An illumination apparatus, which is to be connected to a light source apparatus that generates laser light and which is to be attached to an optical cable that guides the laser light, is provided. The illumination apparatus includes a light-emitting module which is to be attached to a tip portion of the optical cable. The light-emitting module receives the laser light emitted from the optical cable, converts the laser light into light having a different wavelength of a predetermined color, and emits the light. A heat dissipating lens case includes a lens and dissipates heat generated by the light-emitting module. The lens controls distribution of the light emitted by the light-emitting module. The heat dissipating lens case includes an attachment structure which allows the heat dissipating lens case to be removably attached to the light-emitting module.

Disclosed are structures and methods for active optic cable (AOC) assembly having improved thermal characteristics. In one embodiment, an AOC assembly includes a fiber optic cable having a first end attached to a connector with a thermal insert attached to the housing for dissipating heat from the connector. The AOC assembly can dissipate a suitable heat transfer rate from the active components of the connector such as dissipating a heat transfer rate of 0.75 Watts or greater from the connector. In one embodiment, the thermal insert is at least partially disposed under the boot of the connector. In another embodiment, at least one component of the connector has a plurality of fins. Other AOC assemblies may include a connector having a pull tab for dissipating heat from the assembly.

An optical-electrical device can implement a feedback-based control loop for temperature of the device during component calibration. The optical-electrical device can implement compressed air to vary the device temperature during calibration. Additionally, non-active components of the device can be provided current to vary the temperature of the device in concert with the provided compressed air. Additional calibration temperatures can be implemented by activating and deactivating additional non-active components in the device, such as light sources, optical amplifiers, and modulators.

Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. The optical transmitting assembly includes at least two sets of lasers, a transmitting-end optical assembly, and a transmitting-end optical fiber receptacle. The optical receiving assembly includes at least two sets of photoelectric detectors, a receiving-end optical assembly, and a receiving-end optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and the optical receiving assembly to the main circuit board.

A connector is disclosed that includes housing positioned within a cage, the connector having a first port and second port that are vertically spaced apart. A thermal management module is positioned between the two ports. The thermal management module directs thermal energy from one or both ports out a rear wall of the connector. A heat sink can be coupled to the thermal management module to improve thermal dissipation.

Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.

Embodiments include an optical fiber cable comprising a length extending between a first end and a second end, a central cooling tube, a plurality of optical fibers disposed radially around the cooling tube, each optical fiber comprising a fiber core and a cladding disposed around the fiber core, an outer protective cover, and an inner thermal filler disposed between the outer protective cover and the central cooling tube and surrounding each of the optical fibers, wherein each of the central cooling tube, the outer protective cover, the inner thermal filler, and the plurality of optical fibers extend the length of the cable. Various systems and methods for removing imperfections from individual optical fibers and for distributing power across long distances using the optical fiber cable are also provided.