Embodiments described herein may be related to apparatuses, processes, and techniques related to active optical couplers that provide optical coupling at or proximate to an edge of a silicon photonics package, to allow the package to optically couple with other devices or peripherals. In embodiments, the active optical coupler is optically coupled with a photonics IC (PIC) inside the photonics package, and provides an optical coupling mechanism for optical pathways outside the photonics package. The active optical coupler may include electrical circuitry and may be coupled to the package substrate to provide data related to the operation of the active optical coupler. Other embodiments may be described and/or claimed.

Aspects described herein include an apparatus comprising a substrate, an electronic integrated circuit (IC) disposed on the substrate, one or more optical ICs disposed on the substrate and communicatively coupled with the electronic IC, and a stiffener device attached to the substrate. The stiffener device comprises a stiffener ring that substantially circumscribes the one or more optical ICs. The stiffener device defines one or more features configured to receive a plurality of light-carrying media that optically couple with the one or more optical ICs and that extend to one or more lateral edges of the stiffener device.

An optical module includes: a quantum photonic integrated circuit; a temperature controller; and a housing configured to house the photonic integrated circuit and the temperature controller. The photonic integrated circuit is attached to the temperature controller, such that the photonic integrated circuit is in thermal communication with the temperature controller, and the temperature controller is attached directly to the housing, such that the temperature controller is in direct thermal communication with the housing.

A light receiving and emitting module includes a sub-mount platform, a photoelectrical conversion component, a lens and a base. The sub-mount platform is made of silicon-based material and has first and second contact surfaces. The photoelectrical conversion component is disposed on the first contact surface. The lens is disposed on the second contact surface. The sub-mount platform is disposed on one side of the base. The first contact surface and second contact surface have therebetween a height difference, such that the photoelectrical conversion component matches the center of the lens. Further provided is a light receiving and emitting device including the light receiving and emitting module, a printed circuit board and a plurality of conducting wires. The conducting wires are electrically connected to the photoelectrical conversion component and printed circuit board. The conducting wires are disposed on at least two sides of the light receiving and emitting module.

An OSFP optical transceiver having split multiple fiber optical port using reduced amount of MPO terminations is provided that includes two adjacent sockets integrated into the optical port of the OSFP optical transceiver. The two adjacent sockets are vertically oriented with respect to the mounting baseplate of the OSFP optical transceiver, and each of the two adjacent sockets is adapted to receive an MPO receptacle that terminates the proximal end of a bundle of fibers. The OSFP optical transceiver also includes an optical connection between each socket and a corresponding lens in the OSFP optical transceiver, for transmitting optical signals received from other transceivers into the OSFP optical transceiver and optical signals generated in the OSFP optical transceiver to other transceivers.

An optical module includes a light emitting assembly. The light emitting assembly includes a plurality of lasers, a plurality of wavelength division multiplexers and a lens group. The plurality of lasers emit a plurality of optical signals. The plurality of wavelength division multiplexers multiplex the plurality of optical signals into a plurality of composite optical signals. The lens group includes a first lens, a second lens, and a third lens. The second lens is configured to transmit a first part of the plurality of composite optical signals exited from the first lens, reflect a second part of the plurality of composite optical signals exited from the third lens to the first lens, and transmit the second part of the plurality of composite optical signals reflected by the first lens, so as to multiplex the plurality of composite optical signals into the merge composite optical signal.

An assembled electro-optical switch module includes a package substrate. Four optical socket members are disposed respectively to the package substrate. Each optical socket member includes four sockets closely packed in a row. Each socket has a recessed flat region with topside land grid array (LGA) interposer connected to bottom side solder bumps and a side notch opening aligned to an edge of the package substrate at the corresponding edge region. Sixteen optical modules in four sets are co-packaged in the package substrate. Each set has four optical modules respectively seated in the four sockets of each optical socket member with top side LGA interposer. Four clamp latch members are applied to clamp each of the four sets of optical modules in respective optical socket members. A data processor device with 51.2 Tbps data interface is disposed to the package substrate and electrically coupled to each of the sixteen optical modules.

A board mounting type connector includes a housing, a plurality of contact portions to be extending from the housing toward a circuit board, and a plurality of protrusions to be protruding from the housing toward the circuit board. The plurality of contact portions are aligned along a width direction at a first position in a fitting direction. The connector and a mating connector are to be fit each other in the fitting direction. The width direction intersects the fitting direction. The plurality of protrusions are aligned along the width direction at a second position in the fitting direction. A distance between the first position and a position of a center of gravity of the connector in the fitting direction is longer than a distance between the second position and the position of the center of gravity in the fitting direction.

To reduce bad connections of a BGA optical module as an optical fiber interface during mounting by reflowing. An optical module includes: a substrate to which an optical fiber is connected and fixed and on which an electronic circuit, an optical circuit or the like is formed; a ball grid array provided on one face of the substrate as an electrical interface used when the optical module is mounted on a mounting substrate; a lid having a thermal conductivity provided on another face of the substrate; and a fiber routing mechanism provided in contact with the lid, the fiber routing mechanism having a thermal conductivity and shaped to enable the optical fiber to be wound around the fiber routing mechanism.

An optical module includes: a substrate and a waveguide element having a mount face opposed to the substrate, the waveguide element having an interference waveguide portion having an optical interference function. Further, the mount face includes a projection region to which the interference waveguide portion is projected on the mount face and a non-projection region, and the waveguide element is joined to the substrate with a joint material in the non-projection region.