A method according to one embodiment includes steps of: preparing an optical module and optical fiber holding member; attaching a clip member to a receptacle of the optical module and the optical fiber holding member; and pressing the receptacle of the optical module and the optical fiber holding member from below and pressing the clip member from above. The pressing step has pressing the first flat surface of the receptacle and the second flat surface of the optical fiber holding member at the third flat surface of the clip member, and which performed until the first flat surface of the receptacle and the second flat surface of the optical fiber holding member establish parallelism with the third flat surface of the clip member by using a jig that changes the parallelism of the pressing surface.

Disclosed are various embodiments for a multi-tip laser coupler with improved alignment guidance. A photonic integrated circuit (PIC) includes an input interface, an output interface, and a waveguide array. The waveguide array includes a first waveguide, a second waveguide, and a third waveguide. The first waveguide and the third waveguide are coupled to the input interface and are not coupled to the output interface. The second waveguide is coupled to the input interface and the output interface. Further, the second waveguide is positioned parallel to and between the first waveguide and a third waveguide. The second waveguide includes a tapered body such that an output end of the second waveguide coupled to the output interface is wider than an input end of the second waveguide coupled to the input interface.

Various embodiments include an electro-optical circuit with an optical transmission path comprising: an electro-optical assembly having an optical transmitter element and/or an optical receiver element mounted on a mounting surface of a carrier component; a circuit carrier with a mounting side and an embedded optical waveguide exposed with an end face in a cutout in the mounting side; and an optical interface between the electro-optical assembly and the optical waveguide. The optical transmitter element and/or the optical receiver element is mounted on the carrier component with an alignment of its respective optical axis parallel to the mounting surface. The optical assembly is mounted on the circuit carrier with the mounting surface facing toward the mounting side. The optical transmitter element and/or the optical receiver element projects into the cutout and forms an optical axis with the exposed optical waveguide.

An implantable medical device is detailed that includes a housing enclosing an electronic circuit and source of power, and an optical unit sealingly coupled to the housing, the optical unit including a monolithic block made of a transparent ceramic material and comprising: a thin window defined by an inner surface and an outer surface, an outer mating structure for coupling a fiber optic to the monolithic block, and an inner mating structure for permanently coupling a light unit, and a light unit rigidly mounted in the inner mating structure of the monolithic block. The light unit includes a light element including one or more of an inner light source, and/or a photodetector, the light element and a fiber optic engaged in the outer mating structure are in alignment with a corresponding reference point located on the thin window.

Optical interconnects can offer higher bandwidth, lower power, lower cost, and higher latency than electrical interconnects alone. The optical interconnect system enables both optical and electrical interconnection, leverages existing fabrication processes to facilitate package-level integration, and delivers high alignment tolerance and low coupling losses. The optical interconnect system provides connections between a photonics integrated chip (PIC) and a chip carrier and between the chip carrier and external circuitry. The system provides a single flip chip interconnection between external circuitry and a chip carrier using a ball grid array (BGA) infrastructure. The system uses graded index (GRIN) lenses and cross-taper waveguide couplers to optically couple components, delivers coupling losses of less than 0.5 dB with an alignment tolerance of ±1 μm, and accommodates a 2.5× higher bandwidth density.

A semiconductor module includes a photonic integrated circuit and a receptacle. The photonic integrated circuit includes a substrate, a waveguide disposed on the substrate, and a recess in the substrate and having a first width. The receptacle is bonded to a top surface of the substrate and aligning with the recess. The receptacle and the recess jointly form a cavity, and the receptacle has a second width greater than the first width. A method for manufacturing the semiconductor module is also disclosed.

An optical subassembly comprising: (a) an interposer having first and second opposing sides and defining at least one alignment aperture extending from said first opposing side to said second opposing side; (b) at least one fiber having a first optical axis disposed in said at least one alignment aperture; (c) at least one optical component mounted to said second opposing side having a second optical axis coincident with said first optical axis and defining an interface between said at least one optical component and said at least one optical component; and (d) a feedback component disposed on interposer within line-of-sight of said interface to receive at least a portion of uncoupled light emitted from said interface.

An optical connector holding one or more optical ferrule assembly is provided. The optical connector includes an outer body, an inner front body accommodating the one or more optical ferrule assembly, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four optical ferrule assembly are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight optical ferrule assembly are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A receptacle can hold one or more connector inner bodies forming a single boot for all the optical fibers of the inner bodies.

The present invention relates to an optical sub-assembly for an optoelectronic module (M), designed to provide conversion of an electrical signal from a main electronic board into an optical signal or vice-versa. It comprises an alignment ring which allows the mechanical sub-assembly to be mechanically aligned and to be centered in a passive manner directly upon installation and hence the optical axis of the optoelectronic component to be readily aligned with the axis of the fiber optic ferrule and hence with the optical fiber extended by a complementary ferrule which is accommodated facing it in the holding cage.

An optical module structure includes a substrate, an optical chip and an electrical chip that are fixedly coupled to the substrate. The optical module structure further includes an optical coupling structure fixedly coupled to the optical chip. A side of the optical chip that faces the substrate has a first reference plane, and at least one first alignment mark is provided on the first reference plane. The optical coupling structure has a second reference plane, and at least one second alignment mark is provided on the second reference plane. The first reference plane is aligned with the second reference plane, and the first alignment mark is aligned with the second alignment mark.