Embodiments described herein may be related to apparatuses, processes, and techniques related to packages that include CPUs and PICs electrically coupled via an interconnect bridge. In embodiments, the PIC are electrically coupled with the EMIB using a fan out RDL to extend reach of the PIC electrical connectors. EICs may be electrically coupled between the PIC and the interconnect bridge. The CPUs may be CPUS, graphical processing units (GPUs), field programmable gate arrays (FPGAs), or other processors. Other embodiments may be described and/or claimed.

A module accommodates multiple superluminescent light emitting diodes, SLEDs, 12r, 12g and 12b. The SLEDs are arranged in an enclosure and output respective light beams to propagate into free space within the enclosure. The individual light beams from the SLED sources are combined into a single beam path within the enclosure using beam combiners 40r-g, 40rg-b. Each beam combiner is realized as a planar optical element, the back side of which is arranged to receive a SLED beam and route it through the optical element to the front side where it is combined with another SLED beam that is incident on and reflected by the front side. The free-space propagating combined beam is output from the module via an optical fiber 42 (or through a window).

An object is to provide an optical transceiver in which two single-core bidirectional optical communication devices are mounted on a single substrate. A first substrate includes an electric connector connected to an optical transmission apparatus, and a signal processing circuit processing electric signals that are input to and output from first and second optical transceiver modules. Components outputting a control signal to the signal processing circuit is mountd on a second substrate. A flexible printed circuit connects the first substrate to the first and second optical transceiver modules.

A connector assembly includes cages arranged as an upper cage and a lower cage in an up-down direction, a receptacle connector, a first liquid cooling tray and a second liquid cooling tray. Each cage includes a frame and a plurality of partitioning walls provided to the frame, and the frame and the plurality of partitioning walls together define a plurality of insertion space arranged transversely. The first liquid cooling tray is provided to a top portion of the upper cage and constitutes an upper wall surface of each of the plurality of insertion space of the upper cage. The second liquid cooling tray is provided between the upper cage and the lower cage, constitutes a lower wall surface of each of the plurality of insertion spaces of the upper cage, and constitutes an upper wall surface of each of the plurality of insertion space of the lower cage. A pressuring spring corresponding to each insertion space of the upper cage is provided on the upper surface of the second liquid cooling tray, and a pressuring spring corresponding to each insertion space of the lower cage is provided on the bottom plate.

An optical transceiver according to an aspect of the present embodiment is an optical transceiver configured to be inserted to and extracted from a cage of an apparatus along a first direction. The optical transceiver includes a device generating heat, and a housing having a rectangular parallelepiped shape with long sides extending along the first direction. The housing includes an internal space housing the device, and an outside part configured to be exposed to an outside of the cage. When the housing is engaged with the cage, the outside part having an air intake part configured to bring an outside air into the internal space for cooling the device.

An optical-electrical device can implement a feedback-based control loop for temperature of the device during component calibration. The optical-electrical device can implement compressed air to vary the device temperature during calibration. Additionally, non-active components of the device can be provided current to vary the temperature of the device in concert with the provided compressed air. Additional calibration temperatures can be implemented by activating and deactivating additional non-active components in the device, such as light sources, optical amplifiers, and modulators.

An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.

Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, where the package substrate comprises a recessed edge. In an embodiment, a compute die is on the package substrate, and an optics die on the package substrate and overhanging the recessed edge of the package substrate. In an embodiment, an integrated heat spreader (IHS) is over the compute die and the optics die. In an embodiment, a lid covers the recess in the package substrate

Embodiments disclosed herein include optical connectors for photonic packages. In an embodiment an optical connector comprises a socket and a ferrule inserted into the socket. In an embodiment, the optical connector further comprises a first row of optical fibers in the ferrule, and a second row of optical fibers in the ferrule over the first row. In an embodiment, the optical connector further comprises a fiber distribution housing where the first row of optical fibers and the second row of optical fibers are spread laterally within the fiber distribution housing.

Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package comprises a package substrate, and a compute die over the package substrate. In an embodiment, a photonics die is also over the package substrate, and the photonics die overhangs an edge of the package substrate. In an embodiment, an integrated heat spreader (IHS) is over the compute die and the photonics die, and a fiber connector is coupled to the photonics die. In an embodiment, the fiber connector is attached to the IHS