An optical transceiver according to an embodiment includes: a housing having inner sides defining an inner space inside the housing; an optical module including a package, a semiconductor device, and a sleeve, the package being configured to house the semiconductor device, the semiconductor device generating a Joule heat, the sleeve being attached to an outside of the package, the sleeve being fixed to the housing with keeping the package away from the inner sides; a heat-conducting material filled between the package and one of the inner sides, the heat-conducting material including an oily component; and a sheet member being placed between the heat-conducting material and the package, the sheet member covering the heat-conducting material to prevent the oily component from reaching the optical module. The Joule heat is conducted from the package to the housing through the sheet member and the heat-conducting material.

A cage assembly includes a cage including a top wall and a bottom wall and an electrical receptacle positioned between the top wall and the bottom wall such that the electrical receptacle floats within the cage in opposite directions between the top wall and the bottom wall.

Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

An optical module includes a circuit board and a light receiving assembly. The light receiving assembly is electrically connected to the circuit board and configured to receive optical signals from outside of the optical module. The light receiving assembly includes a light receiving cavity, an optical amplification assembly and a light receiving chip. The optical amplification assembly is disposed in the light receiving cavity and configured to amplify the optical signals. The optical amplification assembly includes a fourth substrate and a semiconductor optical amplifier (SOA). The fourth substrate is electrically connected to the circuit board, and the SOA is disposed on the fourth substrate and is electrically connected to the fourth substrate, The light receiving chip is disposed in the light receiving cavity and configured to receive the amplified optical signals.

A fluid compatible electro-optical packages and associated systems and devices are shown. For example, a fluid compatible electro-optical package includes integrated circuits with at least one photonic die and optical connections coupled with the integrated circuit. In an example, optical fibers are coupled with the optical connection. In an example fluid compatible electro-optical package, a fluid impermeable port is coupled with the optical connection and the optical fibers couple with the optical connection within the fluid impermeable port.

An optical module includes: a quantum photonic integrated circuit; a temperature controller; and a housing configured to house the photonic integrated circuit and the temperature controller. The photonic integrated circuit is attached to the temperature controller, such that the photonic integrated circuit is in thermal communication with the temperature controller, and the temperature controller is attached directly to the housing, such that the temperature controller is in direct thermal communication with the housing.

A photonic system includes a light source and a photonic structure. The photonic structure includes an optical transmission structure and an optical absorption structure. The optical transmission structure is configured to transmit light associated with a first wavelength range. The optical absorption structure is configured to absorb light associated with a second wavelength range. The light source is configured to provide a light beam with a wavelength that is within the second wavelength range to the optical absorption structure. The optical absorption structure is configured to generate and provide heat to the optical transmission structure when the light beam falls incident on the optical absorption structure.

A fiber connector, comprising a housing having a chamber extending in a lengthwise direction from a first end configured to receive a fiber to a second end configured to connect the fiber to a laser processing head and a channel disposed on an exterior surface of the chamber, the channel comprising a double helical structure.

Systems, methods, and apparatus for a data bus-in-a-box (BiB) are disclosed. The system involves an electrical box, and at least one optical connector located on the box. The system further involves at least one mother board housed inside of the box, and comprising a transmit side comprising at least one transmit optical media converter (OMC) tile, and a receive side comprising at least one receive OMC tile. Also, the system involves first receive optical fibers that are each connected from at least one receive OMC tile to a receive coupler; and a second receive optical fiber connected from the receive coupler to one of the optical connectors. Further, the system involves first transmit optical fibers that are each connected from at least one transmit OMC tile to a transmit coupler; and a second transmit optical fiber connected from the transmit coupler to at least one of the optical connectors.

An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.