Patent classifications
G02B6/4278
FIELD REPLACEABLE MODULAR OPTICAL INTERCONNECT UNIT WITH OPTICAL MODULE FOR DATACENTER SWITCH SYSTEM
Apparatuses, systems, and methods of assembly are described that provide mechanisms for integrating an optical module (e.g., an MBOM) into a main switch system to allow the optical module to be replaced without having to replace other components of the main switch system. The field replaceable modular optical interconnect unit includes a housing, a printed circuit board assembly supported within the housing, an optical module supported on the printed circuit board assembly that converts between optical signals and electrical signals for transmitting or receiving optical signals through a fiber optic cable, a board-to-board connector on a rear panel of the housing that enables electrical signals to be transmitted between the printed circuit board assembly and a main switch system box, and an external connector on a front panel of the housing that can engage an external optical fiber for transmitting optical signals between the optical module and an external component.
OPTICAL MODULE
An optical module includes a circuit board and a light receiving assembly. The light receiving assembly is electrically connected to the circuit board and configured to receive optical signals from outside of the optical module. The light receiving assembly includes a light receiving cavity, an optical amplification assembly and a light receiving chip. The optical amplification assembly is disposed in the light receiving cavity and configured to amplify the optical signals. The optical amplification assembly includes a fourth substrate and a semiconductor optical amplifier (SOA). The fourth substrate is electrically connected to the circuit board, and the SOA is disposed on the fourth substrate and is electrically connected to the fourth substrate, The light receiving chip is disposed in the light receiving cavity and configured to receive the amplified optical signals.
RETAINER FOR MULTI-FIBER PUSH-ON (MPO) CONNECTOR
An optoelectronic module includes a housing enclosing at least one optical transmitter or receiver and includes a release mechanism configured to engage with a cage sized and shaped to receive the housing. A cable connector for a fiber optic cable is configured to engage in a port of the module, and a slideable collar on the cable connector can keep the module engaged in the port. For example, the collar can hold tabs or arms inside the port engaged with slots or indents on a body of the connector to prevent the connector from being pulled from the port. A retainer is configured to prevent retraction of a collar on the cable connector so that the connector is not inadvertently removed from the port. By keeping the connector engaged, the retainer may by extension keep the module engaged in the cage by preventing inadvertent release of the release mechanism on the module.
Line card, optical module, and optical network device
Embodiments of the present invention provide a line card, an optical module, and an optical network device. The optical module includes at least one electrical interface and at least one optical interface. The wavelength division multiplexer/demultiplexer includes a first interface and a second interface. The panel is disposed on an edge of the mainboard. The electrical interface is electrically connected to the mainboard. The optical interface faces a direction that is from the edge of the mainboard to an interior of the mainboard and that is parallel to the mainboard, and the optical interface is connected to the first interface. The wavelength division multiplexer/demultiplexer is disposed on the mainboard, the second interface is configured to connect to a feeder fiber, and the feeder fiber is configured to connect an optical network device at a sending end and an optical network device at a receiving end.
Electrical conductor to optical input conversion system
A system uses optical signals to monitor real world inputs and convert them to electrical signals for conventional indication and control systems. Optical signals see use where electrical signals cannot and improve reliability of existing control systems. Optical loops extend to peripheral devices which process the light into discrete or analog light signals. A receiving circuit interprets that signal and converts it to a useable electrical signal of discrete or analog form. The system operates within a range of light wavelength from at least as low as 399 nm up to at least as high as 1801 nm. The system replaces electrical conductors for input cards of Programmable Logic Controller systems. The optical sensing devices withstand electrical surges and immersion into water, do not generate electrical noise, allow for maintenance without shock hazard, and lack susceptibility to electrical or magnetic phenomenon.
TECHNOLOGIES FOR A PLUGGABLE CONNECTOR FOR PHOTONIC INTEGRATED CIRCUITS
Technologies for optical coupling to photonic integrated circuit (PIC) dies are disclosed. In one illustrative embodiment, a PIC die has one or more waveguides and one or more vertical couplers to reflect light from the waveguides through a surface of the PIC die. An optical connector interface is positioned on the surface of the PIC die with high precision. The optical connector interface includes one or more lenses to collimate light from the one or more waveguides. An optical connector is plugged into the optical connector interface. The optical connector includes one or more lenses to focus the collimated light to one or more optical fibers. As the optical connector is coupling to collimated light, it does not need to be positioned with high precision.
Heat sink for optical module
In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material.
Apparatus and Method of Providing an Interface to an Electrically Powered Instrument
An interface device includes first and second connectors adapted to be joined together in an operating position. One or more first optical data conduits extend through the first connector, with each first optical data conduit terminating at a respective first optical conduit end which is operatively aligned with a respective first optical lens. One or more second optical data conduits extend through the second connector, with each second optical data conduit terminating at a respective second optical conduit end which is operatively aligned with a respective second optical lens. Each respective second optical data conduit and respective second optical lens are aligned for optical coupling across a coupling region with one of the first optical conduits and respective first optical lens when the first connector and second connector are joined in the operating position. The interface also includes a wireless or contact-type electrical power transfer arrangement.
Apparatus and method for hybrid opto-electrical multichip module
The present disclosure relates to a hybrid opto-electrical module apparatus. The apparatus may have a module substrate having a plurality of electrically conductive circuit traces for carrying electrical signals, and at least one waveguide element for carrying optical signals. A waveguide substrate is in optical communication with the waveguide element. A transducer is supported on the waveguide substrate and in electrical communication with the circuit traces. The waveguide substrate has at least one three dimensional (3D) waveguide formed within its interior volume for routing optical signals between the waveguide element and the transducer. A first optical wirebond interfaces the waveguide element to the 3D waveguide, and a second optical wirebond interfaces the 3D waveguide to the transducer.
Communication Module
A communication module includes a metal housing, a module connector provided at a front surface of the housing, and a light guide which guides light that has gone out from a LED lamp provided on a host board of a communication device and entered interior of a cage through a through hole provided in a bottom surface of the cage. The light guide includes a light incoming portion, a light outgoing portion, and a light guiding portion. The light incoming portion is disposed at a bottom surface of the housing opposed to the bottom surface of the cage, the light outgoing portion is disposed at aback surface of the housing opposed to the front surface, and the light guiding portion extends between the light incoming portion and the light outgoing portion along the bottom surface of the housing.