A micro device transfer tool and methods of operation are described. In an embodiment, the micro device transfer tool includes an articulating transfer head assembly capable of six degrees of motion. A miniatured camera assembly may be secured near the point of contact for the articulating transfer head assembly to aid in system alignment. In an embodiment, an encoder system is described for alignment of a micro pick up array and target substrate using complementary concentric grating patterns. In an embodiment a miniaturized position sensor design is described for sensing position of various system components during alignment or pick and place processes.

An example optoelectronic module includes a housing that extends between a first end and an opposite second end. The optoelectronic module includes a printed circuit board (“PCB”) with an electrical connector at an end thereof, a transmitter electrically coupled to the PCB, a receiver electrically coupled to the PCB, and a receiving member including a plurality of ports each configured to receive a respective one of a plurality of fiber optic cables. In one aspect, the receiving member includes a plurality of deformable retaining members configured to be positioned in corresponding receptacles of the housing member in an arrangement structured to limit movement of the receiving member. In another aspect, the module also includes a plurality of fiber optic cable receptacles and a receptacle retaining member is positioned between the housing and the receptacles and limits movement of the receptacles in the housing.

An optical port shielding and fastening apparatus is configured to be installed in the optical module. The optical module includes a housing assembly and an optical component located in the housing assembly. The optical port shielding and fastening apparatus includes a fastener and an electromagnetic wave absorbing piece. The fastener is fastened in the housing assembly. The electromagnetic wave absorbing piece is fastened on a side that is of the fastener and that faces an outside of the housing assembly. A first mounting hole and a second mounting hole are correspondingly provided on the fastener and the electromagnetic wave absorbing piece. The optical component passes through the first mounting hole and the second mounting hole in sequence. This application provides an optical port shielding and fastening apparatus, an optical module, and a communications device, to resolve poor optical port shielding performance of an optical module in the related technology.

A power and optical fiber interface system includes a housing having an interior. A cable inlet is configured to receive a hybrid cable having an electrical conductor and an optical fiber. An insulation displacement connector (IDC) is situated in the interior of the housing configured to electrically terminate the conductor, and a cable outlet is configured to receive an output cable that is connectable to the IDC and configured to output signals received via the optical fiber.

A light-emitting cable structure includes a light-emitting cable, a first circuit board, second circuit board, at least one light-emitting module and a covering casing. By placing a plurality of signal groups in the light-emitting cable below a plurality of optical fibers in the light-emitting cable for a certain distance and placing the signal groups outside the vertical projection of the optical fibers towards the signal groups, the light in the optical fibers is allowed to be emitted by the vertical projection, so that users can observe the light transmitted in the optical fibers from all sides of the light-emitting cable structure, which greatly increases the attractiveness of the product to consumers.

An optical module includes: a quantum photonic integrated circuit; a temperature controller; and a housing configured to house the photonic integrated circuit and the temperature controller. The photonic integrated circuit is attached to the temperature controller, such that the photonic integrated circuit is in thermal communication with the temperature controller, and the temperature controller is attached directly to the housing, such that the temperature controller is in direct thermal communication with the housing.

An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.

A wall plate is provided having a built-in modem on the backside of the wall plate that performs O/E, E/O and protocol conversions. The backside of the wall plate has an optical port for connecting an end of an optical fiber cable to the wall plate. A printed circuit board (PCB) disposed on the backside of the wall plate has electrical circuitry mounted thereon that performs protocol conversion and communicates with an optical transceiver module also mounted on the PCB. The optical transceiver module receives optical signals transmitted to the customer premises and transmits optical signals from the customer premises and performs O/E and E/O conversion. A front face of the wall plate has at least one socket therein for connection with an electrical connector disposed on an end of an electrical cable. The wall plate does not require a separate power supply.

An optical module includes a housing including an optical interface, a circuit board module disposed in the housing, a fiber optic receptacle module disposed in the housing and including a plurality of fiber optic receptacles, an optoelectronic chip disposed in the housing and electrically connected to the circuit board module, a position limiting card disposed behind the fiber optic receptacle module, and a plurality of through holes arranged at the optical interface. The plurality of fiber optic receptacles are installed at the optical interface and fit through the plurality of through holes, and the position limiting card is fixed to the housing and locks the fiber optic receptacle module tightly against the optical interface.

Apparatus comprising: a heat sink, the heat sink comprising: a body formed out of a heat-transmissive material; at least one channel extending through the body, the at least one channel having an inlet port and an outlet port; at least one opening extending through the body, the at least one opening being configured to receive an optical module therein; at least one securement element mounted to the body for releasably securing an optical module within the at least one opening; and at least one alignment element mounted to the body for ensuring appropriate alignment of an optical module received in the at least one opening.