An electronic device may include a photonic integrated circuit (PIC) coupled with a substrate. The PIC may communicate a photonic signal with one or more optical fibers. The PIC may process the photonic signal into an electronic signal. The electronic device may include an electronic integrated circuit (EIC) coupled with the substrate. The EIC may communicate with the PIC. The EIC may transmit the electronic signal to the PIC. The EIC may receive the electronic signal from the PIC. The electronic device may include a lens assembly. The lens assembly may include at least one gradient refractive index (GRIN) lens.

For optical communications between semiconductor ICs, optical transceiver assembly subsystems may be integrated with a processor. The optical transceiver assembly subsystems may be monolithically integrated with processor ICs or they may be provided in separate optical transceiver ICs coupled to or attached to the processor ICs.

The present disclosure relates to methods of assembling a lensed optical fiber array by printing in situ a lens onto each optical fiber of an optical fiber array with an ultrafast laser system where the lens can be shaped to the optical fiber end face to reduce pitch mismatch. In some embodiments, optical fiber(s) of the optical fiber array can be cleaved, and the lens can be shaped to the optical fiber end face to reduce pitch mismatch.

An optical receptacle includes first to third optical surfaces. The attenuation part includes a plurality of reflecting surfaces that reflects a part of the light entered from the first optical surface and a plurality of transmission surfaces that transmits another part of the light entered from the first optical surface. The reflecting surfaces and the transmission surfaces are alternately disposed in a first direction along an intersection line of the third optical surface and a plane including first and second optical axes, the first optical axis being an optical axis of light transmitted through the attenuation part, the second optical axis being an optical axis of light reflected by the attenuation part. In the third optical surface, the attenuation part is shorter than an irradiation spot at the third optical surface of the light entered from the first optical surface, in at least one direction.

In one example embodiment, an optoelectronic assembly includes an electronic substrate, a transparent component coupled on a first side of the electronic substrate, and a first component coupled to a second side of the electronic substrate opposite the first side. The electronic substrate, the transparent component, and the first component may define a hermetically sealed enclosure. A laser array or a receiver array may be mechanically coupled to the transparent component inside of the enclosure and oriented to transmit or receive optical signals through the transparent component. The laser array or the receiver array may be electrically coupled to the electronic substrate. A second component may be positioned between the first component and the transparent component in the hermetically sealed enclosure with a thermal interface material forming a first interface between the second component and the transparent component.

An optical module-member is provided, including: a layer-shaped optical waveguide; a light-emitting unit substrate including an insulating substrate, light-emitting element-mounting portions where light-emitting elements are configured to be mounted so as to be optically connected to the optical waveguide, and driving element-mounting portions which are electrically connected to the light-emitting element-mounting portions where driving elements for driving the light-emitting elements are configured to be mounted; and a light-receiving unit substrate which is separated from the light-emitting unit substrate, the light-receiving unit substrate including: an insulating substrate, light-receiving element-mounting portions where light-receiving elements are configured to be mounted so as to be optically connected to the optical waveguide, and signal amplification element-mounting portions which are electrically connected to the light-receiving element-mounting portions and where signal amplification elements for amplifying a signal from the light-receiving element are configured to be mounted.

Example implementations relate to mounting optoelectronic devices and wavelength-division multiplexing optical connectors. For example, an implementation includes a transparent interposer having an integrated plurality of lenses. A plurality of optoelectronic devices are mounted to a bottom surface of the transparent interposer, each of the optoelectronic devices being paired to a respective lens of the plurality of lenses. The bottom surface of the transparent interposer is mounted to a substrate within a region of an optical socket. The optical socket receives a filter-based wavelength-division multiplexing (WDM) optical connector. Each lens of the plurality of lenses is paired to a respective filter of the WDM optical connector when the WDM optical connector is mated to the optical socket.

Disclosed herein are configurations for fiber optic endoscopes employing fixed distal optics and multicore optical fiber.

An avionics unit for an avionics network is disclosed having a light emitter to provide a modulated broadband optical signal. The avionics unit also includes a first optical interface and a second optical interface. The first optical interface is optically connected to the light emitter and is to receive a removable wavelength selective filter to extract a modulated narrowband optical signal from the modulated broadband optical signal. The second optical interface is optically connected to the first optical interface and is to output the modulated narrowband optical signal.

A detector for determining a position of at least one object is provided. The detector includes an evaluation device adapted to select at least one reflection feature of a reflection image, wherein the evaluation device is configured for determining at least one longitudinal region of the selected reflection feature of the reflection image by evaluating a combined signal Q from the sensor signals, wherein the evaluation device is adapted to determine at least one displacement region in at least one reference image corresponding to the longitudinal region, wherein the evaluation device is adapted to match the selected reflection feature with at least one reference feature within the displacement region.