A light-emitting row-type connection line assembly, which includes two connectors, a plurality of light-emitting lines, a plurality of connection lines and a plurality of light sources to make the plurality of light-emitting lines emit light. Each of the two connectors is provided with a plurality of ports for connecting the plurality of connection lines, and the plurality of ports are arranged spaced apart and in multiple rows. Each of the two connectors is provided with a light-emitting portion. The light-emitting portion is provided with a plurality of slots for connecting the plurality of light-emitting lines. The number of the plurality of slots is the same with that of ports in each row. A spacing between adjacent two slots is the same with that between adjacent two ports. The plurality of light-emitting lines are covered by a coating layer to form a light-emitting line row.

An optical connector holding one or more optical ferrule assembly is provided. The optical connector includes an outer body, an inner front body accommodating the one or more optical ferrule assembly, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four optical ferrule assembly are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight optical ferrule assembly are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A receptacle can hold one or more connector inner bodies forming a single boot for all the optical fibers of the inner bodies.

An optical connector holding one or more optical ferrule assembly is provided. The optical connector includes an outer body, an inner front body accommodating the one or more optical ferrule assembly, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four optical ferrule assembly are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight optical ferrule assembly are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint.

An optical element device includes an opto-electric hybrid board sequentially including an optical waveguide having a mirror, and an electric circuit board having a terminal in a thickness direction, and an optical element optically connected to the mirror and electrically connected to the terminal. The opto-electric hybrid board includes a mounting region including the mirror and the terminal when projected in the thickness direction and mounted with the optical element. Furthermore, the opto-electric hybrid board includes an alignment mark for aligning the optical element with respect to the mirror. The alignment mark is made of a material for forming the optical waveguide, and disposed at both outer sides of the mounting region in a width direction.

A light-emitting row-type connection line assembly, which includes two connectors, a plurality of light-emitting lines, a plurality of connection lines and a plurality of light sources to make the plurality of light-emitting lines emit light. Each of the two connectors is provided with a plurality of ports for connecting the plurality of connection lines, and the plurality of ports are arranged spaced apart and in multiple rows. Each of the two connectors is provided with a light-emitting portion. The light-emitting portion is provided with a plurality of slots for connecting the plurality of light-emitting lines. The number of the plurality of slots is the same with that of ports in each row. A spacing between adjacent two slots is the same with that between adjacent two ports. The plurality of light-emitting lines are covered by a coating layer to form a light-emitting line row.

An electro-optical module is provided in the form of a Ceramic Ball Grid Array (CBGA) optical package with a detachable fiber optic connector. The electro-optical module is surface mountable on a printed circuit boards (PCB) using standard electronics pick-and-place and reflow manufacturing technology. A module housing array of ultra-high-speed single mode fiber based optical transmit and/or receive devices provides for high density fiber interconnections and can be mounted directly on a PCB in close proximity to associated electronics. The resulting shorter electrical interconnects reduce losses and distortion of the high frequency electrical signals enabling lower power signals and lower error rates on the interfaces, for applications such as high-speed data center interconnects. Shorter electrical interconnects may also allow for simpler clock and data recovery circuits or, in some cases, complete elimination of some of these circuits.

An optoelectronic assembly may include a photonic integrated circuit (PIC) with a top surface and a laser with a top surface and a bottom surface. The optoelectronic assembly may also include a housing configured to cooperate with the PIC to one or both of house and support one or more components. The housing may include a PIC mount including a first surface to interface with the top surface of the PIC, and a laser mount including a second surface to interface with the top or bottom surface of the laser. The first surface and the second surface may be parallel to each other.

Optical interconnects can offer higher bandwidth, lower power, lower cost, and higher latency than electrical interconnects alone. The optical interconnect system enables both optical and electrical interconnection, leverages existing fabrication processes to facilitate package-level integration, and delivers high alignment tolerance and low coupling losses. The optical interconnect system provides connections between a photonics integrated chip (PIC) and a chip carrier and between the chip carrier and external circuitry. The system provides a single flip chip interconnection between external circuitry and a chip carrier using a ball grid array (BGA) infrastructure. The system uses graded index (GRIN) lenses and cross-taper waveguide couplers to optically couple components, delivers coupling losses of less than 0.5 dB with an alignment tolerance of ±1 μm, and accommodates a 2.5× higher bandwidth density.

An optical connector device includes a first optical connector that has a first housing that holds a ferrule; and a second optical connector that has a second housing that houses an FOT and a light guide member. The second housing includes a ferrule insertion portion. The ferrule insertion portion has a ferrule insertion hole into which the ferrule can be inserted. An inner peripheral surface of the ferrule insertion hole has a ferrule fixing structure that fixes the ferrule inside the ferrule insertion hole to suppress play of the ferrule inside the ferrule insertion hole.

An optical-electrical substrate for providing electrical and optical connections to a photonic integrated circuit (PIC) includes a glass body with glass optical waveguides along an upper surface, and electrically conductive vias extending through a portion of the glass body from an intermediate surface to a lower surface. The intermediate surface is arranged at an elevation positioned between the upper and lower surfaces, and may optionally support redistribution layers and an electrical integrated circuit. An optical-electrical substrate may be fabricated by defining glass optical waveguides along an upper surface of a glass body, and forming electrically conductive vias through the glass body from the intermediate surface to the lower surface. A connection method includes registering a PIC with an optical-electrical substrate as described herein; heating bonding bumps arranged between the PIC and the intermediate surface; and providing optically transmissive paths between the PIC and glass optical waveguides of the substrate.