. A first end of the fastening substrate is configured to detachably connect to the optical fiber connector, and a second end of the fastening substrate is connected to the photonic integrated circuit PIC. The optical chip includes at least one optical channel. Each of the at least one optical channel includes optical waveguides located on a surface of the photonic integrated circuit PIC, second lenses included in the second lens array, and first lenses included in the first lens array. Optical fibers of the optical fiber connector, the first lenses, the second lenses, and the optical waveguides are optically aligned in sequence.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

Techniques are provided for reducing crosstalk between bond wires coupling high frequency signals to multiple transducers in an integrated circuit (IC) chip. At least some of the techniques employ a bridge element configured to be bottom mounted to a printed circuit board next to a surface emitter chip. The bridge element may include: device contacts to each be bond wire connected to a respective anode contact of the surface emitter chip; board contacts to each be bond wire connected to a respective signal trace of the printed circuit board; and a signal path for each of the device contacts, the signal path connecting that device contact to a respective one of the board contacts without active amplification.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

The present disclosure relates to packaging techniques in connection with packaging electrical and optical components within circuit packages. For example, one or more examples described herein involve producing or manufacturing wafers having circuit packages formed thereon. Techniques described herein related to modifying a dimension of wafers in order that the wafers conform to a nominal dimension, such that the wafers may be implemented in connection with processing equipment that is specifically configured to operate on wafers of the nominal dimension.

To assemble a donor part to a receiver part, place the receiver part on a stage; provide at least one compliant elastomeric member associated with at least one of the stage and a vacuum element; and use the vacuum element to lift the donor part and assemble it to the receiver part on the stage. Misalignment of the receiver part and the donor part is tolerated by the at least one compliant elastomeric member.