An integrated transceiver module may be configured to convert optical signals received by optical transmission media of the hybrid optical/electrical connector and convert such optical signals into equivalent electrical signals and drive such equivalent electrical signals to electrically-conductive conduits of the electrical connector and convert electrical signals received by electrically-conductive conduits of the electrical connector and convert such electrical signals into equivalent optical signals and drive such equivalent optical signals to the optical transmission media of the hybrid optical/electrical connector, such that the device can communicate with a hybrid optical/electrical port of an information handling system via the cable.

A connector provided on a projector has an RF chip. A plug connected to the connector has an RF chip at a position opposite to the RF chip of the connector. When a protruding section of the plug is inserted and fit into an aperture section of the connector, the RF chip of the plug and the RF chip of the connector perform wireless communication with each other in a non-contact state. Thus, a connecting tool can be easily attached to/detached from a receiving tool without breaking a terminal due to contact such as in a case where a conventional contact type terminal is used.

An interface for transmitting a high-speed signal and an optical module including the same. The interface may include a main substrate and a sub-substrate. The main substrate may have at least one high-speed signal line formed on the upper surface of the main substrate. The sub-substrate may have a first conductive line formed on the lower surface thereof so as to adjust high-speed signal transmission characteristics of the high-speed signal line, wherein the first conductive line may be coupled to the upper surface of the main substrate and partially overlap with the high-speed signal line.

An electronic component containing package includes a substrate including a placement region for placing an electronic component in an upper face thereof; a frame disposed on the upper face of the substrate surrounding the placement region, and including a penetration part opening; and an input/output member disposed in the frame closing the penetration part, including a plurality of wiring conductors which extend inward and outward of the frame and are electrically connected to the electronic component. The input/output member includes via conductors which are connected to the wiring conductors and embedded at sites overlapping with the wiring conductors within a region surrounded by the frame in the input/output member, and a ground layer disposed in a surrounding of lower ends of the via conductors being spaced from the via conductors. Improved high frequency characteristics can be achieved.

An optoelectronic module is provide and includes an electronic unit, an optical unit, and an interconnect structure. The electronic unit is capable of outputting and/or receiving electric signals, while the optical unit is capable of converting the electric signals into optical signals. The interconnect structure connects the electronic unit and the optical unit, and includes an electrically conducting substrate and a pair of transmission leads connecting electronic unit and the optical unit. The pair of transmission leads includes a signal lead and a ground lead having lower impedance than the signal lead.

An optical transmission module includes: a photoelectric conversion element that converts an electrical signal to an optical signal; a photoelectric conversion element-driving IC that drives the photoelectric conversion element; an optical fiber that transmits the optical signal; a guide holding member that holds the optical fiber; a cable that supplies power to at least one of the photoelectric conversion element and the photoelectric conversion element-driving IC; and a substrate on which the photoelectric conversion element and the photoelectric conversion element-driving IC are mounted. The substrate has first and second planes which are perpendicular to each other. The photoelectric conversion element is mounted on the first plane. The optical fiber is connected to a back side of the first plane. An optical axis of the optical fiber is perpendicular to the first plane. The cable is connected to the second plane in parallel with the optical axis of the optical fiber.

A high density opto-electronic interconnection arrangement includes an interposer disposed over the substrate and used to provide a high density electrical connection to a group of electrical ICs flip-chip mounted on the substrate. A set of optical ICs are disposed over and attached to the electrical ICs, where the positioning of the optical IC on the top of the stack eliminates the need to form vias through the thickness of the optical substrate. Thus, a relatively thick optical IC component may be used, providing a stable optical axis and improving alignment and coupling of optical signal paths.

Integration method of a large-scale silicon-based lithium niobate film electro-optic modulator array. By using the method, the difficulty of a fabrication process of a lithium niobate crystal layer is reduced, requirements on precision of bonding lithium niobate and silicon is reduced, and fabrication and bonding of the large-scale array lithium niobate crystal layer can be completed at one time, so that production efficiency of the silicon-based lithium niobate film electro-optic modulator array is greatly improved; through design and optimization of the structure of the silicon crystal layers, light can be naturally alternated and mutually transmitted in silicon waveguides and lithium niobate waveguides, and a high-performance electro-optic modulation effect of the lithium niobate film is achieved.

Methods and systems capable of launching signal-carrying transverse electromagnetic waves onto a transmission line in the higher voltage region of the transmission distribution network. Such methods and systems may include a surface wave launcher located in the higher voltage region, a network unit located in a lower voltage region, and an arrester separating the surface wave launcher and the network unit, the arrester preventing voltage from arcing over from the higher voltage region to the lower voltage region where the arrester provides the signal to the surface wave launcher.

An optical subassembly includes an eyelet including a first through-hole penetrating from a first surface through a second surface; a first lead terminal, which is to be inserted into the first through-hole, and is configured to transmit an electric signal; a dielectric material, which is filled in a space between the first through-hole and the first lead terminal; a device mounting substrate, on which an optical device is to be mounted, and which includes a first conductor pattern configured to transmit the electric signal to the optical device; a metal block having mounted thereon the device mounting substrate; a temperature regulator placed between the metal block and the eyelet; a relay substrate including a second conductor pattern, which is configured to transmit the electric signal to the optical device; a seat, which protrudes from the first surface in a direction extended from the first through-hole, and has a third surface mounting the relay substrate; and a spacer interposed between the third surface and the relay substrate to establish conduction between a rear surface of the relay substrate and the seat.