In a transceiver module, when one end portion of a module board (18) is inserted and connected to a concave portion (16R) of a plug connector (16), a projection portion (16PP) formed on the periphery of the concave portion (16R) of the plug connector (16) is fitted into a notch portion (18PH) as one end surface of the module board (18) comes into contact with an inner peripheral surface that forms the concave portion (16R).

The disclosure provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the distance between the axis of the first optic fiber insertion port, and the axis of the second optic fiber insertion port is less than the distance between the first chip and the second chip; and the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.

A light-emitting cable structure includes a light-emitting cable, a first circuit board, second circuit board, at least one light-emitting module and a covering casing. By placing a plurality of signal groups in the light-emitting cable below a plurality of optical fibers in the light-emitting cable for a certain distance and placing the signal groups outside the vertical projection of the optical fibers towards the signal groups, the light in the optical fibers is allowed to be emitted by the vertical projection, so that users can observe the light transmitted in the optical fibers from all sides of the light-emitting cable structure, which greatly increases the attractiveness of the product to consumers.

The present disclosure generally relates to devices, which may be used in communication or optoelectronic modules for example, suitable for arrayed positioning of a plurality of fiber optical components. In one form, an optoelectronic module includes a printed circuit board (PCB) and at least one optical component array device including an array of laterally or radially spaced receptacles configured to receive an optical component. One or more of the receptacles includes a fused fiber optical component positioned therein. A recursive fiber may extend between an output of a first fused fiber optical component and an input of a second fused fiber optical component, and an optical fiber routing member may be coupled to the PCB and include a plurality of guides extending away from the PCB and defining a pathway for routing optical fibers relative to the PCB.

An optical module includes: a housing formed of a conductor that is insertable and removable with respect to an opening portion of an apparatus; a substrate arranged in an internal space of the housing; and a blocking unit that divides the internal space in which the substrate is arranged into two spaces. The blocking unit includes: a first conductor pattern formed on one surface of the substrate; a second conductor pattern formed on another surface of the substrate; a plurality of vias that penetrate through the substrate and connect the first conductor pattern and the second conductor pattern; a first auxiliary member formed of a conductor that comes into contact with the first conductor pattern and the housing; and a second auxiliary member formed of a conductor that comes into contact with the second conductor pattern and the housing.

There is provided an optical system comprising a light conduit. The light conduit comprises a first light pipe, a second light pipe, and a first bridge to mechanically couple the first light pipe to the second light pipe. The first light pipe has a first inlet to receive a first input light signal and a first outlet to emit at least a portion of the first input light signal to form a first output light signal. Moreover, the second light pipe has a second inlet to receive a second input light signal and a second outlet to emit at least a portion of the second input light signal to form a second output light signal. Furthermore, the first bridge has a first end mechanically coupled to the first light pipe and a second end mechanically coupled to the second light pipe.

An optical module includes: a housing formed of a conductor that is insertable and removable with respect to an opening portion of an apparatus; a substrate arranged in an internal space of the housing; and a blocking unit that divides the internal space in which the substrate is arranged into two spaces. The blocking unit includes: a first conductor pattern formed on one surface of the substrate; a second conductor pattern formed on another surface of the substrate; a plurality of vias that penetrate through the substrate and connect the first conductor pattern and the second conductor pattern; a first auxiliary member formed of a conductor that comes into contact with the first conductor pattern and the housing; and a second auxiliary member formed of a conductor that comes into contact with the second conductor pattern and the housing.

A power and optical fiber interface system includes a housing having an interior. A cable inlet is configured to receive a hybrid cable having an electrical conductor and an optical fiber. An insulation displacement connector (IDC) is situated in the interior of the housing configured to electrically terminate the conductor, and a cable outlet is configured to receive an output cable that is connectable to the IDC and configured to output signals received via the optical fiber.

Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, where the package substrate comprises a recessed edge. In an embodiment, a compute die is on the package substrate, and an optics die on the package substrate and overhanging the recessed edge of the package substrate. In an embodiment, an integrated heat spreader (IHS) is over the compute die and the optics die. In an embodiment, a lid covers the recess in the package substrate

Embodiments described herein may be related to apparatuses, processes, and techniques related to hydrophobic features to block or slow the spread of epoxy. These hydrophobic features are placed either on a die surface or on a substrate surface to control epoxy spread between the die in the substrate to prevent formation of fillets. Packages with these hydrophobic features may include a substrate, a die with a first side and a second side opposite the first side, the second side of the die physically coupled with a surface of the substrate, and a hydrophobic feature coupled with the second side of the die or the surface of the substrate to reduce a flow of epoxy on the substrate or die. In embodiments, these hydrophobic features may include a chemical barrier or a laser ablated area on the substrate or die. Other embodiments may be described and/or claimed.