A Printed Circuit Board (PCB) and methods for manufacturing the PCB board are provided. The PCB includes a Radio Frequency (RF) signal transition at a RF signal pad. Multiple conductive layers other than a conductive signal layer of the PCB and conductive portions of the conductive signal layer not in electrical contact with a RF signal transmission trace have common ground connections forming a ground cage structure within the PCB around the RF signal pad and RF the signal transmission trace.

A coupling module can be used to communicate high speed signals between an optical transceiver and a processing module of an optical communication device, such as an optical line termination (OLT) or an optical network unit (ONU). The coupling module can adjust the common mode voltage level of a differential signal output by the optical transceiver to the common mode voltage level required by the processing module. In addition, the coupling module splits each of the differential output signals from the optical transceiver and passes the split signals to both a high-pass filter and a low-pass filter that are connected in parallel. An adapter module can be connected to the coupling module such that the coupling module can receive different differential signals from different optical transceivers.

A first semiconductor element (laser diode) and a second semiconductor element (laser diode) are connected to each other in series between a wiring electrically connected to an anode of the first semiconductor element and a wiring electrically connected to a cathode of the second semiconductor element. In this case, each of the first semiconductor element and the second semiconductor element includes a laminated pattern having an emission layer and a plurality of semiconductor layers covering this laminated pattern.

Provided is an optical subassembly, which is compact, is easy to manufacture, and has satisfactory high-frequency characteristics. The optical subassembly includes: an eyelet including a first surface, a second surface and a plurality of through-holes; a plurality of lead terminals; a relay substrate including a lead connection surface and a first bonding surface and having first and second conductor patterns formed across the lead connection surface and the first bonding surface; a device mounting unit including a second bonding surface having formed thereon third and fourth conductor patterns; and an optical device configured to convert one of an optical signal and the differential electrical signals into the other. The first and second conductor patterns on the first bonding surface are connected to the third and fourth conductor patterns by bonding wires, respectively, and the first and second bonding surfaces have normal directions in the same direction.

The present application relates to EIC-INTEGRATED PICs. More particularly, various embodiments relate to EIC-INTEGRATED PICs enabling effective thermal management temperature control and heat removal.

The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic modules. The IC die may be an application specific integrated circuit (ASIC) die and the one or more photonic modules may include a photonic integrated circuit (PIC) and fiber array. The one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.

An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

The present invention relates to the technical field of optical communication, and provides a light emitting assembly comprising: an LD chip component, an optical wavelength division multiplexer, a first package housing and a second package housing; the first package housing is fixedly connected with the second package housing to form a first chamber for packaging the LD chip component and a second chamber for packaging the optical wavelength division multiplexer, the first chamber is located inside the first package housing, and the second chamber is located inside the second package housing. The present invention also provides an optical module comprising: a housing, a light receiving assembly and the light emitting assembly mentioned above, wherein the light receiving assembly and the light emitting assembly are both disposed on the housing. The present invention adopts a two-section structure, so that the LD chip component and the optical wavelength division multiplexer are independently separated, and the optical signal processing is carried out in two steps, which not only improves the yield, but also facilitates the implementation of the mounting process. By adopting the optical fiber adapter set, the assembly tolerance can be effectively compensated by utilizing the flexibility of the optical fiber, the stress is eliminated, and the problem of light loss of the assembly stress is avoided.

There is provided a highly convenient package for an optical module in which a device can be mounted as it is even when the number and mounting position thereof are different according to the device to be mounted. The package includes a base plate having a top surface on which devices are assembled, an optical fiber mounting component mounted on the top surface of the base plate, a direct current electrical interface component and a high frequency electrical interface component mounted on the top surface of the base plate. The optical fiber mounting component and the electrical interface components are separately manufactured, separately assembled on the top surface of the base plate, and fixed in different modes. The optical fiber mounting component is fixed by fastening with screws and fixed by soldering, and the electrical interface components are fixed by fastening with the screw.

Provided is a printed circuit board realizing selective inhibition of electromagnetic noise and enabling high-density arrangement of differential transmission lines without increasing cost. The printed circuit board includes a pair of strip conductors (first layer), a first resonance conductor plate, a ground conductive layer (together with a second layer) including an opening portion, a second resonance conductor plate (third layer), a third resonance conductor plate (fourth layer), first via holes connecting the first and second resonance conductor plates, a second via hole connecting the second and third resonance conductor plates, and third via holes connecting the third resonance conductor plate and the ground conductive layer, wherein a polygon obtained by sequentially connecting centers of the adjacent third via holes overlaps so as to include the first resonance conductor plate, and center-to-center distance between the adjacent third via holes is 0.5 wavelength or less at frequency corresponding to the bit rate.