Conventional hybrid photonic integrated circuits (PIC) combine one type of semiconductor platform for the main PIC, and a different type of semiconductor platform for a secondary chip. Conventional mounting processes include forming a recess in the main PIC, and mating electrical connectors from the secondary chip and the main PIC within the recess. Mating the first and second electrical connectors in the recess increases the complexity of forming the main PIC, and hampers heat dissipation from secondary chip through oxide layers in the main PIC. Providing a conductive, e.g. redistribution, layer from the first electrode along the bottom and sides of the recess eliminates the complexity in forming the main PIC, and enables the first electrical connector to be mounted directly onto a more thermally conductive substrate material.

Provided is an optical communication module. The optical communication module includes: an optical device configured to provide an optical output from an electrical input; a circuit board on which the optical device is mounted and which is configured to provide the electrical input to the optical device; a temperature compensation element mounted on a side of the circuit board; and a mechanical switch connected to the temperature compensation element and configured to turn on/off according to ambient temperature for supplying or interrupting power to the temperature compensation element. The optical communication module includes the temperature compensation element configured to heat or cool the optical device according to ambient temperature, thereby maintaining proper modulation performance and optical power over a wide range of temperature in low-temperature and high-temperature environments.

An embodiment of the indention includes a passive, fiber optic, thermal insulator. The thermal insulator includes an inner sleeve defining a central access port. The thermal insulator includes an outer sleeve concentric to the inner sleeve. The inner sleeve and the outer sleeve are joined sufficient to define an annular void. The thermal insulator includes a first insulator located in the annular void. Optionally, the apparatus includes at least one optical fiber secured in the central access port.

Conventional hybrid photonic integrated circuits (PIC) combine one type of semiconductor platform for the main PIC, and a different type of semiconductor platform for a secondary chip. Conventional mounting processes include forming a recess in the main PIC, and mating electrical connectors from the secondary chip and the main PIC within the recess. Mating the first and second electrical connectors in the recess increases the complexity of forming the main PIC, and hampers heat dissipation from secondary chip through oxide layers in the main PIC. Providing a conductive, e.g. redistribution, layer from the first electrode along the bottom and sides of the recess eliminates the complexity in forming the main PIC, and enables the first electrical connector to be mounted directly onto a more thermally conductive substrate material.

A method of manufacturing an optical communication device includes preparing first and second pre-defined break lines in a carrier wafer. A first sub-mount is positioned near the first break line to accommodate an optical laser and a second sub-mount is positioned near the second break line to accommodate an optical modulator. The first sub-mount is secured to a thermally conductive and electrically nonconductive spacer which is secured to a thermo-electrical cooler that defines a gap between the first submount and the thermo-electrical cooler. A portion of the carrier wafer between the sub-mounts is removed.

An optical device includes a light-emitting element; an electronic circuit chip; a substrate on which the light-emitting element and the electronic circuit chip are mounted; a first electrode formed on a first mounting surface of the light-emitting element on the substrate; and a second electrode formed on a second mounting surface of the electronic circuit chip on the substrate.

The first electrode and the second electrode have the same structure.

A LED light apparatus includes a central beam module, a peripheral light module, a support housing and a cap. The central beam module has a beam lens for converting a first light to form a light beam. The peripheral light module has a light passing ring. The light passing ring surrounds the beam lens for converting a second light to form a peripheral light. The peripheral light has a lower intensity strength than the light beam. The support housing fixes the central beam module and the peripheral light module. The cap is fixed to the support housing for plugging in an external socket for getting an external power supply.

An optical integrated circuit (IC) structure includes: a substrate including a fiber slot formed in an upper surface of the substrate and extending from an edge of the substrate, and an undercut formed in the upper surface and extending from the fiber slot; a semiconductor layer disposed on the substrate; a dielectric structure disposed on the semiconductor layer; an interconnect structure disposed in the dielectric structure; a plurality of vents that extend through a coupling region of the dielectric structure and expose the undercut; a fiber cavity that extends through the coupling region of dielectric structure and exposes the fiber slot; and a barrier ring disposed in the dielectric structure, the barrier ring surrounding the interconnect structure and routed around the perimeter of the coupling region.

Methods and systems for joining photonic components. A method includes suspending nano-particles in a medium, wherein the nano-particles include metal nano-particles. The method further includes applying a layer of the nano-particle medium to a first substrate, and exposing the layer of nano-particle medium to a thermal process to remove at least a portion of the medium and expose the nano-particles. A second substrate is placed on the nano-particles in alignment with the first substrate, and a heat is applied to the nano-particles to cause connection of contact points between adjacent nano-particles to cause a secure alignment of the first and second substrates. The heat applied to the layer of nano-particles is less than 300 C.

A wavelength-selective optical reception device includes a photoreceptor (21) that converts optical signals (201) into electric signals and outputs the electric signals, a base (31) on which the photoreceptor (21) is provided, a housing (41) that is mounted on the base (31) and surrounds the photoreceptor (21) along with the base (31), and that is provided with a window (51) to pass optical signals (203) including the optical signals (201) and including optical signals (202) of a wavelength different from a first wavelength of the optical signals (201) and a window (52) to pass the optical signals (202), and an optical filter (61) that is disposed inside the housing between the window (51) and the photoreceptor (21) along the optical axis (205) of the optical signals (203), and that outputs, out of the optical signals (203) that enter thereto, the optical signals (201) toward the photoreceptor (21), and reflects the optical signals (202) toward a near side in a direction of travel of the optical signals (203).